Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Package
HXSON6: plastic, thermal enhanced extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1.6 mm x 1.6 mm x 0.5 mm body
Buy Options
BGU7258X
End of Life
12NC: 934067773115
Details
Order
Operating Features
No information available
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | RHF Indicator | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|---|
BGU7258X(934067773115) | Yes | Yes Certificate Of Analysis (CoA) | Yes |  | REACH SVHC | 6.912947 |
Quality
| Part/12NC | Safe Assure Functional Safety | Moisture Sensitivity Level (MSL) | Peak Package Body Temperature (PPT) (C°) | ||
|---|---|---|---|---|---|
| Lead Soldering | Lead Free Soldering | Lead Soldering | Lead Free Soldering | ||
BGU7258X (934067773115) | No | 1 | 1 | 240 | 260 |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer |
|---|---|
BGU7258X (934067773115) | 854233 |
More about BGU7258
The BGU7258 is a fully integrated MMIC Low Noise Amplifier (LNA) for wireless receiver applications in the 5 GHz to 6 GHz ISM band. Manufactured in NXP’s high performance SiGe:C technology, the BGU7258 couples gain, noise figure, linearity and efficiency with the process stability and ruggedness that are the hallmarks of SiGe technology. The BGU7258 features a robust temperature-compensated internal bias network and an integral bypass / shutdown feature that stabilizes the DC operating point over temperature and enables operation in the presence of high input signals, while minimizing current consumption in bypass (standby) mode. The 1.6 mm x 1.6 mm footprint coupled with only two external components, makes the circuit board implementation of the BGU7258 LNA the smallest IEEE 802.11ac LNA with bypass solution on the market, ideal for space sensitive applications.