201808025F01 : IMPROVED PASSIVE COMPONENT ATTACH MATERIAL FOR TO270WB PACKAGES
NXP announces a change from silver filled epoxy to a sintered silver die attach for passive components in TO270WB packages. Sintered silver is a widely accepted die attach material for power devices with superior thermal and electrical properties and significantly increases the adhesion strength of the bond between passive component and heatsink. Datasheet Functional Table RF performance specifications remains unchanged. If you have any questions or require additional information please contact your local NXP sales office or NXP approved distributor.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 22-Feb-2019 | 22-May-2019 |
Reason of Change
Die attach material standardization and improved die attach bond strength.
Identification of Affected Products
Device marking will not change.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
A2I20D020GNR1 (935313109528) |
- | - | - |
|
A2I20D020NR1 (935313237528) |
- | - | - |
|
A2I20D040GNR1 (935316286528) |
- | - | - |
|
A2I20D040NR1 (935316291528) |
- | - | - |
|
A2I22D050NR1 (935312142528) |
- | - | - |
|
A2I25D025GNR1 (935323756528) |
- | - | - |
|
A2I25D025NR1 (935315964528) |
- | - | - |
|
A2I25H060GNR1 (935316196528) |
- | - | - |
|
A2I25H060NR1 (935322312528) |
- | - | - |
|
A2I35H060NR1 (935322497528) |
- | - | - |
|
A2T09VD250NR1 (935320819528) |
- | - | - |
|
A2T09VD300NR1 (935316219528) |
- | - | - |
|
AFIC31025GNR1 (935343961528) |
- | - | - |
|
AFIC31025NR1 (935343962528) |
- | - | - |