MCIMX515DJM8CR2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

NXP Semiconductors
Product content declaration of MCIMX515DJM8CR2Last Revision (GMT):
Friday, 13 September 2024, 08:51:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX515DJM8CR2SOT1526-2LFBGA5291003.918674 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 195 445182023-11-2473 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-82.35775497.0000000.234855
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0729203.0000000.007264
Subtotal2.430674100.00000000.242119
Die EncapsulantDie EncapsulantAluminum and its compoundsAluminum, metal7429-90-59.7188572.0010000.968092
Inorganic Silicon compoundsSilica, vitreous60676-86-0339.91714569.98500033.859032
Inorganic Silicon compoundsSilicon dioxide7631-86-987.46971318.0090008.712829
Magnesium and its compoundsMagnesium, metal7439-95-44.8594281.0005000.484046
Phenols and Phenolic ResinsOther phenolic resins14.5782853.0015001.452138
PolymersOther acrylic/epoxy resin mixture29.1565716.0030002.904276
Subtotal485.700000100.000000048.380413
Epoxy AdhesiveEpoxy AdhesiveAcrylatesDitrimethylolpropane tetraacrylate94108-97-10.0300005.0000000.002988
Aromatic hydrocarbon compoundsHydroquinone123-31-90.0003000.0500000.000030
Inorganic Silicon compoundsSilicon dioxide7631-86-90.09000015.0000000.008965
Inorganic Silicon compoundsSilylated silica68909-20-60.29970049.9500000.029853
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0300005.0000000.002988
Organic compoundsFatty acids, C18-unsatd., dimers, hydrogenated, polymers with hydrogenated di-Me esters of hydrogenated C18-unsatd. fatty acid dimer177591-08-10.12000020.0000000.011953
Polymers2-Propenoic acid,2-methyl-, 1,1'-(2,2-dimethyl-1,3-propanediyl) ester1985-51-90.0300005.0000000.002988
Subtotal0.600000100.00000000.059766
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-323.97080098.0000002.387723
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4892002.0000000.048729
Subtotal24.460000100.00000002.436452
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0013020.0010000.000130
Antimony and its compoundsAntimony, metal7440-36-00.0651140.0500000.006486
Arsenic and its compoundsArsenic, metal7440-38-20.0390680.0300000.003892
Bismuth and its compoundsBismuth, metal7440-69-90.0390680.0300000.003892
Cadmium and its compoundsCadmium, metal7440-43-90.0026050.0020000.000259
Copper and its compoundsCopper, metal7440-50-80.6511400.5000000.064860
Iron and its compoundsIron, metal7439-89-60.0260460.0200000.002594
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0651140.0500000.006486
Silver and its compoundsSilver, metal7440-22-41.3022801.0000000.129720
Tin and its compoundsTin, metal7440-31-5128.03496098.31600012.753519
Zinc and its compoundsZinc, metal7440-66-60.0013020.0010000.000130
Subtotal130.228000100.000000012.971967
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0057680.0050000.000575
Copper and its compoundsCopper, metal7440-50-8115.27348099.92500011.482352
Nickel and its compoundsNickel, metal7440-02-00.0576800.0500000.005745
Zinc and its compoundsZinc, metal7440-66-60.0230720.0200000.002298
Subtotal115.360000100.000000011.490971
Copper PlatingCopper and its compoundsCopper, metal7440-50-872.49608199.9000007.221310
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0725690.1000000.007228
Subtotal72.568650100.00000007.228539
Gold PlatingGold and its compoundsGold, metal7440-57-53.13321499.9000000.312098
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0031360.1000000.000312
Subtotal3.136350100.00000000.312411
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0144200.1000000.001436
Nickel and its compoundsNickel, metal7440-02-014.40558099.9000001.434935
Subtotal14.420000100.00000001.436371
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0300300.1000000.002991
Barium and its compoundsBarium sulfate7727-43-78.73862829.1000000.870452
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1801780.6000000.017948
Magnesium and its compoundsTalc14807-96-60.9008903.0000000.089737
Organic compoundsOther organic compounds.1.0810673.6000000.107685
PolymersPlastic: EP - Epoxide, Epoxy5.85578219.5000000.583292
PolymersPlastic: PAK13.24307544.1000001.319138
Subtotal30.029650100.00000002.991243
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-636.62070829.3000003.647776
Inorganic Silicon compoundsFibrous-glass-wool65997-17-332.49619126.0000003.236935
Inorganic Silicon compoundsSilicon dioxide7631-86-92.1247511.7000000.211646
Miscellaneous substancesOther miscellaneous substances (less than 10%).10.2487998.2000001.020879
Phenols - SpecificBisphenol A80-05-71.2498531.0000000.124497
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)24.62211419.7000002.452600
PolymersPlastic: EP - Epoxide, Epoxy17.62293414.1000001.755415
Subtotal124.985350100.000000012.449749
Total1003.918674100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX515DJM8CR2
Product content declaration of MCIMX515DJM8CR2
上次修订 Last Revision (GMT):
Friday, 13 September 2024, 08:51:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX515DJM8CR2Last Revision (GMT):
Friday, 13 September 2024, 08:51:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Test Report
20 Oct 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Substrate, Pre-plated NiAuAUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
E679FG SERIESTest Report
14 Dec 2022
Test Report
21 Dec 2021
Test Report
14 Dec 2022
Test Report
21 Dec 2021
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.