Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
LBGA480: LBGA480, plastic, low profile ball grid array; 480 balls; 1.27 mm pitch; 37.5 mm x 37.5 mm x 1.05 mm body
Buy Options
MPC8250ACVVMHBC
End of Life
12NC: 935322712557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
External Memory Supported | EPROM, SDRAM, SRAM |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MPC8250ACVVMHBC(935322712557) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | e1 | REACH SVHC | 10060.85 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Free Soldering | Lead Free Soldering | Lead Free Soldering | |||||
MPC8250ACVVMHBC (935322712557) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) | Footprint | Capture Symbol |
|---|---|---|---|---|
MPC8250ACVVMHBC (935322712557) | 854231 | 3A991A2 | PDF | Cadence Allegro(dra) | PDF | Orcad Capture 16.3(olb) |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MPC8250ACVVMHBC (935322712557) | 2025-04-16 | 2025-05-26 | 202504007I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
MPC8250ACVVMHBC (935322712557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
MPC8250ACVVMHBC (935322712557) | 2018-08-24 | 2018-11-21 | 201803021F01 | MPC8245 and MPC8250/8255/8260/8265 TBGA Product Family Conversion to Center Gate Mold Process |
MPC8250ACVVMHBC (935322712557) | 2017-12-20 | 2018-01-03 | 201710023I | New PQ Label Input for Non-MPQ Shipments |
More about MPC8250
The PowerQUICC® II™ integrated communications processor family delivers excellent integration of processing power for networking and communications peripherals, providing customers with an innovative, total system solution for building high-end communications systems. NXP® Semiconductors's PowerQUICC II processor family is the next generation of the leading PowerQUICC™ line of integrated communications processors, providing higher performance in all areas of device operation, including greater flexibility, extended capabilities, and higher integration.
Our leading PowerQUICC architecture integrates two processing blocks. One block is a high-performance embedded G2 core and the second block is the Communications Processor Module (CPM). The CPM of the MPC8255 processor can support up to two fast serial communications controllers (FCCs), one multichannel controller (MCC), four serial communications controllers (SCCs), two serial management controllers (SMCs), one serial peripheral interface (SPI) and one I²C interface. The combination of the G2 core and the CPM, along with the versatility and performance of the PowerQUICC II processor family, provides customers with enormous potential in developing networking and communications products while significantly reducing time-to-market development stages.