NT3H2211W0FHKH
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| NXP Semiconductors | ||
| Product content declaration of NT3H2211W0FHKH | Last Revision (GMT): Monday, 25 November 2024, 07:37:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| NT3H2211W0FHKH | SOT902 | XQFN8(U) | 3.924168 mg | Yes | Yes | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | Cu alloy | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9353 069 43125 | 2023-11-25 | 6 | 1 / Unlimited | 260 | 30 sec. | 1 / Unlimited | 240 | 20 sec. | 3 | Bangkok, Thailand |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au | Bonding Wire - Au | Calcium and its compounds | Calcium | 7440-70-2 | 0.000001 | 0.002000 | 0.000011 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.021633 | 98.840000 | 0.551304 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.008000 | 0.000045 | |||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.000252 | 1.150000 | 0.006414 | ||
| Subtotal | 0.021888 | 100.0000000 | 0.557774 | ||||
| Copper Lead-Frame, Pre-Plated NiPdAu | Copper Lead-Frame, Pre-Plated NiPdAu | Copper and its compounds | Copper, metal | 7440-50-8 | 0.769602 | 96.200300 | 19.611862 |
| Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.005200 | 0.650000 | 0.132512 | ||
| Magnesium and its compounds | Magnesium, metal | 7439-95-4 | 0.001201 | 0.150100 | 0.030600 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.023997 | 2.999600 | 0.611513 | ||
| Subtotal | 0.800000 | 100.0000000 | 20.386487 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.089250 | 3.570000 | 2.274367 | |
| Epoxy Resins | Tetramethylbiphenyl diglycidyl ether | 85954-11-6 | 0.038250 | 1.530000 | 0.974729 | ||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 2.112000 | 84.480000 | 53.820326 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.004500 | 0.180000 | 0.114674 | ||
| Magnesium and its compounds | Magnesium dihydroxide | 1309-42-8 | 0.089250 | 3.570000 | 2.274367 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.079250 | 3.170000 | 2.019536 | |||
| Phenols and Phenolic Resins | Phenol p-xylylene dimethyl ether copolymer | 26834-02-6 | 0.087500 | 3.500000 | 2.229772 | ||
| Subtotal | 2.500000 | 100.0000000 | 63.707772 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.080000 | 40.000000 | 2.038649 |
| Organic compounds | Other organic compounds. | 0.010000 | 5.000000 | 0.254831 | |||
| Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 0.020000 | 10.000000 | 0.509662 | ||
| Polymers | Acrylonitrile-methyl-methacrylate-vinylidene chloride copolymer | 25036-25-3 | 0.030000 | 15.000000 | 0.764493 | ||
| Polymers | Plastic: EP - Epoxide, Epoxy | 0.060000 | 30.000000 | 1.528987 | |||
| Subtotal | 0.200000 | 100.0000000 | 5.096622 | ||||
| Pre-plating - Precious metal - NiPdAu | Pre-plating - Precious metal - NiPdAu | Gold and its compounds | Gold, metal | 7440-57-5 | 0.001000 | 1.000000 | 0.025483 |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.097000 | 97.000000 | 2.471862 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.002000 | 2.000000 | 0.050966 | ||
| Subtotal | 0.100000 | 100.0000000 | 2.548311 | ||||
| Semiconductor Die | Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.284680 | 98.000000 | 7.254531 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.005810 | 2.000000 | 0.148052 | |||
| Subtotal | 0.290490 | 100.0000000 | 7.402583 | ||||
| Metallization Layer | Gold and its compounds | Gold, metal | 7440-57-5 | 0.010789 | 99.990000 | 0.274940 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000028 | |||
| Subtotal | 0.010790 | 100.0000000 | 0.274968 | ||||
| Under Bump Metal | Gold and its compounds | Gold, metal | 7440-57-5 | 0.000210 | 21.000000 | 0.005352 | |
| Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.000020 | 2.000000 | 0.000510 | ||
| Tungsten and its compounds | Tungsten, metal | 7440-33-7 | 0.000770 | 77.000000 | 0.019622 | ||
| Subtotal | 0.001000 | 100.0000000 | 0.025483 | ||||
| Total | 3.924168 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 NT3H2211W0FHKH Product content declaration of NT3H2211W0FHKH | 上次修订 Last Revision (GMT): Monday, 25 November 2024, 07:37:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 铜引线框架，预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | 铜引线框架，预镀镍钯金 Copper Lead-Frame, Pre-Plated NiPdAu | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 预电镀-贵金属-镍钯金 Pre-plating - Precious metal - NiPdAu | 预电镀-贵金属-镍钯金 Pre-plating - Precious metal - NiPdAu | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Die | O | O | O | O | O | O |
| | 金属化层 Metallization Layer | O | O | O | O | O | O |
| | 焊料凸点下的金属 Under Bump Metal | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品具有无限期的环保使用期限（EFUP）。 |
| Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP). |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of NT3H2211W0FHKH | Last Revision (GMT): Monday, 25 November 2024, 07:37:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | Test Report 3 Jul 2024 | |
| Copper Lead-Frame, Pre-Plated NiPdAu | AU PLATING | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 |
| C7025 | Test Report 24 Jan 2025 | Test Report 24 Jan 2025 | Test Report 24 Jan 2025 | Test Report 24 Jan 2025 | |
| NI PLATING | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | |
| PD PLATING | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | Test Report 19 Apr 2024 | |
| Die Encapsulant | Not Available | Not Available | Not Available | Not Available | |
| Epoxy Adhesive | Test Report 11 Apr 2024 | Test Report 11 Apr 2024 | Test Report 11 Apr 2024 | Test Report 11 Apr 2024 | |
| Pre-plating - Precious metal - NiPdAu | Test Report 1 Jan 2025 | Test Report 1 Jan 2025 | Test Report 1 Jan 2025 | Test Report 1 Jan 2025 | |
| Semiconductor Die | AU BUMP | Test Report 11 Dec 2024 | Test Report 11 Dec 2024 | Test Report 11 Dec 2024 | Test Report 11 Dec 2024 |
| DIE | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | Test Report 18 Jun 2024 | |
| TIW UBM | Test Report 8 Apr 2024 | Test Report 8 Apr 2024 | Test Report 8 Apr 2024 | Test Report 8 Apr 2024 | |
| UBM AU | Not Available | Not Available | Not Available | Not Available | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |