AFSC5G40E38T2

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Product content declaration of AFSC5G40E38T2		Last Revision (GMT): Wednesday, 12 June 2024, 09:31:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G40E38T2	SOT1831	HLLGA27	158.846618 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 096 47528	2023-11-24	5	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.616236	99.990000	0.387944
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000062	0.010000	0.000039
			Subtotal		0.616298	100.0000000	0.387983

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.033680
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006736
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013472
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.080833
			Subtotal		0.214000	100.0000000	0.134721
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005665
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005666
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004406
			Subtotal		0.007000	100.0000000	0.004407
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001007
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.045327
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004029
			Subtotal		0.080000	100.0000000	0.050363
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.012589
			Subtotal		0.020000	100.0000000	0.012591

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.083099
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.013850
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.041550
			Subtotal		0.220000	100.0000000	0.138498
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.005036
			Subtotal		0.008000	100.0000000	0.005036
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004406
			Subtotal		0.007000	100.0000000	0.004407
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000957
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.043060
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003828
			Subtotal		0.076000	100.0000000	0.047845
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.011960
			Subtotal		0.019000	100.0000000	0.011961

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051137	25.000000	0.032193
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010228	5.000000	0.006439
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020455	10.000000	0.012877
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.122729	60.000000	0.077263
			Subtotal		0.204549	100.0000000	0.128772
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008503	99.900000	0.005353
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000005
			Subtotal		0.008512	100.0000000	0.005359
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012755	99.900000	0.008030
			Subtotal		0.012768	100.0000000	0.008038
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002556	2.000000	0.001609
		Copper and its compounds	Copper, metal	7440-50-8	0.115012	90.000000	0.072404
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010223	8.000000	0.006436
			Subtotal		0.127791	100.0000000	0.080449
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000019
		Tin and its compounds	Tin, metal	7440-31-5	0.029761	99.900000	0.018736
			Subtotal		0.029791	100.0000000	0.018755

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.007557
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001511
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003023
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.018136
			Subtotal		0.048015	100.0000000	0.030227
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001257
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001258
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001885
			Subtotal		0.002997	100.0000000	0.001887
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000378
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.016996
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001511
			Subtotal		0.029997	100.0000000	0.018884
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004398
			Subtotal		0.006993	100.0000000	0.004402

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039222
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007844
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015689
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.094133
			Subtotal		0.249213	100.0000000	0.156889
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006598
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006598
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005131
			Subtotal		0.008152	100.0000000	0.005132
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001173
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.052785
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004692
			Subtotal		0.093163	100.0000000	0.058650
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014661
			Subtotal		0.023291	100.0000000	0.014663

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.032424	25.000000	0.020412
		Manganese and its compounds	Manganese oxide	1344-43-0	0.006485	5.000000	0.004083
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.012970	10.000000	0.008165
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.077818	60.000000	0.048989
			Subtotal		0.129697	100.0000000	0.081649
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.005454	99.990000	0.003433
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.005455	100.0000000	0.003434
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.004241	99.990000	0.002671
			Subtotal		0.004242	100.0000000	0.002671
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000970	2.000000	0.000611
		Copper and its compounds	Copper, metal	7440-50-8	0.043636	90.000000	0.027471
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003879	8.000000	0.002442
			Subtotal		0.048485	100.0000000	0.030523
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.012120	99.990000	0.007630
			Subtotal		0.012121	100.0000000	0.007631

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015114
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003023
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006045
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.036273
			Subtotal		0.096030	100.0000000	0.060455
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002513
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002516
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003770
			Subtotal		0.005994	100.0000000	0.003773
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000755
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.033992
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003021
			Subtotal		0.059994	100.0000000	0.037769
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008796
			Subtotal		0.013986	100.0000000	0.008805

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.079134
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	53.576929
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	1.847480
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.307913
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.061583
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	0.800575
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	1.847480
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.061583
			Subtotal		97.822000	100.0000000	61.582677

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.028170	3.000000	0.017734
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.061035	6.500000	0.038424
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.004695	0.500000	0.002956
		Silver and its compounds	Silver, metal	7440-22-4	0.845100	90.000000	0.532023
			Subtotal		0.939000	100.0000000	0.591136

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.082354	40.000000	0.051845
		Boron and its compounds	Boron oxide	1303-86-2	0.020588	10.000000	0.012961
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.102942	50.000000	0.064806
			Subtotal		0.205884	100.0000000	0.129612
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000041	0.100000	0.000026
		Silver and its compounds	Silver, metal	7440-22-4	0.041136	99.900000	0.025897
			Subtotal		0.041177	100.0000000	0.025923
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000009
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013573	99.900000	0.008545
			Subtotal		0.013587	100.0000000	0.008554
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000056	0.100000	0.000035
		Silver and its compounds	Silver, metal	7440-22-4	0.055531	99.900000	0.034959
			Subtotal		0.055587	100.0000000	0.034994
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000782	5.000000	0.000493
		Boron and its compounds	Boron oxide	1303-86-2	0.002347	15.000000	0.001478
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000782	5.000000	0.000493
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010954	70.000000	0.006896
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000782	5.000000	0.000493
			Subtotal		0.015648	100.0000000	0.009851
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000018	0.100000	0.000011
		Tin and its compounds	Tin, metal	7440-31-5	0.018098	99.900000	0.011393
			Subtotal		0.018116	100.0000000	0.011405

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.060000	40.000000	0.037773
		Boron and its compounds	Boron oxide	1303-86-2	0.015000	10.000000	0.009443
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.075001	50.000000	0.047216
			Subtotal		0.150001	100.0000000	0.094431
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000570	5.000000	0.000359
		Boron and its compounds	Boron oxide	1303-86-2	0.001710	15.000000	0.001077
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000570	5.000000	0.000359
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007981	70.000000	0.005024
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000570	5.000000	0.000359
			Subtotal		0.011401	100.0000000	0.007177
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000030	0.100000	0.000019
		Silver and its compounds	Silver, metal	7440-22-4	0.029971	99.900000	0.018868
			Subtotal		0.030001	100.0000000	0.018887
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Nickel and its compounds	Nickel, metal	7440-02-0	0.009889	99.900000	0.006226
			Subtotal		0.009899	100.0000000	0.006232
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000041	0.100000	0.000025
		Silver and its compounds	Silver, metal	7440-22-4	0.040459	99.900000	0.025470
			Subtotal		0.040499	100.0000000	0.025496
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.013186	99.900000	0.008301
			Subtotal		0.013199	100.0000000	0.008309

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023154	96.100000	0.014576
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000061
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000228
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000303
			Subtotal		0.024093	100.0000000	0.015168
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000087
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000008
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000029
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000506
			Subtotal		0.001000	100.0000000	0.000630
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000028
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000001
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000017
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000023
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000560
			Subtotal		0.001000	100.0000000	0.000630
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000105
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000027
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000157
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000341
			Subtotal		0.001000	100.0000000	0.000630
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001729	99.990000	0.001089
			Subtotal		0.001730	100.0000000	0.001089
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000042
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000475
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000106
			Subtotal		0.001000	100.0000000	0.000630
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.510000	0.000046
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000007
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000007
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000257	19.540000	0.000161
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.650000	0.000047
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000015
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.020000	0.000074
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.020000	0.000074
		Silver and its compounds	Silver, metal	7440-22-4	0.000565	43.050000	0.000356
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.810000	0.000023
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000015
			Subtotal		0.001313	100.0000000	0.000826
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000220
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000409
			Subtotal		0.001000	100.0000000	0.000629
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002593	99.990000	0.001633
			Subtotal		0.002594	100.0000000	0.001633

Resistor 2	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.109641	96.100000	0.069023
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000456	0.400000	0.000287
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001711	1.500000	0.001077
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.002282	2.000000	0.001437
			Subtotal		0.114090	100.0000000	0.071824
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000452	13.799000	0.000284
		Boron and its compounds	Boron oxide	1303-86-2	0.000039	1.200000	0.000025
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000151	4.608000	0.000095
		Silver and its compounds	Silver, metal	7440-22-4	0.002631	80.393000	0.001656
			Subtotal		0.003273	100.0000000	0.002060
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000196	4.500000	0.000124
		Boron and its compounds	Boron oxide	1303-86-2	0.000009	0.200000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000118	2.700000	0.000074
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000161	3.700000	0.000102
		Silver and its compounds	Silver, metal	7440-22-4	0.003879	88.900000	0.002442
			Subtotal		0.004364	100.0000000	0.002747
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000724	16.600000	0.000456
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000188	4.300000	0.000118
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.001091	25.000000	0.000687
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.002361	54.100000	0.001486
			Subtotal		0.004364	100.0000000	0.002747
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006545	99.990000	0.004121
			Subtotal		0.006546	100.0000000	0.004121
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000146	6.698000	0.000092
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001647	75.476000	0.001037
		Boron and its compounds	Boron oxide	1303-86-2	0.000023	1.031000	0.000014
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000367	16.795000	0.000231
			Subtotal		0.002182	100.0000000	0.001374
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000300	5.501000	0.000189
		Boron and its compounds	Boron oxide	1303-86-2	0.000049	0.900000	0.000031
		Copper and its compounds	Cupric oxide	1317-38-0	0.000049	0.900000	0.000031
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001074	19.702000	0.000677
		Lead and its compounds	Lead monooxide	1317-36-8	0.000308	5.641000	0.000194
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000098	1.800000	0.000062
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000491	9.001000	0.000309
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000491	9.001000	0.000309
		Silver and its compounds	Silver, metal	7440-22-4	0.002343	42.954000	0.001475
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000153	2.800000	0.000096
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000098	1.800000	0.000062
			Subtotal		0.005454	100.0000000	0.003433
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	34.965000	0.000220
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.035000	0.000409
			Subtotal		0.001000	100.0000000	0.000629
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.008726	99.990000	0.005493
			Subtotal		0.008727	100.0000000	0.005494

Semiconductor Die 1	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.002775	1.020000	0.001747
		Inorganic Silicon compounds	Silicon, doped		0.263919	97.000400	0.166147
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005386	1.979600	0.003391
			Subtotal		0.272080	100.0000000	0.171285

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	5.356993
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.053809
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.029894
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.018833
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.519258
			Subtotal		9.497100	100.0000000	5.978786

Semiconductor Die 3	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.016766	1.020000	0.010555
		Inorganic Silicon compounds	Silicon	7440-21-3	1.594396	97.000400	1.003733
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.032539	1.979600	0.020484
			Subtotal		1.643700	100.0000000	1.034772

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.003763	2.986400	0.002369
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.003425	2.718100	0.002156
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.015688	12.450900	0.009876
		Silver and its compounds	Silver, metal	7440-22-4	0.005425	4.305300	0.003415
		Tin and its compounds	Tin, metal	7440-31-5	0.097699	77.539300	0.061506
			Subtotal		0.126000	100.0000000	0.079322

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007215	0.500000	0.004542
		Silver and its compounds	Silver, metal	7440-22-4	0.043290	3.000000	0.027253
		Tin and its compounds	Tin, metal	7440-31-5	1.392495	96.500000	0.876629
			Subtotal		1.443000	100.0000000	0.908424

Substrate, Pre-plated NiPdAu	Substrate, Pre-plated NiPdAu	Aliphatic Amines	Proprietary Material-Other aliphatic amines		0.060006	0.137000	0.037776
		Barium and its compounds	Barium sulfate	7727-43-7	0.360036	0.822000	0.226656
		Cyanide compounds	Phthalocyanine Blue	57455-37-5	0.011826	0.027000	0.007445
		Gold and its compounds	Gold, metal	7440-57-5	0.010950	0.025000	0.006893
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	12.233340	27.930000	7.701354
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.360036	0.822000	0.226656
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	16.830588	38.426000	10.595497
		Magnesium and its compounds	Talc	14807-96-6	0.060006	0.137000	0.037776
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		3.268794	7.463000	2.057830
		Nickel and its compounds	Nickel, metal	7440-02-0	0.600060	1.370000	0.377761
		Palladium and its compounds	Palladium, metal	7440-05-3	0.010950	0.025000	0.006893
		Polymers	Acrylic acid ester copolymer	78506-70-4	0.180018	0.411000	0.113328
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1)		8.637360	19.720000	5.437547
		Polymers	Plastic: EP - Epoxide, Epoxy		0.360036	0.822000	0.226656
		Polymers	Plastic: MMA-Acrylic Copolymer		0.815994	1.863000	0.513699
			Subtotal		43.800000	100.0000000	27.573769

			Total		158.846618	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G40E38T2 Product content declaration of AFSC5G40E38T2		上次修订 Last Revision (GMT): Wednesday, 12 June 2024, 09:31:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G40E38T2		Last Revision (GMT): Wednesday, 12 June 2024, 09:31:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 1 Jun 2023
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor 1	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 2	1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	ALUMINA SUBSTRATE	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Semiconductor Die 2	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 3		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Flux		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Not Available
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer