MC8640HJ1250HE Product Information|NXP

Features


32-Bit Power Architecture SoC, 2 X 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3

Package


CFBGA994: CFBGA994, ceramic, fine-pitch ball grid array; 994 balls; 1 mm pitch; 33 mm x 33 mm x 2.97 mm body

Buy Options

MC8640HJ1250HE

End of Life

12NC: 935343659557

Details

Order

Operating Features

ParameterValue
Security Status
COMPANY PUBLIC
Description
32-Bit Power Architecture SoC, 2 X 1250MHz, DDR1/2, AltiVec, GbE, PCI-e, SRIO, 0 to 105C, Rev 3
ParameterValue
Number of pins
994
Package Style
CFBGA

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF Indicator2nd Level InterconnectREACH SVHCWeight (mg)
MC8640HJ1250HE(935343659557)
No
No
Yes
N
e0
REACH SVHC
5854.2

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead SolderingLead SolderingLead Free SolderingLead SolderingLead Free Soldering
MC8640HJ1250HE
(935343659557)
No
3
245
245
30
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC8640HJ1250HE
(935343659557)
854231
3A991A1

Discontinued and Replacement Part Data

Part/12NCDiscontinuance NoticeLast Time Buy DateLast Time Delivery DateReplacement
MC8640HJ1250HE
(935343659557)
NOTICE
2021-09-09
2022-09-09
-

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC8640HJ1250HE
(935343659557)
2021-03-042021-03-05202102034DNDiscontinuance of P1010P1020 P1022 P2020P3041 P4080 P5040 C290 MSC8156 BSC9131837x 8548 8572 8536 8544 Families
MC8640HJ1250HE
(935343659557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label

More about MPC8640

NXP’s MPC8640D dual-core processor is engineered to deliver breakthrough performance, connectivity and integration for embedded networking, telecom, aerospace and defense, storage, industrial and pervasive computing applications.

The MPC8640D’s strength is its integration of the high-performance e600 core built on Power Architecture® technology and combined with the PowerQUICC® system-on-chip (SoC) platform. With dual-core performance and integrated northbridge and southbridge functionality, this single chip replaces what could take up to four chips using other solutions. This translates into smaller boards or higher processing density. Additionally, all core-to-peripheral connections are internal in an integrated device, so the board designer is not exposed to the difficulties of laying out high-speed parallel buses.