MC08XS6421BEKR2
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| NXP Semiconductors | ||
| Product content declaration of MC08XS6421BEKR2 | Last Revision (GMT): Monday, 04 March 2024, 01:10:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| MC08XS6421BEKR2 | SOT1746-2 | HSOP32 | 467.731824 mg | Yes | No | Yes | Tin (Sn) | Cu alloy | e3 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9340 706 14518 | 2023-11-24 | 13 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | Tianjin, China |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Al | Bonding Wire - Al | Aluminum and its compounds | Aluminum, metal | 7429-90-5 | 12.700020 | 99.990000 | 2.715235 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.001270 | 0.010000 | 0.000272 | |||
| Subtotal | 12.701290 | 100.0000000 | 2.715507 | ||||
| Bonding Wire - CuPd | Bonding Wire - CuPd | Copper and its compounds | Copper, metal | 7440-50-8 | 0.682386 | 98.820000 | 0.145893 |
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.000552 | 0.080000 | 0.000118 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.007596 | 1.100000 | 0.001624 | ||
| Subtotal | 0.690534 | 100.0000000 | 0.147635 | ||||
| Copper Lead-Frame | Copper Alloy | Copper and its compounds | Copper, metal | 7440-50-8 | 108.646806 | 97.291000 | 23.228440 |
| Iron and its compounds | Iron, metal | 7439-89-6 | 2.646626 | 2.370000 | 0.565843 | ||
| Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.018984 | 0.017000 | 0.004059 | ||
| Phosphorus compounds | Phosphorus, elemental (not containing red allotrope) | 7723-14-0 | 0.185375 | 0.166000 | 0.039633 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.033502 | 0.030000 | 0.007163 | ||
| Zinc and its compounds | Zinc, metal | 7440-66-6 | 0.140707 | 0.126000 | 0.030083 | ||
| Subtotal | 111.672000 | 100.0000000 | 23.875220 | ||||
| Silver Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000113 | 0.010000 | 0.000024 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.127887 | 99.990000 | 0.241140 | ||
| Subtotal | 1.128000 | 100.0000000 | 0.241164 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Epichlorohydrin, o-cresol, formaldehyde polymer | 29690-82-2 | 9.980400 | 3.000000 | 2.133787 |
| Epoxy Resins | Proprietary Material-Other Epoxy resins | 9.980400 | 3.000000 | 2.133787 | |||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 291.095000 | 87.500000 | 62.235449 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 9.980400 | 3.000000 | 2.133787 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 1.663400 | 0.500000 | 0.355631 | ||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 9.980400 | 3.000000 | 2.133787 | |||
| Subtotal | 332.680000 | 100.0000000 | 71.126227 | ||||
| Epoxy Adhesive 1 | Epoxy Adhesive | Cyanide compounds | Polymethylene polyphenyl isocyanate (PAPI) | 9016-87-9 | 0.008058 | 0.510000 | 0.001723 |
| Epoxy Resins | Other Non-halogenated Epoxy resins | 0.068825 | 4.356000 | 0.014715 | |||
| Organic Tin compounds - Specific | Dibutyltin dilaurate | 77-58-7 | 0.000537 | 0.034000 | 0.000115 | ||
| Organic compounds | Alkanes, C14-16 | 90622-46-1 | 0.221200 | 14.000000 | 0.047292 | ||
| Polymers | 1,3-Benzenedicarboxylic acid, polymer with 1,4-benzenedicarboxylic acid, 1,4-butanediol and hexanedioic acid | 66027-02-9 | 0.080580 | 5.100000 | 0.017228 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 1.200800 | 76.000000 | 0.256728 | ||
| Subtotal | 1.580000 | 100.0000000 | 0.337801 | ||||
| Epoxy Adhesive 2 | Epoxy Adhesive | Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.985500 | 45.000000 | 0.210698 |
| Non-Halogenated Organic Compounds - Specific | Benzenesulfonic acid, 4-((3-((2-hydroxy-3-(((4-methoxyphenyl)amino)carbonyl)-1-naphthalenyl)azo)-4-methylbenzoyl)amino)-, calcium sa | 43035-18-3 | 0.000219 | 0.010000 | 0.000047 | ||
| Organic Silicon compounds | Dimethyl silicone polymer with silica | 67762-90-7 | 0.109500 | 5.000000 | 0.023411 | ||
| Polymers | Plastic: EP - Epoxide, Epoxy | 1.094781 | 49.990000 | 0.234062 | |||
| Subtotal | 2.190000 | 100.0000000 | 0.468217 | ||||
| Post-plating - Lead Free | Post-plating - Lead Free | Lead and its compounds | Lead, metallic lead and lead alloys | 7439-92-1 | 0.000200 | 0.020000 | 0.000043 |
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.999800 | 99.980000 | 0.213755 | ||
| Subtotal | 1.000000 | 100.0000000 | 0.213798 | ||||
| Semiconductor Die 1 | Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 2.135469 | 98.000000 | 0.456558 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.043581 | 2.000000 | 0.009317 | |||
| Subtotal | 2.179050 | 100.0000000 | 0.465876 | ||||
| Glass | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000110 | 1.000000 | 0.000023 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000876 | 8.000000 | 0.000187 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.000329 | 3.000000 | 0.000070 | ||
| Lead and its compounds | Lead monooxide | 1317-36-8 | 0.005858 | 53.500000 | 0.001252 | ||
| Lead and its compounds | Lead titanium oxide (PbTiO3) | 12060-00-3 | 0.003778 | 34.500000 | 0.000808 | ||
| Subtotal | 0.010950 | 100.0000000 | 0.002341 | ||||
| Semiconductor Die 2 | Semiconductor Die | Inorganic Silicon compounds | Silicon, doped | 1.862000 | 98.000000 | 0.398091 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.038000 | 2.000000 | 0.008124 | |||
| Subtotal | 1.900000 | 100.0000000 | 0.406216 | ||||
| Total | 467.731824 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 MC08XS6421BEKR2 Product content declaration of MC08XS6421BEKR2 | 上次修订 Last Revision (GMT): Monday, 04 March 2024, 01:10:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-铝 Bonding Wire - Al | 焊丝-铝 Bonding Wire - Al | O | O | O | O | O | O |
| 焊丝-铜钯 Bonding Wire - CuPd | 焊丝-铜钯 Bonding Wire - CuPd | O | O | O | O | O | O |
| 铜引线框架 Copper Lead-Frame | 铜合金 Copper Alloy | O | O | O | O | O | O |
| | 镀银 Silver Plating | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 1 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive 2 | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 封装后电镀- 无铅 Post-plating - Lead Free | 封装后电镀- 无铅 Post-plating - Lead Free | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 1 | 半导体芯片 Die | O | O | O | O | O | O |
| | 玻璃 Glass | X | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 2 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of MC08XS6421BEKR2 | Last Revision (GMT): Monday, 04 March 2024, 01:10:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Al | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | Test Report 18 Sep 2023 | |
| Bonding Wire - CuPd | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | Test Report 15 Sep 2023 | |
| Copper Lead-Frame | AG PLATING | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 | Test Report 7 Nov 2023 |
| CDA 194 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | Test Report 2 Feb 2024 | |
| Die Encapsulant | Test Report 17 Apr 2024 | Test Report 17 Apr 2024 | Test Report 17 Apr 2024 | Test Report 17 Apr 2024 | |
| Epoxy Adhesive 1 | Test Report 22 Jul 2022 | Test Report 22 Jul 2022 | Test Report 22 Jul 2022 | Test Report 22 Jul 2022 | |
| Epoxy Adhesive 2 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | |
| Post-plating - Lead Free | Test Report 29 May 2024 | Test Report 29 May 2024 | Test Report 29 May 2024 | Test Report 29 May 2024 | |
| Semiconductor Die 1 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| Semiconductor Die 2 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | Test Report 2 Aug 2023 | |
| For more information: contact us | |||||
| Note(s): |
|---|
| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |