PCA2129T/Q900/2,51
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| NXP Semiconductors | ||
| Product content declaration of PCA2129T/Q900/2,51 | Last Revision (GMT): Tuesday, 25 June 2024, 12:14:00 AM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| PCA2129T/Q900/2,51 | SOT162 | SO16 | 450.934014 mg | Yes | Yes | Yes | Other | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9352 969 23518 | 2024-02-16 | 4 | 3 / 168 hours | 260 | 30 sec. | 3 / 168 hours | 240 | 20 sec. | 3 | Bangkok, Thailand |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au | Bonding Wire - Au | Calcium and its compounds | Calcium | 7440-70-2 | 0.000004 | 0.001000 | 0.000001 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.363978 | 99.990000 | 0.080716 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000033 | 0.009000 | 0.000007 | |||
| Subtotal | 0.364014 | 100.0000000 | 0.080725 | ||||
| Copper Lead-Frame, Pre-Plated | Copper Lead-Frame, Pre-Plated | Copper and its compounds | Copper, metal | 7440-50-8 | 118.913400 | 97.470000 | 26.370466 |
| Iron and its compounds | Iron, metal | 7439-89-6 | 2.928000 | 2.400000 | 0.649319 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.036600 | 0.030000 | 0.008117 | ||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.122000 | 0.100000 | 0.027055 | ||
| Subtotal | 122.000000 | 100.0000000 | 27.054956 | ||||
| Crystal Oscillator | Ceramic | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 7.518040 | 92.600000 | 1.667215 |
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.259803 | 3.200000 | 0.057614 | ||
| Magnesium and its compounds | Magnesium-oxide | 1309-48-4 | 0.024356 | 0.300000 | 0.005401 | ||
| Manganese and its compounds | Manganese (III) oxide | 1317-34-6 | 0.276040 | 3.400000 | 0.061215 | ||
| Molybdenum and its compounds | Molybdenum trioxide | 1313-27-5 | 0.040594 | 0.500000 | 0.009002 | ||
| Subtotal | 8.118834 | 100.0000000 | 1.800448 | ||||
| Copper Alloy | Copper and its compounds | Copper, metal | 7440-50-8 | 0.822279 | 99.990000 | 0.182350 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000082 | 0.010000 | 0.000018 | |||
| Subtotal | 0.822362 | 100.0000000 | 0.182368 | ||||
| Crystal | Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.189325 | 99.997000 | 0.041985 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000006 | 0.003000 | 0.000001 | |||
| Subtotal | 0.189331 | 100.0000000 | 0.041987 | ||||
| Gold Plating | Gold and its compounds | Gold, metal | 7440-57-5 | 0.056365 | 99.998000 | 0.012500 | |
| Thallium and its compounds | Thallium, metal | 7440-28-0 | 0.000001 | 0.002000 | 0.000000 | ||
| Subtotal | 0.056366 | 100.0000000 | 0.012500 | ||||
| Inner Electrode | Gold and its compounds | Gold, metal | 7440-57-5 | 0.015294 | 99.990000 | 0.003392 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000002 | 0.010000 | 0.000000 | |||
| Subtotal | 0.015296 | 100.0000000 | 0.003392 | ||||
| Iron Alloy | Cobalt and its compounds | Cobalt, metal | 7440-48-4 | 0.231419 | 16.600000 | 0.051320 | |
| Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.000418 | 0.030000 | 0.000093 | ||
| Iron and its compounds | Iron, metal | 7439-89-6 | 0.745280 | 53.460000 | 0.165275 | ||
| Manganese and its compounds | Manganese, metal | 7439-96-5 | 0.003485 | 0.250000 | 0.000773 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.413487 | 29.660000 | 0.091696 | ||
| Subtotal | 1.394089 | 100.0000000 | 0.309156 | ||||
| Metal Braze | Copper and its compounds | Copper, metal | 7440-50-8 | 0.056510 | 15.000000 | 0.012532 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.320225 | 85.000000 | 0.071014 | ||
| Subtotal | 0.376735 | 100.0000000 | 0.083545 | ||||
| Metallization Layer | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000172 | 0.025000 | 0.000038 | ||
| Molybdenum and its compounds | Molybdenum, metal | 7439-98-7 | 0.687297 | 99.975000 | 0.152416 | ||
| Subtotal | 0.687469 | 100.0000000 | 0.152454 | ||||
| Nickel Cobalt Plating | Cobalt and its compounds | Cobalt, metal | 7440-48-4 | 0.041696 | 19.999900 | 0.009247 | |
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000002 | 0.001000 | 0.000000 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.166783 | 79.999100 | 0.036986 | ||
| Subtotal | 0.208481 | 100.0000000 | 0.046233 | ||||
| Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000013 | 0.010000 | 0.000003 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.131025 | 99.990000 | 0.029056 | ||
| Subtotal | 0.131038 | 100.0000000 | 0.029059 | ||||
| Die Encapsulant | Die Encapsulant | Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 263.700000 | 90.000000 | 58.478623 |
| Inorganic compounds | Carbon Black | 1333-86-4 | 1.465000 | 0.500000 | 0.324881 | ||
| Polymers | Plastic: EP - Epoxide, Epoxy | 27.835000 | 9.500000 | 6.172744 | |||
| Subtotal | 293.000000 | 100.0000000 | 64.976247 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Organic compounds | Other organic compounds. | 0.080000 | 0.800000 | 0.017741 | |
| Polymers | Plastic: EP - Epoxide, Epoxy | 2.420000 | 24.200000 | 0.536664 | |||
| Silver and its compounds | Silver, metal | 7440-22-4 | 7.500000 | 75.000000 | 1.663215 | ||
| Subtotal | 10.000000 | 100.0000000 | 2.217619 | ||||
| Pre-plating - Precious metal - Other | Pre-plating - Precious metal - Other | Gold and its compounds | Gold, metal | 7440-57-5 | 0.138000 | 3.000000 | 0.030603 |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 4.245800 | 92.300000 | 0.941557 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.142600 | 3.100000 | 0.031623 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.073600 | 1.600000 | 0.016322 | ||
| Subtotal | 4.600000 | 100.0000000 | 1.020105 | ||||
| Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 8.790600 | 98.000000 | 1.949421 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.179400 | 2.000000 | 0.039784 | |||
| Subtotal | 8.970000 | 100.0000000 | 1.989205 | ||||
| Total | 450.934014 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 PCA2129T/Q900/2,51 Product content declaration of PCA2129T/Q900/2,51 | 上次修订 Last Revision (GMT): Tuesday, 25 June 2024, 12:14:00 AM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | 铜引线框架，预镀 Copper Lead-Frame, Pre-Plated | O | O | O | O | O | O |
| 晶体振荡器 Crystal Oscillator | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 铜合金 Copper Alloy | O | O | O | O | O | O |
| | 水晶 Crystal | O | O | O | O | O | O |
| | 镀金材料 Gold Plating | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 铁合金 Iron Alloy | O | O | O | O | O | O |
| | 金属钎焊 Metal Braze | O | O | O | O | O | O |
| | 金属化层 Metallization Layer | O | O | O | O | O | O |
| | 镍钴电镀 Nickel Cobalt Plating | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 预电镀-贵金属-其它 Pre-plating - Precious metal - Other | 预电镀-贵金属-其它 Pre-plating - Precious metal - Other | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品具有无限期的环保使用期限（EFUP）。 |
| Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of PCA2129T/Q900/2,51 | Last Revision (GMT): Tuesday, 25 June 2024, 12:14:00 AM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | Test Report 13 Jul 2023 | |
| Copper Lead-Frame, Pre-Plated | AG PLATING | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 |
| AU PLATING | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | |
| C194 | Test Report 5 Feb 2024 | Test Report 5 Feb 2024 | Test Report 5 Feb 2024 | Test Report 5 Feb 2024 | |
| NI PLATING | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | |
| PD PLATING | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | Test Report 13 Dec 2023 | |
| Crystal Oscillator | AU PLATING | Test Report 12 Jan 2021 | Not Available | Not Available | Not Available |
| CERAMIC | Test Report 18 Feb 2021 | Not Available | Not Available | Not Available | |
| CRYSTAL | Test Report 2 Apr 2021 | Test Report 2 Apr 2021 | Test Report 2 Apr 2021 | Not Available | |
| INNER ELECTRODE AU | Test Report 4 Jan 2021 | Test Report 4 Jan 2021 | Not Available | Not Available | |
| LID COPPER | Test Report 23 Feb 2021 | Not Available | Not Available | Not Available | |
| LID KOVAR | Test Report 23 Feb 2021 | Not Available | Not Available | Not Available | |
| LID NICKEL | Test Report 23 Feb 2021 | Not Available | Not Available | Not Available | |
| LID SILVER | Test Report 23 Feb 2021 | Not Available | Not Available | Not Available | |
| METALLIZATION | Test Report 4 Feb 2021 | Not Available | Not Available | Not Available | |
| NI PLATING | Test Report 12 Jan 2021 | Test Report 25 Jun 2021 | Not Available | Not Available | |
| Die Encapsulant | Test Report 28 Dec 2023 | Test Report 28 Dec 2023 | Test Report 28 Dec 2023 | Test Report 28 Dec 2023 | |
| Epoxy Adhesive | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | |
| Pre-plating - Precious metal - Other | Test Report 1 Jan 2024 | Test Report 1 Jan 2024 | Test Report 1 Jan 2024 | Not Available | |
| Semiconductor Die | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | Test Report 19 Dec 2023 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |