NXH2261UK: NFMI radio solution | NXP Semiconductors

NFMI Radio for Wireless Audio and Data Streaming

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Product Details

Features

Controller subsystem

  • Customer programmable Arm Cortex-M0 ultra-low power for system configuration and control
  • I²C-bus/SPI follower control interface
  • Flexible interfaces: UART, GPIO, SWD, SPI leader, I²C-bus controller
  • Embedded low power 512 kbit EEPROM

Magnetic induction transceiver

  • 596 kbit/s raw throughput
  • Carrier frequency of 10.579 MHz
  • On-chip tuning of coil resonator tank
  • Programmable transmit power
  • Integrated AGC
  • Operation from internal oscillator
  • Optimized protocol for low latency ear-to-ear communication
  • Embedded network protocol for up to 15 devices

Audio data path

  • I2S-bus audio interface
  • Support for multiple audio sample frequencies up to 48 kHz
  • Integrated MAC accelerator for MI radio
  • Integrated audio G.722 and ADPCM codecs for up to four audio channels
  • Integrated latency controller for two RX channels
  • Integrated adaptive sample rate converter for two RX channels
  • Integrated CoolFlux DSP with SBC codec

Power management subsystem

  • Integrated battery management supporting ZnAir or NiMH batteries
  • Integrated supply booster for transparent EEPROM operation

Power consumption

  • Supports multiple low-power modes:
    • Power-down: 5 μA
    • Deep-sleep: 8 μA
    • Sleep: 60 μA
    • Carrier detect: 100 μA
    • Mono audio streaming - receive: 1000 μA (fs = 20 kHz, G.722)
    • Mono audio streaming - transmit: 1050 μA (fs = 20 kHz, G.722)
    • Binaural audio streaming: 1300 μA (fs = 20 kHz, G.722)
    • Mono audio streaming - receive: 2400 μA (fs = 44.1 kHz, SBC)
    • Mono audio streaming - transmit: 2000 μA (fs = 44.1 kHz, SBC)
  • Support for flexible slot allocation of the radio enabling better power tuning over the different use cases
  • Integrated ultra-low-power oscillator and timer used in low-power modes

Package

  • WLCSP48 with dimensions of 2.79 mm × 3.72 mm (10.38 mm2)
  • Flexible I/O switch matrix with 19 pins
  • Configurable supply level for I/O
  • 48 bumps with a minimum pitch of 400 μm
  • Backside coating

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N true 0 PSPNXH2261UKen 3 Fact Sheet Fact Sheet t523 1 Package Information Package Information t790 1 Packing Information Packing Information t935 1 en_US en_US en Fact Sheet Fact Sheet 1 1 2 English Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. 1565293859646702436251 PSP 158.9 KB None None documents None 1565293859646702436251 /docs/en/fact-sheet/MIGLOFS.pdf 158883 /docs/en/fact-sheet/MIGLOFS.pdf MIGLOFS documents N N 2019-08-08 MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf /docs/en/fact-sheet/MIGLOFS.pdf Fact Sheet N 736675474163315314 2023-06-18 pdf N en Oct 13, 2021 736675474163315314 Fact Sheet Y N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming Package Information Package Information 1 2 1.0 English 1476247164101717932787 PSP 528.0 KB None None documents None 1476247164101717932787 /docs/en/package-information/SOT1887-1.pdf 528000 /docs/en/package-information/SOT1887-1.pdf SOT1887-1 documents N N 2016-10-11 wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) /docs/en/package-information/SOT1887-1.pdf /docs/en/package-information/SOT1887-1.pdf Package Information N 302435339416912908 Y 2022-12-07 PDF en Oct 7, 2016 302435339416912908 Package Information 528.0 KB N /docs/en/package-information/SOT1887-1.pdf wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) Packing Information Packing Information 1 3 kb 1.0 English 1480488030238705828231 PSP 201.0 KB None None documents None 1480488030238705828231 /docs/en/packing/SOT1887-1_012.pdf 201000 /docs/en/packing/SOT1887-1_012.pdf SOT1887-1_012 documents N N 2016-11-29 WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 /docs/en/packing/SOT1887-1_012.pdf /docs/en/packing/SOT1887-1_012.pdf Packing Information N 145666923842250347 Y 2022-12-07 PDF en Nov 29, 2016 145666923842250347 Packing Information 201.0 MB N /docs/en/packing/SOT1887-1_012.pdf WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 PDF false 0 NXH2261UK downloads en true 1 Y PSP Y Y Fact Sheet 1 /docs/en/fact-sheet/MIGLOFS.pdf 2019-08-08 1565293859646702436251 PSP 1 Oct 13, 2021 Fact Sheet Learn about the many features and benefits of NXP’s ultra-low power, single chip, Near Field Magnetic Induction (NFMI) enabled solutions for high quality wireless audio and data communication. None /docs/en/fact-sheet/MIGLOFS.pdf English documents 158883 None 736675474163315314 2023-06-18 N /docs/en/fact-sheet/MIGLOFS.pdf MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming /docs/en/fact-sheet/MIGLOFS.pdf documents 736675474163315314 Fact Sheet N en None Y pdf 2 N N MiGLO™ NFMI radios for wireless, ultra-low power audio and data streaming 158.9 KB MIGLOFS N 1565293859646702436251 Package Information 1 /docs/en/package-information/SOT1887-1.pdf 2016-10-11 1476247164101717932787 PSP 2 Oct 7, 2016 Package Information None /docs/en/package-information/SOT1887-1.pdf English documents 528000 None 302435339416912908 2022-12-07 /docs/en/package-information/SOT1887-1.pdf wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) /docs/en/package-information/SOT1887-1.pdf documents 302435339416912908 Package Information N en None N PDF 1.0 N wafer level chip-scale package; 48 bumps; 3.72 mm x 2.79 mm x 0.525 mm(Backside coating included) Y 528.0 KB 528.0 KB SOT1887-1 N /docs/en/package-information/SOT1887-1.pdf 1476247164101717932787 Packing Information 1 /docs/en/packing/SOT1887-1_012.pdf 2016-11-29 1480488030238705828231 PSP 3 Nov 29, 2016 Packing Information PDF None /docs/en/packing/SOT1887-1_012.pdf English documents 201000 kb None 145666923842250347 2022-12-07 /docs/en/packing/SOT1887-1_012.pdf WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 /docs/en/packing/SOT1887-1_012.pdf documents 145666923842250347 Packing Information N en None N PDF 1.0 N WLCSP48; Reel dry pack, SMD, 7" Q1/T1 standard product orientation Orderable part number ending ,012 or Z Ordering code (12NC) ending 012 Y 201.0 KB 201.0 MB SOT1887-1_012 N /docs/en/packing/SOT1887-1_012.pdf 1480488030238705828231 true Y Products

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