SPC5675KFF0VMS2R

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of SPC5675KFF0VMS2RLast Revision (GMT):
Friday, 20 September 2024, 04:52:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
SPC5675KFF0VMS2RSOT1523-2LFBGA4731601.572221 mg YesYesYesNickel/Gold (Ni/Au)Othere2contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 152 395182024-08-20103 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-83.79112598.1000000.236713
Gold and its compoundsGold, metal7440-57-50.0038650.1000000.000241
Palladium and its compoundsPalladium, metal7440-05-30.0695621.8000000.004343
Subtotal3.864551100.00000000.241297
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins25.8150005.0000001.611854
Inorganic Silicon compoundsSilica, vitreous60676-86-0345.92100067.00000021.598839
Inorganic Silicon compoundsSilicon dioxide7631-86-9129.07500025.0000008.059268
Inorganic compoundsCarbon Black1333-86-42.5815000.5000000.161185
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins12.9075002.5000000.805927
Subtotal516.300000100.000000032.237073
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-91.71000045.0000000.106770
Non-Halogenated Organic Compounds - SpecificBenzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa43035-18-30.0003800.0100000.000024
Organic Silicon compoundsDimethyl silicone polymer with silica67762-90-70.1900005.0000000.011863
PolymersPlastic: EP - Epoxide, Epoxy1.89962049.9900000.118610
Subtotal3.800000100.00000000.237267
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon, doped20.25333798.0000001.264591
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4133332.0000000.025808
Subtotal20.666670100.00000001.290399
Solder Ball - Lead FreeSolder Ball - Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0039340.0032000.000246
Antimony and its compoundsAntimony, metal7440-36-00.0153680.0125000.000959
Arsenic and its compoundsArsenic, metal7440-38-20.0092210.0075000.000576
Bismuth and its compoundsBismuth, metal7440-69-90.0231130.0188000.001443
Cadmium and its compoundsCadmium, metal7440-43-90.0015980.0013000.000100
Copper and its compoundsCopper, metal7440-50-80.0077450.0063000.000484
Gold and its compoundsGold, metal7440-57-50.0077450.0063000.000484
Indium and its compoundsIndium, metal7440-74-60.0077450.0063000.000484
Inorganic compoundsSulfur7704-34-90.0012290.0010000.000077
Iron and its compoundsIron, metal7439-89-60.0153680.0125000.000959
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0384810.0313000.002403
Nickel and its compoundsNickel, metal7440-02-00.0039340.0032000.000246
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0077450.0063000.000484
Silver and its compoundsSilver, metal7440-22-44.3031813.5002000.268685
Tin and its compoundsTin, metal7440-31-5118.49225796.3814007.398496
Zinc and its compoundsZinc, metal7440-66-60.0023360.0019000.000146
Subtotal122.941000100.00000007.676269
Substrate, Pre-plated NiAuCopper CoreCopper and its compoundsCopper, metal7440-50-8215.26547199.99000013.440884
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0215290.0100000.001344
Subtotal215.287000100.000000013.442229
Copper PlatingCopper and its compoundsCopper, metal7440-50-8296.48569199.98000018.512165
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0593090.0200000.003703
Subtotal296.545000100.000000018.515868
Gold PlatingGold and its compoundsGold, metal7440-57-52.70832999.9900000.169104
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0002710.0100000.000017
Subtotal2.708600100.00000000.169121
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0051280.0300000.000320
Nickel and its compoundsNickel, metal7440-02-017.08707299.9700001.066894
Subtotal17.092200100.00000001.067214
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.1161900.1000000.007255
Barium and its compoundsBarium sulfate7727-43-733.81117429.1000002.111124
Inorganic Silicon compoundsSilicon dioxide7631-86-90.6971380.6000000.043528
Magnesium and its compoundsTalc14807-96-63.4856883.0000000.217642
Organic compoundsOther organic compounds.4.1828263.6000000.261170
PolymersPlastic: EP - Epoxide, Epoxy22.65697219.5000001.414671
PolymersPlastic: PAK51.23961444.1000003.199332
Subtotal116.189600100.00000007.254721
Substrate Core 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-372.83852246.6700004.547939
Inorganic Silicon compoundsSilica, vitreous60676-86-010.3943556.6600000.649010
PolymersPlastic: PI - Polyimide72.83852246.6700004.547939
Subtotal156.071400100.00000009.744887
Substrate Core 2Inorganic Silicon compoundsFibrous-glass-wool65997-17-360.72056446.6700003.791310
Inorganic Silicon compoundsSilica, vitreous60676-86-08.6650736.6600000.541035
PolymersPlastic: PI - Polyimide60.72056346.6700003.791310
Subtotal130.106200100.00000008.123655
Total1601.572221100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 SPC5675KFF0VMS2R
Product content declaration of SPC5675KFF0VMS2R
上次修订 Last Revision (GMT):
Friday, 20 September 2024, 04:52:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-无铅
Solder Ball - Lead Free
焊锡球-无铅
Solder Ball - Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜芯
Copper Core
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core 1
OOOOOO

有机基质芯
Substrate Core 2
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of SPC5675KFF0VMS2RLast Revision (GMT):
Friday, 20 September 2024, 04:52:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder Ball - Lead FreeTest Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Test Report
6 Aug 2024
Substrate, Pre-plated NiAuAUS308Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
Test Report
18 Oct 2021
E679FG SERIESTest Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
Test Report
21 Dec 2021
SOLDER MASKNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.