Design Files
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MIFARE Classic® EV1 1K - 4K
This product is not recommended for new designs. Instead, we recommend to use our MIFARE® DESFire® Light IC.
NXP® has developed the MIFARE® MF1ICS50 to be used in a contactless smart card according to ISO/IEC 14443 Type-A.
The MIFARE MF1ICS50 IC is used in applications like public transport ticketing where major cities have adopted MIFARE as their e-ticketing solution of choice.
An intelligent anti-collision function allows operating more than one card in the field simultaneously. The anti-collision algorithm selects each card individually and ensures that the execution of a transaction with a selected card is performed correctly without data corruption resulting from other cards in the field.
The MF1ICS50 is designed for simple integration and user convenience. Which could allow complete ticketing transactions to be handled in less than 100 ms. Thus, the MF1ICS50 card user is not forced to stop at the reader leading to high throughput at gates and reduced boarding times onto buses. The MIFARE product-based card may also remain in the wallet during the transaction, even if there are coins in it.
Product Details
Features
MIFARE, RF Interface (ISO/IEC 14443 A)
- Contactless transmission of data and supply energy (no battery needed)
- Operating distance: Up to 100mm (depending on antenna geometry)
- Operating frequency: 13.56 MHz
- Data transfer: 106 kbit/s
- Data integrity: 16-Bit CRC, parity, bit coding, bit counting
- Anti-collision
- Typical ticketing transaction: < 100 ms (including backup management)
EEPROM
- 1 kB - 4 kB, organized in 16 sectors with 4 blocks of 16 bytes each (one block consists of 16 bytes)
- User-definable access conditions for each memory block
- Data retention of 10 years
- Write endurance 100.000 - 200.000 cycles
Security
- Mutual three-pass authentication (ISO/IEC DIS 9798-2)
- An individual set of two keys per sector (per application) to support multiapplication with key hierarchy
- A unique serial number for each device
Delivery options
- Die on wafer
- Bumped die on wafer
- MOA4 or MOA2 contactless card module
Part numbers include: MF1S5000XDA4, MF1S5000XDA8, MF1S5001XDUD, MF1S5001XDUD2, MF1S5001XDUF, MF1S5030XDA4, MF1S5030XDA8, MF1S5031XDUD, MF1S5031XDUD2, MF1S5031XDUF, MF1S7000XDA4, MF1S7000XDA8, MF1S7001XDUD, MF1S7001XDUD2, MF1S7001XDUF, MF1S7030XDA4, MF1S7030XDA8, MF1S7031XDUD, MF1S7031XDUD2, MF1S7031XDUF.
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Documentation
Quick reference to our documentation types.
1-5 of 13 documents
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Application Note
MIFARE Application Directory (MAD)
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Application Note
MIFARE type identification procedure
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Application Note
MIFARE ISO/IEC 14443 PICC selection
Design Resources
Engineering Services
To get further assistance directly from NXP, please see our Engineering Services.
1-5 of 17 engineering services
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Independent Design House (IDH)
Hardware Design Services
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Independent Design House (IDH)
Engineering Services and Consulting
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Independent Design House (IDH)
Electric Vehicle Charger Development
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Independent Design House (IDH)
Accredited Testing Laboratory
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Independent Design House (IDH)
Embedded System Design Services
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Training
2 trainings