Ultra-Low Power Hearing Aid SoC Solution over Bluetooth® LE Audio

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Block Diagram

NXH2004

NXH2004 Block Diagram

Features

Application Processors

  • Dual-Core Cortex™ M0+

Ecosystem Application Support

  • ASHA for Android devices and MFi for Apple devices

Flash Memory

  • Embedded Flash

Audio Processors

  • Dual Core CoolFlux® DSP

Bluetooth

  • Bluetooth 5.3 LE Audio certified and enables Auracast

Power Management

  • Runs on Zn-Air and Li-ion battery

Audio

  • Supports LC3 and G.722

Voice

  • Support for dual digital microphones

General

  • Radio PHY conforms to Bluetooth Low Energy 5.3 Bluetooth specification
  • Supports ASHA and MFI
  • WLCSP package 9.1 mm2 with 48 bumps
  • Supports HAP (Hearing Aid Profile) and TMAP (Telephony and Media Audio Profile)
  • Pb-free and compliant with RoHS directive 2011/65/EU (RoHS 2)
  • Low number of external passive components
  • Operating temperature −20 °C to 85 °C for regulated supply and -0 °C to 60 °C for battery supply node

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Design Files

Hardware

Quick reference to our board types.

1 hardware offering

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