NTM88H155ST1

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of NTM88H155ST1Last Revision (GMT):
Friday, 04 October 2024, 03:09:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
NTM88H155ST1SOT1931HQFN24112.370000 mg YesYesYesNickel/Palladium/Gold (Ni/Pd/Au)Cu alloye4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 416 785282024-10-2343 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.03999699.9900000.035593
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000004
Subtotal0.040000100.00000000.035597
Bonding Wire - CuPdAuBonding Wire - CuPdAuCopper and its compoundsCopper, metal7440-50-80.08689596.5500000.077329
Gold and its compoundsGold, metal7440-57-50.0003150.3500000.000280
Palladium and its compoundsPalladium, metal7440-05-30.0027903.1000000.002483
Subtotal0.090000100.00000000.080093
Copper Lead-Frame, Pre-Plated NiPdAuCopper Lead-Frame, Pre-Plated NiPdAuCopper and its compoundsCopper, metal7440-50-823.71987896.54000021.108728
Gold and its compoundsGold, metal7440-57-50.0024570.0100000.002187
Iron and its compoundsIron, metal7439-89-60.5601962.2800000.498528
Nickel and its compoundsNickel, metal7440-02-00.2334150.9500000.207720
Palladium and its compoundsPalladium, metal7440-05-30.0098280.0400000.008746
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0073710.0300000.006560
Zinc and its compoundsZinc, metal7440-66-60.0368550.1500000.032798
Subtotal24.570000100.000000021.865267
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins3.3754007.0000003.003827
Inorganic Silicon compoundsSilica, vitreous60676-86-038.43134079.70000034.200712
Inorganic Silicon compoundsSilicon dioxide7631-86-94.82200010.0000004.291181
Inorganic compoundsCarbon Black1333-86-40.1446600.3000000.128735
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins1.4466003.0000001.287354
Subtotal48.220000100.000000042.911809
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsOther Epoxy resins0.01860093.0000000.016553
Organic Silicon compounds(3,4-Epoxycyclohexyl)ethyltrimethoxysilane3388-04-30.0004002.0000000.000356
Organic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0010005.0000000.000890
Subtotal0.020000100.00000000.017798
Epoxy Adhesive 2Epoxy AdhesiveEpoxy ResinsOther Epoxy resins2.88090099.0000002.563763
Inorganic compoundsCarbon Black1333-86-40.0291001.0000000.025897
Subtotal2.910000100.00000002.589659
Epoxy Adhesive 3Epoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.0015005.0000000.001335
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.00450015.0000000.004005
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01500050.0000000.013349
PolymersCopolymer of ethylacrylate, buthylacrylate, acrylnitrile, glycidylmethacrylate58152-79-70.00450015.0000000.004005
PolymersFormaldehyde, polymer with 4,4'-(1-methylethylidene)bis[phenol]25085-75-00.00450015.0000000.004005
Subtotal0.030000100.00000000.026697
Epoxy Adhesive 4Epoxy AdhesiveInorganic Silicon compoundsSilicon dioxide7631-86-90.19500075.0000000.173534
Organic compoundsOther organic compounds.0.0039001.5000000.003471
PolymersPlastic: EP - Epoxide, Epoxy0.06110023.5000000.054374
Subtotal0.260000100.00000000.231378
LidLidChromium and Chromium III compoundsChromium, metal7440-47-34.56421719.0255004.061776
Inorganic Silicon compoundsSilicon7440-21-30.2402121.0013000.213769
Inorganic compoundsCarbon7440-44-00.0120190.0501000.010696
Inorganic compoundsSulfur7704-34-90.0047980.0200000.004270
Iron and its compoundsIron, metal7439-89-616.57917769.10870014.754096
Manganese and its compoundsManganese, metal7439-96-50.3603301.5020000.320664
Nickel and its compoundsNickel, metal7440-02-02.2220509.2624001.977440
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0071970.0300000.006405
Subtotal23.990000100.000000021.349114
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-36.56600098.0000005.843197
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1340002.0000000.119249
Subtotal6.700000100.00000005.962446
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.19600098.0000000.174424
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0040002.0000000.003560
Subtotal0.200000100.00000000.177983
Semiconductor Die 3Semiconductor DieInorganic Silicon compoundsSilicon7440-21-30.33320098.0000000.296520
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0068002.0000000.006051
Subtotal0.340000100.00000000.302572
Thermally Conductive Gel 1Thermally Conductive GelOrganic Silicon compoundsDimethyl,methyl hydrogen siloxane68037-59-20.0600006.0000000.053395
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-60.27000027.0000000.240278
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-20.67000067.0000000.596244
Subtotal1.000000100.00000000.889917
Thermally Conductive Gel 2Thermally Conductive GelOrganic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-61.45454436.3636001.294424
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-22.42424460.6061002.157376
Organic Silicon compoundsTetra (trimethylsiloxy) silane3555-47-30.1212123.0303000.107869
Subtotal4.000000100.00000003.559669
Total112.370000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 NTM88H155ST1
Product content declaration of NTM88H155ST1
上次修订 Last Revision (GMT):
Friday, 04 October 2024, 03:09:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
键合线-铜钯金
Bonding Wire - CuPdAu
键合线-铜钯金
Bonding Wire - CuPdAu
OOOOOO
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
铜引线框架,预镀镍钯金
Copper Lead-Frame, Pre-Plated NiPdAu
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 3
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 4
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
盖子
Lid
盖子
Lid
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
导热凝胶
Thermally Conductive Gel 1
导热凝胶
Thermally Conductive Gel
OOOOOO
导热凝胶
Thermally Conductive Gel 2
导热凝胶
Thermally Conductive Gel
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of NTM88H155ST1Last Revision (GMT):
Friday, 04 October 2024, 03:09:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Bonding Wire - CuPdAuTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Copper Lead-Frame, Pre-Plated NiPdAuAU PLATINGTest Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
CDA 194Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
NI PLATINGTest Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
PD PLATINGTest Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Test Report
19 Apr 2024
Die EncapsulantTest Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Test Report
15 Mar 2024
Epoxy Adhesive 1Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Test Report
28 Jul 2023
Epoxy Adhesive 2Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Test Report
12 Dec 2023
Epoxy Adhesive 3Not AvailableNot AvailableNot AvailableNot Available
Epoxy Adhesive 4Test Report
7 Mar 2024
Test Report
7 Mar 2024
Not AvailableNot Available
LidTest Report
3 Jan 2023
Test Report
3 Jan 2023
Test Report
3 Jan 2018
Test Report
3 Jan 2018
Semiconductor Die 1Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Semiconductor Die 2Not AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 3Not AvailableNot AvailableNot AvailableNot Available
Thermally Conductive Gel 1Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Thermally Conductive Gel 2Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
Test Report
3 May 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.