MC8610TPX800GB Product Information|NXP

Buy Options

Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
REV 1.1, 8610, 1.0V,-40C/105C
ParameterValue
Number of pins
783
Package Style
BGA

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC8610TPX800GB(935310018557)
No
No
Yes
N
e0
REACH SVHC
3803.3

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MC8610TPX800GB
(935310018557)
No
3
245
245
30
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC8610TPX800GB
(935310018557)
854231
3A991A1

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC8610TPX800GB
(935310018557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about MPC8610

The MPC8610 processor is engineered to deliver breakthrough performance, connectivity and integration for embedded applications that process or display graphical images, such as kiosks, robotics, in-vehicle infotainment, cockpit displays, single-board computers and multi-function printers and scanners.

The MPC8610’s strength is its integration—the high-performance e600 core built on Power Architecture® technology—combined with the PowerQUICC® system-on-chip (SoC) platform and an LCD controller. With e600 core performance and integrated northbridge and southbridge functionality, the single chip replaces what could take up to four chips using other solutions. Moving all core-to-peripheral connections inside the device greatly reduces the number of high-speed parallel busses to be routed on the circuit board. This translates into smaller boards with fewer layers and higher processing density.