MIFARE DUOX®: High security contactless smartcard IC

MIFARE-DUOX
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As the first contactless smartcard IC in its class to combine asymmetric and symmetric cryptography in a single chip, MIFARE DUOX simplifies key management and key distribution. By adding certificate management capabilities, delivering enhanced features and security with CC EAL6+ certification, MIFARE DUOX enables high performing, highly secure and cost-effective NFC system solutions for access management, secure car access, EV-charging applications, and more.

Block Diagram

MIFARE DUOX

MIFARE DUOX Block Diagram
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Features

Certification and Compliancy

  • ISO/IEC 14443 A levels 1-4
  • ISO/IEC 7816-4
  • ISO/SAE 21434 automotive cybersecurity compliant
  • Common Criteria EAL 6+ certified hardware and software
  • NFC Forum Tag Type 4
  • MISRA-C coding standard compliant

RF Interface and ISO/IEC 14443 Type A

  • Contactless interface compliant with ISO/IEC 14443-2/3 A
  • Fast data transfer with baud rate of 106 kbit/s, 212 kbit/s, 424 kbit/s, 848 kbit/s and support of VHBR
  • 13.56 MHz operating frequency
  • Low Hmin enabling operating distance up to 100 mm (depending on power provided by the PCD and antenna geometry)
  • Configurable FSCI to support up to 256-bytes frame size

Nonvolatile Memory

  • User memory size of 2 kB, 4 kB, 8 kB and 16 kB
  • Data retention of 25 years
  • Write endurance up to 1,000,000 cycles
  • True multiapplication support with secure separation between applications
  • Flexible file system with data management structured into applications and files
  • File access rights management via assignment of access conditions per file
  • Interapplication file and data sharing
  • Delegated Application Management (DAM) functionality for easy postissuance application installation of third parties

Security and Privacy

  • Symmetric cryptographic algorithms: AES-128, AES-256
  • Symmetric AES-based mutual authentication establishing a secure channel
  • Future proof for PQC era (Post-Quantum-Crypto) with AES-256
  • Asymmetric cryptographic algorithms and key management: ECC with NIST P-256 and brainpoolP256r1 curves
  • Asymmetric ECC-based mutual authentication, reader-unilateral authentication and card-unilateral authentication establishing a secure channel
  • ECC signature generation via ECDSA and SHA-256
  • Simplified key management and key distribution via private/public key management and PKI concept
  • Key management on card level: 2 preinjected asymmetric keypairs and certificates; 11 reserved slots for symmetric keys
  • Key management on application level: up to 5 certificates per application; up to 14 symmetric keys per application (in up to 16 keysets)
  • Self-securing file system
  • Hardware exception sensors

Extended Features

  • Proximity Checks to detect relay attacks based on round-trip time measurement
  • Transaction Signature and Transaction MAC generating a secure proof of executed transactions
  • Transaction Timer to prevent Man-in-the-Middle attacks
  • Secure Dynamic Messaging to ensure security and integrity protected NDEF data reading
  • Dynamic Originality Checks based on ECC, verifying the genuineness of the IC via card-unilateral ECC-based authentication
  • NXP offered Trust Provisioning service to preinject data and key material securely by your trusted semiconductor manufacturer

EV-Charging Functionality (on "MIFARE DUOX EV" part types)

  • Availability of dedicated part types for EV-Charging with "MIFARE DUOX EV"
  • Support of EV-Charging specific command set as defined in VDE-AR-E 2532-100
  • Preinstalled EV-Charging application and file structure as defined in VDE-AR-E 2532-100
  • Preinjected key material and certificates, issued by the NXP EV-Charging CA, as defined in VDE-AR-E 2532-100
  • Ready-made solution for EV-Charging and interoperability between multiple CPOs and EMSPs

Additional Aspects

  • Extended operating temperature range for industrial and automotive applications: -40 °C up to +105 °C on silicon level
  • Unique 7 bytes serial number (UID) for each IC, as per ISO/IEC 14443-3 requirements
  • Optional configurable 4 byte random ID (RID)
  • Compatibility to MIFARE DESFire application and file system layout and EV2 secure messaging
  • Delivery forms as 75 µm sawn and bumped wafer and MOA8 contactless smart card module
  • Input capacitance options with 17 pF and 70 pF for different form factor designs (smartcards, wristbands, key fobs, tokens, stickers, and so on)

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Documentation

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Application Note (3)
Data Sheet (1)
Fact Sheet (4)
Supporting Information (1)
White Paper (1)

Design Files

Hardware

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Software

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