201908032F01 : FXLS6xxxx Product Family Sensitivity Test Replacement at -40C and 105C
NXP Semiconductor is announcing the sensitivity shake replacement at the final test cold (-40C) and hot (105C) test insertions for the FXLS6xxxx Product Family. This sensitivity shake will be replaced with a correlated sensitivity algorithm. Shaking for sensitivity at the final test trim insertion will remain in place and unchanged.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Test equipment, Test process | 07-Sep-2019 | 05-Dec-2019 |
Reason of Change
To ensure quality and supply assurance.
Identification of Affected Products
Product identification does not change
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
FXLS60120AESR2 (935360715528) |
- | - | - |
|
FXLS60220AESR2 (935360716528) |
- | - | - |
|
FXLS60230AESR2 (935350379528) |
- | - | - |