MPC8572ELPXAVNE
As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.
Download
| NXP Semiconductors | ||
| Product content declaration of MPC8572ELPXAVNE | Last Revision (GMT): Tuesday, 05 March 2024, 06:34:00 AM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MPC8572ELPXAVNE | SOT1619-1 | BGA1023 | 5761.213000 mg | No | No | No | Tin/Lead (Sn63/Pb37) | Other | e0 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9353 105 79557 | 2024-02-06 | 5 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 245 | 30 sec. | 3 | Kuala Lumpur, Malaysia;External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Capacitor | Capacitor | Barium and its compounds | Barium titanate | 12047-27-7 | 46.695600 | 65.400000 | 0.810517 |
| Copper and its compounds | Copper, metal | 7440-50-8 | 9.853200 | 13.800000 | 0.171026 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 13.923000 | 19.500000 | 0.241668 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.928200 | 1.300000 | 0.016111 | ||
| Subtotal | 71.400000 | 100.0000000 | 1.239322 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Inorganic Silicon compounds | Quartz | 14808-60-7 | 21.600000 | 30.000000 | 0.374921 |
| Inorganic Silicon compounds | Silylated silica | 68909-20-6 | 2.880000 | 4.000000 | 0.049989 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.014400 | 0.020000 | 0.000250 | |||
| Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 2.880000 | 4.000000 | 0.049989 | ||
| Organic Silicon compounds | Other siloxanes and silicones | 2.160000 | 3.000000 | 0.037492 | |||
| Organic Silicon compounds | Silicic acid sodium salt hydrolysis products with chlorotrimethylsilane and dichloroethenylmethylsilane | 68584-83-8 | 3.240000 | 4.500000 | 0.056238 | ||
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 38.880000 | 54.000000 | 0.674858 | ||
| Organic Silicon compounds | [3-(2,3-epoxypropoxy)propyl]trimethoxysilane | 2530-83-8 | 0.216000 | 0.300000 | 0.003749 | ||
| Organic compounds | Other organic compounds. | 0.108000 | 0.150000 | 0.001875 | |||
| Platinum and its compounds | Other platinum compounds | 0.021600 | 0.030000 | 0.000375 | |||
| Subtotal | 72.000000 | 100.0000000 | 1.249737 | ||||
| Semiconductor Die | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 309.444300 | 89.100000 | 5.371166 | |
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 32.707672 | 9.417700 | 0.567722 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 3.125700 | 0.900000 | 0.054254 | |||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.286523 | 0.082500 | 0.004973 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 1.721219 | 0.495600 | 0.029876 | ||
| Titanium and its compounds | Titanium, metal | 7440-32-6 | 0.014587 | 0.004200 | 0.000253 | ||
| Subtotal | 347.300000 | 100.0000000 | 6.028244 | ||||
| Solder Ball - Low Lead | Solder Ball - Low Lead | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 367.363080 | 36.000000 | 6.376488 |
| Silver and its compounds | Silver, metal | 7440-22-4 | 20.409060 | 2.000000 | 0.354249 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 632.680860 | 62.000000 | 10.981730 | ||
| Subtotal | 1020.453000 | 100.0000000 | 17.712468 | ||||
| Solder Flux | Solder Flux | Copper and its compounds | Copper, metal | 7440-50-8 | 51.531000 | 96.500000 | 0.894447 |
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.602000 | 3.000000 | 0.027807 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.267000 | 0.500000 | 0.004634 | ||
| Subtotal | 53.400000 | 100.0000000 | 0.926888 | ||||
| Substrate | Copper Foil | Copper and its compounds | Copper, metal | 7440-50-8 | 501.176916 | 99.870000 | 8.699156 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.652378 | 0.130000 | 0.011324 | |||
| Subtotal | 501.829294 | 100.0000000 | 8.710480 | ||||
| Copper Plating | Copper and its compounds | Copper, metal | 7440-50-8 | 1392.114656 | 99.750000 | 24.163569 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 3.489009 | 0.250000 | 0.060560 | |||
| Subtotal | 1395.603665 | 100.0000000 | 24.224129 | ||||
| Insulation | Epoxy Resins | Bisphenol A diglycidyl ether | 1675-54-3 | 37.337598 | 10.450000 | 0.648086 | |
| Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 37.337598 | 10.450000 | 0.648086 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 149.529039 | 41.850000 | 2.595444 | ||
| Polymers | Plastic: EP - Epoxide, Epoxy | 133.093350 | 37.250000 | 2.310162 | |||
| Subtotal | 357.297585 | 100.0000000 | 6.201777 | ||||
| Solder Ball 1 | Copper and its compounds | Copper, metal | 7440-50-8 | 0.237120 | 0.500000 | 0.004116 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.422720 | 3.000000 | 0.024695 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 45.764147 | 96.500000 | 0.794349 | ||
| Subtotal | 47.423987 | 100.0000000 | 0.823160 | ||||
| Solder Ball 2 | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 3.934158 | 37.000000 | 0.068287 | |
| Tin and its compounds | Tin, metal | 7440-31-5 | 6.698701 | 63.000000 | 0.116272 | ||
| Subtotal | 10.632859 | 100.0000000 | 0.184559 | ||||
| Solder Mask | Barium and its compounds | Barium sulfate | 7727-43-7 | 20.737986 | 31.100000 | 0.359959 | |
| Copper and its compounds | Copper phthalocyanine | 147-14-8 | 0.133363 | 0.200000 | 0.002315 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.333408 | 0.500000 | 0.005787 | ||
| Magnesium and its compounds | Talc | 14807-96-6 | 2.400539 | 3.600000 | 0.041667 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.733498 | 1.100000 | 0.012732 | |||
| Organic compounds | Proprietary Material-Other organic compounds. | 0.066682 | 0.100000 | 0.001157 | |||
| Polymers | Plastic: EP - Epoxide, Epoxy | 42.276152 | 63.400000 | 0.733806 | |||
| Subtotal | 66.681628 | 100.0000000 | 1.157423 | ||||
| Substrate Core | Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 508.520319 | 32.000000 | 8.826619 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 95.347560 | 6.000000 | 1.654991 | ||
| Polymers | Plastic: PI - Polyimide | 985.258119 | 62.000000 | 17.101574 | |||
| Subtotal | 1589.125998 | 100.0000000 | 27.583184 | ||||
| Via Plugging | Calcium and its compounds | Calcium-carbonate | 471-34-1 | 41.733712 | 50.400000 | 0.724391 | |
| Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 7.121229 | 8.600000 | 0.123606 | ||
| Epoxy Resins | Proprietary Material-Other Epoxy resins | 12.420748 | 15.000000 | 0.215593 | |||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.828050 | 1.000000 | 0.014373 | |||
| Phenols and Phenolic Resins | Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane | 25068-38-6 | 20.701246 | 25.000000 | 0.359321 | ||
| Subtotal | 82.804985 | 100.0000000 | 1.437284 | ||||
| Thermally Conductive Gel | Thermally Conductive Gel | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 50.841000 | 70.000000 | 0.882470 |
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 2.178900 | 3.000000 | 0.037820 | |||
| Organic Silicon compounds | Dimethyl Cyclosiloxanes | 70900-21-9 | 0.726300 | 1.000000 | 0.012607 | ||
| Organic Silicon compounds | Dimethyl,methyl hydrogen siloxane | 68037-59-2 | 0.726300 | 1.000000 | 0.012607 | ||
| Organic Silicon compounds | Siloxanes and silicones, di-Me, vinyl group-terminated | 68083-19-2 | 7.263000 | 10.000000 | 0.126067 | ||
| Zinc and its compounds | Zinc oxide | 1314-13-2 | 10.894500 | 15.000000 | 0.189101 | ||
| Subtotal | 72.630000 | 100.0000000 | 1.260672 | ||||
| Underfill | Underfill | Aromatic amines and their salts | 4,4'-Methylenebis(2-ethylbenzenamine) | 19900-65-3 | 7.989300 | 11.000000 | 0.138674 |
| Bismuth and its compounds | Bismuth nitrate | 10361-44-1 | 0.072630 | 0.100000 | 0.001261 | ||
| Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.581040 | 0.800000 | 0.010085 | ||
| Epoxy Resins | 1,6-Bis(2,3-epoxypropoxy) naphthalene | 27610-48-6 | 10.168200 | 14.000000 | 0.176494 | ||
| Epoxy Resins | Other Epoxy resins | 2.905200 | 4.000000 | 0.050427 | |||
| Epoxy Resins | Phenolic Polymer Resin, Epikote 155 | 9003-36-5 | 7.263000 | 10.000000 | 0.126067 | ||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 43.578000 | 60.000000 | 0.756403 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.072630 | 0.100000 | 0.001261 | ||
| Subtotal | 72.630000 | 100.0000000 | 1.260672 | ||||
| Total | 5761.213000 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MPC8572ELPXAVNE Product content declaration of MPC8572ELPXAVNE | 上次修订 Last Revision (GMT): Tuesday, 05 March 2024, 06:34:00 AM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 电容器 Capacitor | 电容器 Capacitor | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die | 半导体芯片 Semiconductor Die | X | O | O | O | O | O |
| 焊球 - 低铅 Solder Ball - Low Lead | 焊球 - 低铅 Solder Ball - Low Lead | X | O | O | O | O | O |
| 助焊剂 Solder Flux | 助焊剂 Solder Flux | O | O | O | O | O | O |
| 基板 Substrate | 铜箔 Copper Foil | O | O | O | O | O | O |
| | 镀铜 Copper Plating | O | O | O | O | O | O |
| | 绝缘 Insulation | O | O | O | O | O | O |
| | 焊锡球 Solder Ball 1 | O | O | O | O | O | O |
| | 焊锡球 Solder Ball 2 | X | O | O | O | O | O |
| | 阻焊层 Solder Mask | O | O | O | O | O | O |
| | 有机基质芯 Substrate Core | O | O | O | O | O | O |
| | 有机基质通道堵塞 Via Plugging | O | O | O | O | O | O |
| 导热凝胶 Thermally Conductive Gel | 导热凝胶 Thermally Conductive Gel | O | O | O | O | O | O |
| 底注 Underfill | 底注 Underfill | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MPC8572ELPXAVNE | Last Revision (GMT): Tuesday, 05 March 2024, 06:34:00 AM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Capacitor | CERAMIC | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 | Test Report 27 Nov 2023 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 29 Sep 2023 | Test Report 29 Sep 2023 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 27 Apr 2023 | Test Report 25 Jun 2021 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 21 Sep 2023 | Test Report 21 Sep 2023 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Epoxy Adhesive | Test Report 26 Feb 2024 | Test Report 26 Feb 2024 | Test Report 26 Feb 2024 | Not Available | |
| Semiconductor Die | Test Report 6 Mar 2024 | Test Report 6 Mar 2024 | Test Report 6 Mar 2024 | Test Report 28 Mar 2023 | |
| Solder Ball - Low Lead | Test Report 8 Oct 2021 | Test Report 8 Oct 2021 | Test Report 8 Oct 2021 | Test Report 8 Nov 2021 | |
| Solder Flux | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | Test Report 11 Aug 2021 | |
| Substrate | ABF-GX13 | Test Report 4 Mar 2024 | Test Report 4 Mar 2024 | Test Report 4 Mar 2024 | Test Report 4 Mar 2024 |
| AUS 703 | Test Report 18 Mar 2024 | Test Report 18 Mar 2024 | Test Report 11 Oct 2023 | Test Report 11 Oct 2023 | |
| COPPER FOIL | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
| E679FG SERIES | Test Report 7 Dec 2023 | Not Available | Not Available | Not Available | |
| E679FGB | Not Available | Not Available | Not Available | Not Available | |
| E679FGB SERIES | Not Available | Not Available | Test Report 7 Dec 2023 | Test Report 7 Dec 2023 | |
| PHP-900 IR6 | Test Report 18 Mar 2024 | Test Report 18 Mar 2024 | Test Report 20 Apr 2023 | Not Available | |
| Thermally Conductive Gel | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | Test Report 31 Jul 2024 | |
| Underfill | Test Report 11 Sep 2024 | Test Report 11 Sep 2024 | Test Report 11 Sep 2024 | Test Report 11 Sep 2024 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |