Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
- No Longer Manufactured
- LH7A404N0F092B3
Buy Options
LH7A404N0F092B3,55
No Longer Manufactured
12NC: 935285071551
Details
Order
LH7A404N0F092B3;55
No Longer Manufactured
12NC: 935285071557
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Operating Frequency [Max] (MHz) | 266 |
RAM (kB) | 80 |
GPIO | 64 |
USB Controllers | 3 |
LCD | 1 |
UART | 3 |
SPI | 1 |
| Parameter | Value |
|---|---|
ADC (Channels) | 9 |
ADC (bits) | 10 |
Timers | 3 |
Timer (bits) | 16 |
RTC | 1 |
PWM | 2 |
Temperature range | -40 °C to +85 °C |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
LH7A404N0F092B3,55(935285071551) | Yes | Yes | No |  | REACH SVHC | 1028.16270112 |
LH7A404N0F092B3;55(935285071557) | Yes | Yes | No | | REACH SVHC | 1028.16270112 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | FIT | MTBF | IR | ||
|---|---|---|---|---|---|---|---|---|
| Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | |||||
LH7A404N0F092B3,55 (935285071551) | No | 3 | 3 | 225 | 260 | 2.84 | 2.58397932816537E8 | 0.0 |
LH7A404N0F092B3;55 (935285071557) | No | 3 | 3 | 225 | 260 | 2.84 | 2.58397932816537E8 | 0.0 |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
LH7A404N0F092B3,55 (935285071551) | 854231 |
LH7A404N0F092B3;55 (935285071557) | 854231 |
Discontinued and Replacement Part Data
| Part/12NC | Discontinuance Notice | Last Time Buy Date | Last Time Delivery Date | Replacement |
|---|---|---|---|---|
LH7A404N0F092B3,55 (935285071551) | - | - | - | LH7A404N0F092B3;55 (935285071557) |
LH7A404N0F092B3;55 (935285071557) | - | 2015-06-30 | 2015-09-30 | - |
More about LH7A404N0F092B3
Archived content is no longer updated and is made available for historical reference only.
The advent of 3G technology opens up a wide range of multimedia applications in mobile information appliances. The LH7A404 is designed from the ground up with a 32‑bit Arm922T™ Core to provide high processing performance, low power consumption, and a high level of integration. Features include 80 kB on-chip SRAM, fully static design, power management unit, low voltage (1.8 V Core, 3.3 V I/O) and on-chip PLL.
NOTE:
Devices containing lead-free solder formulations have different reflow temperatures than leaded-solder formulations. When using both solder formulations on the same PC board, designers should consider the effect of different reflow temperatures on the overall PCB assembly process. Refer to www.nxp.com for an application note on recommended SOT1021-1 soldering practices.