Features
Battery Cell Controller, Advanced, 6 Channels, TPL, LQFP48.
Package
HLQFP48 LQFP64, plastic, low profile quad flat package; 64 terminals; 0.5 mm pitch; 10 mm x 10 mm x 1.4 mm body.
Features
3400-3800 MHz RF Top-Side Cooling Evaluation Board
Buy Options
A5M36TG140TC-EVB
Active
12NC: 935455672598
Details
Order
Operating Features
| Parameter | Value |
|---|---|
Security Status | COMPANY PUBLIC |
Description | 3400-3800 MHz RF Top-Side Cooling Evaluation Board |
Environmental
| Part/12NC | PbFree | EU RoHS | Halogen Free | REACH SVHC | Weight (mg) |
|---|---|---|---|---|---|
A5M36TG140TC-EVB(935455672598) | Not Available | No Information | Not Available | Compliant | 453592.0 |
Quality
| Part/12NC | Safe Assure Functional Safety |
|---|---|
A5M36TG140TC-EVB (935455672598) | No |
Shipping
| Part/12NC | Harmonized Tariff (US)Disclaimer | Export Control Classification Number (US) |
|---|---|---|
A5M36TG140TC-EVB (935455672598) | 903090 | EAR99 |
More about TSC-EVB
NXP RF top-side cooling technology enables thinner and lighter 5G massive MIMO radios, removing the need of the dedicated RF shield and separating thermal management from RF design. The first family of NXP top-side cooled devices are designed for 64T64R (320 W) or 32T32R (200 W) mMIMO radios covering 3.3 GHz to 3.8 GHz. These modules combine NXP’s internal LDMOS and GaN semiconductor technologies to enable high gain and efficiency with wideband performance, delivering 31 dB gain and 46 percent efficiency over 400 MHz of instantaneous bandwidth.
These NXP GaN multi-chip evaluation boards are designed for the thin MIMO module series whose top-side cooling technology helps reduce the thickness and weight of the overall radio by more than 30 percent, while simplifying the design and manufacturing process.