201710001F01 : LPC31xxFET180 LPC32xxFET296 Cu Wire Qualification for NXP-ATKH
Copper wire has been qualified and will be added as a wirebond material. To support a robust wirebond process the mold compound has also changed. Upon expiration of this notice NXP will begin shipping product with copper wire.See attached Self Qualification Report (SQR) for details of the affected part numbers material changes and qualification test results.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly materials | 10-Jan-2018 | 22-Apr-2018 |
Reason of Change
Adding Copper wire is required to mitigate against raw material cost increases and for supply assurance.The die attach material and mold compound change enable a robust Cu wirebond process.
Identification of Affected Products
Top side marking Product revision is incremented. See marking details in attached SQR document.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
Wire composition lead frame finish and mold compound are the only change to form. No Impact to fit or function. Reliability is equivalent or improved.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
LPC3220FET296/01,5 (935290763551) |
- | - | - |
|
LPC3240FET296/01,5 (935290765551) |
- | - | - |
|
LPC3250FET296/01,5 (935290766551) |
- | - | - |