MK22FN512VMP12

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MK22FN512VMP12Last Revision (GMT):
Wednesday, 06 November 2024, 08:35:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MK22FN512VMP12SOT1555LFBGA6462.456680 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 120 245572023-11-2453 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-80.59351598.1000000.950282
Gold and its compoundsGold, metal7440-57-50.0006050.1000000.000969
Palladium and its compoundsPalladium, metal7440-05-30.0108901.8000000.017436
Subtotal0.605010100.00000000.968688
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins1.8000006.0000002.881998
Inorganic Silicon compoundsSilica, vitreous60676-86-022.20000074.00000035.544637
Inorganic Silicon compoundsSilicon dioxide7631-86-94.50000015.0000007.204994
Inorganic compoundsCarbon Black1333-86-40.1500000.5000000.240167
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.6000002.0000000.960666
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.7500002.5000001.200832
Subtotal30.000000100.000000048.033293
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.11000010.0000000.176122
Inorganic Silicon compoundsSilicon dioxide7631-86-90.27500025.0000000.440305
Phenols and Phenolic ResinsPhenol p-xylylene dimethyl ether copolymer26834-02-60.33000030.0000000.528366
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.27500025.0000000.440305
PolymersAcrylic acid ester copolymer78506-70-40.11000010.0000000.176122
Subtotal1.100000100.00000001.761221
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-317.41133798.00000027.877461
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.3553332.0000000.568928
Subtotal17.766670100.000000028.446389
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-80.0349250.5000000.055919
Silver and its compoundsSilver, metal7440-22-40.0698501.0000000.111838
Tin and its compoundsTin, metal7440-31-56.88022598.50000011.015995
Subtotal6.985000100.000000011.183752
Substrate, Pre-plated NiAuCopper FoilCopper and its compoundsCopper, metal7440-50-81.27127399.9900002.035447
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001270.0100000.000204
Subtotal1.271400100.00000002.035651
Copper PlatingCopper and its compoundsCopper, metal7440-50-81.51244999.9900002.421596
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001510.0100000.000242
Subtotal1.512600100.00000002.421839
Gold PlatingGold and its compoundsGold, metal7440-57-50.11398999.9900000.182508
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000110.0100000.000018
Subtotal0.114000100.00000000.182527
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0003310.0300000.000531
Nickel and its compoundsNickel, metal7440-02-01.10426999.9700001.768055
Subtotal1.104600100.00000001.768586
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0004430.1000000.000709
Barium and its compoundsBarium sulfate7727-43-70.12885529.1000000.206311
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0026570.6000000.004254
Magnesium and its compoundsTalc14807-96-60.0132843.0000000.021269
Organic compoundsOther organic compounds.0.0159413.6000000.025523
PolymersPlastic: EP - Epoxide, Epoxy0.08634619.5000000.138249
PolymersPlastic: PAK0.19527544.1000000.312656
Subtotal0.442800100.00000000.708971
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-30.49747232.0000000.796507
Inorganic Silicon compoundsSilica, vitreous60676-86-00.0932766.0000000.149345
PolymersPlastic: PI - Polyimide0.96385262.0000001.543233
Subtotal1.554600100.00000002.489085
Total62.456680100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MK22FN512VMP12
Product content declaration of MK22FN512VMP12
上次修订 Last Revision (GMT):
Wednesday, 06 November 2024, 08:35:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MK22FN512VMP12Last Revision (GMT):
Wednesday, 06 November 2024, 08:35:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Test Report
29 Aug 2024
Die EncapsulantTest Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy AdhesiveTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Not Available
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
Solder Ball - SAC, Lead FreeTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
COPPER FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
CU PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
E679FG SERIESTest Report
7 Dec 2023
Test Report
7 Dec 2023
Not AvailableNot Available
E679FGB SERIESNot AvailableNot AvailableTest Report
7 Dec 2023
Test Report
7 Dec 2023
NI PLATINGTest Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
Test Report
20 Mar 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.