Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Buy Options
MC8610VT800GB
End of Life
12NC: 935321324557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | REV 1.1, 8610, 1.0V,105C |
| Parameter | Value |
|---|---|
Number of pins | 783 |
Package Style | BGA |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | 2nd Level Interconnect | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|---|
MC8610VT800GB(935321324557) | No | Yes Certificate Of Analysis (CoA) | Yes |  | e2 | REACH SVHC | 3453.1 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | |||
MC8610VT800GB (935321324557) | No | 3 | 245 | 245 | 30 | 30 | |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
MC8610VT800GB (935321324557) | 854231 | 3A991A1 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
MC8610VT800GB (935321324557) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about MPC8610
The MPC8610 processor is engineered to deliver breakthrough performance, connectivity and integration for embedded applications that process or display graphical images, such as kiosks, robotics, in-vehicle infotainment, cockpit displays, single-board computers and multi-function printers and scanners.
The MPC8610’s strength is its integration—the high-performance e600 core built on Power Architecture® technology—combined with the PowerQUICC® system-on-chip (SoC) platform and an LCD controller. With e600 core performance and integrated northbridge and southbridge functionality, the single chip replaces what could take up to four chips using other solutions. Moving all core-to-peripheral connections inside the device greatly reduces the number of high-speed parallel busses to be routed on the circuit board. This translates into smaller boards with fewer layers and higher processing density.