MCIMX287CVM4B

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NXP Semiconductors
Product content declaration of MCIMX287CVM4BLast Revision (GMT):
Thursday, 24 October 2024, 07:19:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MCIMX287CVM4BSOT1534-1LFBGA289440.762002 mg YesYesYesNickel/Gold (Ni/Au)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 142 825572023-11-2483 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuPdBonding Wire - CuPdCopper and its compoundsCopper, metal7440-50-81.78246898.0994000.404406
Gold and its compoundsGold, metal7440-57-50.0018170.1000000.000412
Palladium and its compoundsPalladium, metal7440-05-30.0327171.8006000.007423
Subtotal1.817002100.00000000.412241
Die EncapsulantDie EncapsulantEpoxy ResinsBisphenol A diglycidyl ether1675-54-37.1370003.0000001.619241
Epoxy ResinsProprietary Material-Other Epoxy resins7.1370003.0000001.619241
Inorganic Silicon compoundsSilica, vitreous60676-86-0160.58250067.50000036.432927
Inorganic Silicon compoundsSilicon dioxide7631-86-947.58000020.00000010.794941
Inorganic compoundsCarbon Black1333-86-41.1895000.5000000.269873
Miscellaneous substancesOther miscellaneous substances (less than 10%).7.1370003.0000001.619241
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins7.1370003.0000001.619241
Subtotal237.900000100.000000053.974707
Epoxy AdhesiveEpoxy AdhesiveAcrylatesDitrimethylolpropane tetraacrylate94108-97-10.0750005.0000000.017016
Aromatic hydrocarbon compoundsHydroquinone123-31-90.0007500.0500000.000170
Inorganic Silicon compoundsSilicon dioxide7631-86-90.22500015.0000000.051048
Inorganic Silicon compoundsSilylated silica68909-20-60.74925049.9500000.169990
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0750005.0000000.017016
Organic compoundsFatty acids, C18-unsatd., dimers, hydrogenated, polymers with hydrogenated di-Me esters of hydrogenated C18-unsatd. fatty acid dimer177591-08-10.30000020.0000000.068064
Polymers2-Propenoic acid,2-methyl-, 1,1'-(2,2-dimethyl-1,3-propanediyl) ester1985-51-90.0750005.0000000.017016
Subtotal1.500000100.00000000.340320
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-312.74000098.0000002.890449
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.2600002.0000000.058989
Subtotal13.000000100.00000002.949438
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeAluminum and its compoundsAluminum, metal7429-90-50.0007120.0010000.000161
Antimony and its compoundsAntimony, metal7440-36-00.0355720.0500000.008071
Arsenic and its compoundsArsenic, metal7440-38-20.0213440.0300000.004842
Bismuth and its compoundsBismuth, metal7440-69-90.0213440.0300000.004842
Cadmium and its compoundsCadmium, metal7440-43-90.0014230.0020000.000323
Copper and its compoundsCopper, metal7440-50-80.3557250.5000000.080707
Iron and its compoundsIron, metal7439-89-60.0142290.0200000.003228
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0355720.0500000.008071
Silver and its compoundsSilver, metal7440-22-40.7114501.0000000.161414
Tin and its compoundsTin, metal7440-31-569.94691898.31600015.869544
Zinc and its compoundsZinc, metal7440-66-60.0007120.0010000.000161
Subtotal71.145000100.000000016.141364
Substrate, Pre-plated NiAuCopper FoilChromium and Chromium III compoundsChromium, metal7440-47-30.0013190.0050000.000299
Copper and its compoundsCopper, metal7440-50-826.35719599.9250005.979915
Nickel and its compoundsNickel, metal7440-02-00.0131890.0500000.002992
Zinc and its compoundsZinc, metal7440-66-60.0052750.0200000.001197
Subtotal26.376978100.00000005.984404
Copper PlatingCopper and its compoundsCopper, metal7440-50-834.28652799.9900007.778921
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0034290.0100000.000778
Subtotal34.289956100.00000007.779699
Gold PlatingGold and its compoundsGold, metal7440-57-51.42850999.9900000.324100
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001430.0100000.000032
Subtotal1.428652100.00000000.324132
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0010990.0100000.000249
Nickel and its compoundsNickel, metal7440-02-010.98959799.9900002.493318
Subtotal10.990696100.00000002.493567
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0137380.1000000.003117
Barium and its compoundsBarium sulfate7727-43-73.99786629.1000000.907035
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0824300.6000000.018702
Magnesium and its compoundsTalc14807-96-60.4121513.0000000.093509
Organic compoundsOther organic compounds.0.4945813.6000000.112211
PolymersPlastic: EP - Epoxide, Epoxy2.67898219.5000000.607807
PolymersPlastic: PAK6.05862144.1000001.374579
Subtotal13.738370100.00000003.116959
Substrate CoreAluminum and its compoundsAluminum hydroxide oxide24623-77-66.22942621.8000001.413331
Inorganic Silicon compoundsFibrous-glass-wool65997-17-312.80175644.8000002.904460
Inorganic Silicon compoundsSilicon dioxide7631-86-90.3429041.2000000.077798
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.8288226.4000000.414923
Phenols - SpecificBisphenol A80-05-70.2857531.0000000.064832
PolymersBT Resin (CAS# 13676-54-5/25722-66-1)4.11485014.4000000.933576
PolymersPlastic: EP - Epoxide, Epoxy2.97183610.4000000.674250
Subtotal28.575348100.00000006.483170
Total440.762002100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MCIMX287CVM4B
Product content declaration of MCIMX287CVM4B
上次修订 Last Revision (GMT):
Thursday, 24 October 2024, 07:19:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜钯
Bonding Wire - CuPd
焊丝-铜钯
Bonding Wire - CuPd
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板,镍金预镀
Substrate, Pre-plated NiAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

镀镍层
Nickel Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机基质芯
Substrate Core
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MCIMX287CVM4BLast Revision (GMT):
Thursday, 24 October 2024, 07:19:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuPdTest Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Test Report
25 Dec 2023
Die EncapsulantTest Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Test Report
12 Oct 2023
Epoxy AdhesiveTest Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Test Report
18 Apr 2024
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Test Report
13 Sep 2024
Substrate, Pre-plated NiAuAU PLATINGTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
AUS308Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
Test Report
5 Jun 2024
CU FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
8 Feb 2023
Test Report
8 Feb 2023
CU PLATINGTest Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
29 Mar 2024
Test Report
17 May 2022
HL832NXATest Report
29 Dec 2023
Test Report
29 Dec 2023
Test Report
8 Feb 2023
Test Report
8 Feb 2023
NI PLATINGTest Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
Test Report
16 May 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.