LX2120SE72232B

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With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of LX2120SE72232BLast Revision (GMT):
Tuesday, 25 June 2024, 12:52:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
LX2120SE72232BSOT1848BGA151720333.271000 mg YesYesYesTin/Silver/Copper (Sn/Ag/Cu)Othere1contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 026 495572023-11-2463 / 168 hours24530 sec.Not ApplicableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Epoxy AdhesiveEpoxy AdhesiveInorganic Silicon compoundsQuartz14808-60-715.62320040.0000000.076836
Organic Silicon compoundsDimethylvinylated and trimethylated silica68988-89-65.85870015.0000000.028813
Organic Silicon compoundsSiloxanes and silicones, di-Me, vinyl group-terminated68083-19-217.57610045.0000000.086440
Subtotal39.058000100.00000000.192089
Heat SpreaderCopper AlloyCopper and its compoundsCopper, metal7440-50-814014.11236099.90000068.922075
Miscellaneous substancesProprietary Material-Other miscellaneous substances.14.0281400.1000000.068991
Subtotal14028.140500100.000000068.991066
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.2208590.1000000.001086
Nickel and its compoundsNickel, metal7440-02-0220.63864199.9000001.085111
Subtotal220.859500100.00000001.086198
Semiconductor DieSemiconductor DieInorganic Silicon compoundsSilicon7440-21-3193.70582098.0000000.952654
Miscellaneous substancesOther miscellaneous substances (less than 10%).3.9531802.0000000.019442
Subtotal197.659000100.00000000.972096
Solder Ball - SAC, Lead FreeSolder Ball - SAC, Lead FreeCopper and its compoundsCopper, metal7440-50-86.3638990.5009000.031298
Silver and its compoundsSilver, metal7440-22-438.1833973.0054000.187788
Tin and its compoundsTin, metal7440-31-51225.94570496.4937006.029260
Subtotal1270.493000100.00000006.248346
SubstrateCopper FoilCopper and its compoundsCopper, metal7440-50-81810.63591899.9900008.904794
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.1810820.0100000.000891
Subtotal1810.817000100.00000008.905685
Solder 1Copper and its compoundsCopper, metal7440-50-80.3075650.5000000.001513
Silver and its compoundsSilver, metal7440-22-41.8453903.0000000.009076
Tin and its compoundsTin, metal7440-31-559.36004596.5000000.291936
Subtotal61.513000100.00000000.302524
Solder 2Copper and its compoundsCopper, metal7440-50-80.0880040.7000000.000433
Tin and its compoundsTin, metal7440-31-512.48399699.3000000.061397
Subtotal12.572000100.00000000.061830
Solder MaskBarium and its compoundsBarium sulfate7727-43-719.83682023.5000000.097558
Inorganic Silicon compoundsSilica, vitreous60676-86-013.08386015.5000000.064347
Miscellaneous substancesProprietary Material-Other miscellaneous substances.4.2206005.0000000.020757
PolymersPlastic: EP - Epoxide, Epoxy47.27072056.0000000.232480
Subtotal84.412000100.00000000.415142
Substrate Build UpEpoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-622.9439005.0000000.112839
Inorganic Silicon compoundsSilicon dioxide7631-86-9298.27070065.0000001.466910
IsocyanatesProprietary Material-Other isocyanate compounds34.4158507.5000000.169259
Miscellaneous substancesProprietary Material-Other miscellaneous substances.11.4719502.5000000.056420
PolymersPlastic: EP - Epoxide, Epoxy91.77560020.0000000.451357
Subtotal458.878000100.00000002.256784
Substrate CoreInorganic Silicon compoundsFibrous-glass-wool65997-17-3804.10512039.0000003.954627
Inorganic Silicon compoundsSilica, vitreous60676-86-0742.25088036.0000003.650425
PolymersPlastic: PI - Polyimide515.45200025.0000002.535018
Subtotal2061.808000100.000000010.140071
Thermally Conductive GelThermally Conductive GelAluminum and its compoundsAluminum, metal7429-90-532.51160072.0000000.159894
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.9031002.0000000.004442
Organic Silicon compoundsProprietary Material-Other siloxanes and silicones3.6124008.0000000.017766
Zinc and its compoundsZinc oxide1314-13-28.12790018.0000000.039973
Subtotal45.155000100.00000000.222075
UnderfillUnderfillAromatic amines and their salts6-methyl-2,4-bis(methylthio)phenylene-1,3-diamine106264-79-30.8799422.0998000.004328
Epoxy Resins1,6-Bis(2,3-epoxypropoxy) naphthalene27610-48-61.4665843.4997000.007213
Epoxy ResinsPhenolic Polymer Resin, Epikote 1559003-36-57.96134418.9981000.039154
Inorganic Silicon compoundsSilica, vitreous60676-86-028.07417066.9932000.138070
Inorganic compoundsCarbon Black1333-86-40.0335250.0800000.000165
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.7709871.8398000.003792
Organic compoundsOther organic compounds.2.6398276.2994000.012983
Phosphorus compoundsTriphenyl phosphine603-35-00.0796210.1900000.000392
Subtotal41.906000100.00000000.206096
Total20333.271000100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 LX2120SE72232B
Product content declaration of LX2120SE72232B
上次修订 Last Revision (GMT):
Tuesday, 25 June 2024, 12:52:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
散热片
Heat Spreader
铜合金
Copper Alloy
OOOOOO

镀镍层
Nickel Plating
OOOOOO
半导体芯片
Semiconductor Die
半导体芯片
Semiconductor Die
OOOOOO
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
焊锡球-铅银铜,无铅
Solder Ball - SAC, Lead Free
OOOOOO
基板
Substrate
铜箔
Copper Foil
OOOOOO

焊料
Solder 1
OOOOOO

焊料
Solder 2
OOOOOO

阻焊层
Solder Mask
OOOOOO

有机底物堆积
Substrate Build Up
OOOOOO

有机基质芯
Substrate Core
OOOOOO
导热凝胶
Thermally Conductive Gel
导热凝胶
Thermally Conductive Gel
OOOOOO
底注
Underfill
底注
Underfill
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of LX2120SE72232BLast Revision (GMT):
Tuesday, 25 June 2024, 12:52:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Epoxy AdhesiveTest Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Test Report
27 Feb 2024
Heat SpreaderCU ALLOYTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
NI PLATINGTest Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Test Report
29 May 2024
Semiconductor DieTest Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Test Report
19 Dec 2023
Solder Ball - SAC, Lead FreeTest Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
Test Report
26 Jan 2024
SubstrateABF-GZ41Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
Test Report
4 Mar 2024
CU FOILTest Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
Test Report
7 Dec 2023
E705GTest Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
Test Report
7 Mar 2024
SOLDER 1Not AvailableNot AvailableNot AvailableNot Available
SOLDER 2Not AvailableNot AvailableNot AvailableNot Available
SR7300GRBTest Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Test Report
13 Dec 2023
Thermally Conductive GelTest Report
31 Jul 2024
Test Report
31 Jul 2024
Test Report
31 Jul 2024
Test Report
31 Jul 2024
UnderfillTest Report
19 Mar 2024
Test Report
19 Mar 2024
Test Report
19 Mar 2024
Test Report
19 Mar 2024
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.