MC13212 Product Information|NXP

Features


SIP 802.15.4 2.4GHZ 32KB

Package


HVLGA71: HVLGA71, plastic, thermal enhanced, very thin, low profile land grid array package; 71 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.9 mm body

Buy Options

MC13212R2

End of Life

12NC: 935313421518

Details

Order

Operating Features

No information available

Environmental

Part/12NCPbFreeEU RoHSHalogen FreeRHF IndicatorREACH SVHCWeight (mg)
MC13212(935313421557)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9
MC13212R2(935313421518)
Yes
Yes
Certificate Of Analysis (CoA)
Yes
DREACH SVHC
159.9

Quality

Part/12NCSafe Assure Functional SafetyMoisture Sensitivity Level (MSL)Peak Package Body Temperature (PPT) (C°)Maximum Time at Peak Temperatures (s)
Lead Free SolderingLead Free SolderingLead Free Soldering
MC13212
(935313421557)
No
3
250
30
MC13212R2
(935313421518)
No
3
250
30

Shipping

Part/12NCHarmonized Tariff (US)DisclaimerExport Control Classification Number (US)
MC13212
(935313421557)
854231
3A991A2
MC13212R2
(935313421518)
854231
3A991A2

Product Change Notice

Part/12NCIssue DateEffective DatePCNTitle
MC13212
(935313421557)
2025-04-162025-05-26202504006IFreescale Logo to NXP Logo Product Marking Conversion for All Remaining Former Freescale Products
MC13212R2
(935313421518)
MC13212
(935313421557)
2020-12-152020-12-16202011011INXP Will Add a Sealed Date to the Product Label
MC13212R2
(935313421518)
MC13212
(935313421557)
2017-12-202018-01-03201710023INew PQ Label Input for Non-MPQ Shipments

More about MC13212

Archived content is no longer updated and is made available for historical reference only.

Please note that this product is not recommended for new designs.

The MC13212 System in Package (SiP) integrates the MC9S08GT MCU with the MC1320x transceiver into a single 9x9mm LGA package.  The MC13212 provides 32 K Flash memory and 2 K of RAM, providing an ideal platform for  applications that require a star network using the NXP® SMAC or IEEE 802015.4 Compliant PHY/MAC.