Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
HLFLGA21: HLFLGA21, thermal enhanced low profile fine-pitch land grid array package, 21 terminals, 0.9 mm pitch, 6.2 mm x 6.2 mm x 1.148 mm body
Buy Options
AFRX5G272T4
End of Life
12NC: 935400237528
Details
Order
Operating Features
| Parameter | Value |
|---|---|
fi(RF) [max] (MHz) | 2690 |
Number of pins | 21 |
Package Style | HLLGA |
@f [max] (MHz) | 2500 |
NF (dB) | 1.2 |
@f [min] (MHz) | 2500 |
NF (dB) | 1.2 |
@f [max] (MHz) | 2500 |
Supply Voltage (Typ) (V) | 5 |
Die Technology | GaAs pHEMT |
Security Status | COMPANY PUBLIC |
Frequency (Min-Max) (MHz) | 2300, 2690 |
Frequency Band (Hz) | 2300000000, 2690000000 |
Description | Airfast RX Module, 2300-2690 MHz, 33 dB, 1.2 dB NF |
Noise Figure (Typ) (dB) | 1.2 |
fi(RF) [min] (MHz) | 2300 |
Input 3rd Order Intercept (dBm) | 0 |
Frequency (Max) (MHz) | 2690 |
Frequency (Min) (MHz) | 2300 |
| Parameter | Value |
|---|---|
Frequency (Min-Max) (GHz) | 2.3 to 2.69 |
Power Gain (dB) @ f (MHz) | 33 @ 2500 |
frange [max] (MHz) | 2690 |
frange [min] (MHz) | 2300 |
NF (dB) | 1.2 |
IP3i (dBm) | 0.0 |
NF @Gp= 5 dB (dB) | 1.2 |
Gain (Typ) (dB) @ f (MHz) | 33 @ 2500 |
NF [typ] (dB) | 1.2 |
IP3o (dBm) [Typ] | 0 |
Gass (dB) | 33 |
Noise Figure (Typ) (dB) @ f (MHz) | 1.2 @ 2500 |
Gconv [typ] (dB) | 33 |
3rd Order Intercept (Typ) (dBm) | 0 |
Gp (dB) | 33 |
Gp (dB) | 33 |
NXP_Gp [typ] (dB) | 33 |
@f | 2.5 |
Input 3rd Order Intercept (dBm) | 0 |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
AFRX5G272T4(935400237528) | No | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 164.3438 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | Maximum Time at Peak Temperatures (s) | |||
|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Soldering | Lead Soldering | |||||
AFRX5G272T4 (935400237528) | No | 3 | 260 | 40 | |||
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
AFRX5G272T4 (935400237528) | 854233 |
Product Change Notice
| Part/12NC | Issue Date | Effective Date | PCN | Title |
|---|---|---|---|---|
AFRX5G272T4 (935400237528) | 2025-04-16 | 2025-05-26 | 202504006I | Freescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products |
AFRX5G272T4 (935400237528) | 2020-12-15 | 2020-12-16 | 202011011I | NXP Will Add a Sealed Date to the Product Label |
More about AFRX5G272
The AFRX5G272 is an integrated multi-chip module designed for TD-LTE and 5G mMIMO applications. It consists of a T/R switch, a two-stage low noise amplifier and support circuitry to work from a 5 V supply and a 1.8 V logic-level T/R control.
The device has Tx and Rx modes, which are controlled via T/R logic signaling. In Tx mode, internal RF switches direct the signal from the antenna port to an external termination resistor. In Rx mode, internal RF switches direct the signal from the antenna port to internal LNAs. While in Tx mode, the LNA is in idle mode with minimized current consumption.