Design Files
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5 GHz-7 GHz Wi-Fi® 6E, Wi-Fi 7 Front-End IC
For additional information contact support, your local sales representative or an NXP Authorized Distributor.
The WLAN7201CC is a single monolithic, RF front-end IC available as a flip chip die with copper pillar bumps.
The WLAN7201CC is designed for Wi-Fi 6E and Wi-Fi 7 applications. It includes a power amplifier with directional coupler, a low noise receive amplifier (LNA) and a single pole double throw (SPDT) switch. The WLAN7201CC includes coexistence filters for both transmit and receive channels.
The device is matched to 50 Ω and integrates harmonic and out of band filtering which minimizes the layout area in the application.
Note: To prevent reliability issues of Cu-pillar products. It is mandatory to select a molded underfill material (MUF) with less than 20 ppm chlorides as per the material supplier specifications.
Product Details
Features
- Fully integrated Wi-Fi 6E and Wi-Fi 7 RF front-end IC with high linearity and low-power modes
- 5G EVMdyn = -44 dB, 802.11ax/11be, Po = 14.5 dBm
- 6G EVMdyn = -44 dB, 802.11ax, Po = 14.5 dBm
- 6G EVMdyn = -46 dB, 802.11be, Po = 14.5 dBm
- Full band 5.150 GHz to 7.125 GHz
- High power efficiency
- Integrated RF decoupling capacitors for all VCC and control pins
- Requires no external matching components, DC free RF ports except for the antenna port (on-chip ESD coil)
- 5 TX operation modes per band, enabling flexibility for power efficiency adaptation
- 2 RX operation modes enabling gain step between LNA mode and bypass mode
- IO levels supporting 1.2 V and 1.8 V logic interface
- ESD protection on all pins
- Human Body Model (HBM) according to ANSI/ESDA/JEDEC standard JS-001 exceeds 2 kV
- Charged Device Model (CDM) according to ANSI/ESDA/JEDEC standard JS-002 exceeds 500 V
Part numbers include: WLAN7201CC.
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