MC33GD3100A3EK

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
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Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of MC33GD3100A3EKLast Revision (GMT):
Tuesday, 17 September 2024, 12:37:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
MC33GD3100A3EKSOT1762SSOP32467.936325 mg YesYesYesTin (Sn)Cu alloye3contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 814 265742023-11-24113 / 168 hours26040 sec.Not ApplicableNot ApplicableNot Applicable3Tianjin, China
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - CuBonding Wire - CuCopper and its compoundsCopper, metal7440-50-80.03999599.9948000.008548
Inorganic compoundsSulfur7704-34-90.0000010.0010000.000000
Iron and its compoundsIron, metal7439-89-60.0000010.0010000.000000
Manganese and its compoundsManganese, metal7439-96-50.0000010.0010000.000000
Nickel and its compoundsNickel, metal7440-02-00.0000010.0010000.000000
Silver and its compoundsSilver, metal7440-22-40.0000010.0012000.000000
Subtotal0.040000100.00000000.008548
Copper Lead-Frame, Pre-Plated AgCopper AlloyCopper and its compoundsCopper, metal7440-50-8104.60144697.29100022.353778
Iron and its compoundsIron, metal7439-89-62.5480822.3700000.544536
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0182770.0170000.003906
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.1784730.1660000.038141
Tin and its compoundsTin, metal7440-31-50.0322540.0300000.006893
Zinc and its compoundsZinc, metal7440-66-60.1354680.1260000.028950
Subtotal107.514000100.000000022.976203
Silver PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001090.0100000.000023
Silver and its compoundsSilver, metal7440-22-41.08589199.9900000.232060
Subtotal1.086000100.00000000.232083
Die EncapsulantDie EncapsulantEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-210.4310003.0000002.229149
Epoxy ResinsProprietary Material-Other Epoxy resins10.4310003.0000002.229149
Inorganic Silicon compoundsSilica, vitreous60676-86-0304.23750087.50000065.016859
Inorganic Silicon compoundsSilicon dioxide7631-86-910.4310003.0000002.229149
Inorganic compoundsCarbon Black1333-86-41.7385000.5000000.371525
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins10.4310003.0000002.229149
Subtotal347.700000100.000000074.304981
Die SpacerDie SpacerInorganic Silicon compoundsFibrous-glass-wool65997-17-30.00093040.0000000.000199
Inorganic Silicon compoundsSilica, vitreous60676-86-00.00081435.0000000.000174
PolymersPlastic: PI - Polyimide0.00058125.0000000.000124
Subtotal0.002325100.00000000.000497
Epoxy Adhesive 1Epoxy AdhesiveEpoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-50.42000015.0000000.089756
Epoxy ResinsProprietary Material-Other Epoxy resins0.1120004.0000000.023935
Silver and its compoundsSilver, metal7440-22-42.26800081.0000000.484681
Subtotal2.800000100.00000000.598372
Epoxy Adhesive 2Epoxy AdhesiveBoron and its compoundsTetraphenylphosphonium tetraphenylborate15525-15-20.0049270.7100000.001053
Epoxy ResinsBenzaldehyde, 2-hydroxy-, polymer with (chloromethyl)oxirane and phenol120206-26-00.14574021.0000000.031145
Inorganic Silicon compoundsSilicon dioxide7631-86-90.36782053.0000000.078605
Organic Silicon compounds3,16-Dioxa-8,9,10,11-tetrathia-4,15-disilaoctadecane, 4,4,15,15-tetraethoxy-40372-72-30.0015960.2300000.000341
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.0333124.8000000.007119
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.09716014.0000000.020764
PolymersAcrylic acid ester copolymer78506-70-40.0434446.2600000.009284
Subtotal0.694000100.00000000.148311
Post-plating - Lead FreePost-plating - Lead FreeLead and its compoundsLead, metallic lead and lead alloys7439-92-10.0006400.0200000.000137
Tin and its compoundsTin, metal7440-31-53.19936099.9800000.683717
Subtotal3.200000100.00000000.683854
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon, doped4.11600098.0000000.879607
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0840002.0000000.017951
Subtotal4.200000100.00000000.897558
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon, doped0.68600098.0000000.146601
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0140002.0000000.002992
Subtotal0.700000100.00000000.149593
Total467.936325100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 MC33GD3100A3EK
Product content declaration of MC33GD3100A3EK
上次修订 Last Revision (GMT):
Tuesday, 17 September 2024, 12:37:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-铜
Bonding Wire - Cu
焊丝-铜
Bonding Wire - Cu
OOOOOO
铜引线框架,预镀银
Copper Lead-Frame, Pre-Plated Ag
铜合金
Copper Alloy
OOOOOO

镀银
Silver Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
叠芯片间垫片
Die Spacer
叠芯片间垫片
Die Spacer
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 1
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive 2
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
封装后电镀- 无铅
Post-plating - Lead Free
封装后电镀- 无铅
Post-plating - Lead Free
OOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of MC33GD3100A3EKLast Revision (GMT):
Tuesday, 17 September 2024, 12:37:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - CuTest Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Test Report
8 Nov 2023
Copper Lead-Frame, Pre-Plated AgAG PLATINGTest Report
15 Nov 2021Test Report
14 Nov 2022
Test Report
15 Nov 2021Test Report
14 Nov 2022
Test Report
15 Nov 2021Test Report
14 Nov 2022
Test Report
15 Nov 2021Test Report
14 Nov 2022
CDA 194Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Test Report
2 Feb 2024
Die EncapsulantTest Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Test Report
17 Apr 2024
Die SpacerTest Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
Test Report
16 Mar 2023
Epoxy Adhesive 1Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Test Report
6 Feb 2024
Epoxy Adhesive 2Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Post-plating - Lead FreeTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor Die 1Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Semiconductor Die 2Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.