AFSC5G37D37T2

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Product content declaration of AFSC5G37D37T2Last Revision (GMT):
Monday, 16 September 2024, 04:35:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
AFSC5G37D37T2SOT1831HLLGA27182.145880 mg YesNoYesNot ApplicableOtherNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 777 675282023-11-2412Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.39754099.9900000.218254
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000400.0100000.000022
Subtotal0.397580100.00000000.218276
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02334125.0000000.012814
Manganese and its compoundsManganese oxide1344-43-00.0046685.0000000.002563
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00933610.0000000.005126
Zirconium and its compoundsZirconium oxide1314-23-40.05601760.0000000.030754
Subtotal0.093363100.00000000.051257
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00388199.9000000.002131
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000002
Subtotal0.003885100.00000000.002133
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000003
Nickel and its compoundsNickel, metal7440-02-00.00582299.9000000.003196
Subtotal0.005828100.00000000.003199
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0011672.0000000.000640
Copper and its compoundsCopper, metal7440-50-80.05249590.0000000.028820
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0046668.0000000.002562
Subtotal0.058327100.00000000.032022
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000008
Tin and its compoundsTin, metal7440-31-50.01358499.9000000.007458
Subtotal0.013598100.00000000.007465
Capacitor 2CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.006590
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001318
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.002636
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.015816
Subtotal0.048015100.00000000.026361
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001096
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001998100.00000000.001097
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.001644
Subtotal0.002997100.00000000.001645
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000329
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.014822
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001318
Subtotal0.029997100.00000000.016469
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000004
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.003835
Subtotal0.006993100.00000000.003839
Capacitor 3CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.006590
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001318
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.002636
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.015816
Subtotal0.048015100.00000000.026361
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001096
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001998100.00000000.001097
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.001644
Subtotal0.002997100.00000000.001645
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000329
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.014822
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001318
Subtotal0.029997100.00000000.016469
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000004
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.003835
Subtotal0.006993100.00000000.003839
Capacitor 4CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01459125.0000000.008011
Manganese and its compoundsManganese oxide1344-43-00.0029185.0000000.001602
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00583610.0000000.003204
Zirconium and its compoundsZirconium oxide1314-23-40.03501860.0000000.019225
Subtotal0.058364100.00000000.032042
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00245499.9900000.001347
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.002455100.00000000.001348
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00190899.9900000.001048
Subtotal0.001909100.00000000.001048
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0004362.0000000.000240
Copper and its compoundsCopper, metal7440-50-80.01963690.0000000.010781
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0017468.0000000.000958
Subtotal0.021818100.00000000.011978
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00545499.9900000.002994
Subtotal0.005455100.00000000.002995
Capacitor 5CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01459125.0000000.008011
Manganese and its compoundsManganese oxide1344-43-00.0029185.0000000.001602
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00583610.0000000.003204
Zirconium and its compoundsZirconium oxide1314-23-40.03501860.0000000.019225
Subtotal0.058364100.00000000.032042
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00245499.9900000.001347
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Subtotal0.002455100.00000000.001348
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00190899.9900000.001048
Subtotal0.001909100.00000000.001048
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0004362.0000000.000240
Copper and its compoundsCopper, metal7440-50-80.01963690.0000000.010781
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0017468.0000000.000958
Subtotal0.021818100.00000000.011978
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00545499.9900000.002994
Subtotal0.005455100.00000000.002995
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins5.7106005.0000003.135179
Inorganic Silicon compoundsSilica, vitreous60676-86-099.36444087.00000054.552121
Inorganic Silicon compoundsSilicon dioxide7631-86-93.4263603.0000001.881108
Inorganic compoundsCarbon Black1333-86-40.5710600.5000000.313518
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.1142120.1000000.062704
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.4847561.3000000.815147
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins3.4263603.0000001.881108
Zinc and its compoundsProprietary Material-Other zinc compounds0.1142120.1000000.062704
Subtotal114.212000100.000000062.703587
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0318363.0612000.017479
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0318363.0612000.017479
Silver and its compoundsSilver, metal7440-22-40.97632793.8776000.536014
Subtotal1.040000100.00000000.570971
Inductor 1CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.01882440.0000000.010334
Boron and its compoundsBoron oxide1303-86-20.00470610.0000000.002584
Inorganic Silicon compoundsSilicon dioxide7631-86-90.02353050.0000000.012918
Subtotal0.047059100.00000000.025836
GlassAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0001795.0000000.000098
Boron and its compoundsBoron oxide1303-86-20.00053615.0000000.000295
Cobalt and its compoundsCobalt oxide1307-96-60.0001795.0000000.000098
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00250470.0000000.001375
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0001795.0000000.000098
Subtotal0.003577100.00000000.001964
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000090.1000000.000005
Silver and its compoundsSilver, metal7440-22-40.00940399.9000000.005162
Subtotal0.009412100.00000000.005167
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00310299.9000000.001703
Subtotal0.003106100.00000000.001705
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000130.1000000.000007
Silver and its compoundsSilver, metal7440-22-40.01269399.9000000.006968
Subtotal0.012706100.00000000.006975
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000040.1000000.000002
Tin and its compoundsTin, metal7440-31-50.00413799.9000000.002271
Subtotal0.004141100.00000000.002273
Inductor 2CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03529440.0000000.019377
Boron and its compoundsBoron oxide1303-86-20.00882310.0000000.004844
Inorganic Silicon compoundsQuartz14808-60-70.04411750.0000000.024221
Subtotal0.088234100.00000000.048442
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01764699.9900000.009688
Subtotal0.017647100.00000000.009689
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00582299.9900000.003197
Subtotal0.005823100.00000000.003197
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.02382199.9900000.013078
Subtotal0.023823100.00000000.013079
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0003355.0000000.000184
Boron and its compoundsBoron oxide1303-86-20.00100615.0000000.000552
Cobalt and its compoundsCobalt oxide1307-96-60.0003355.0000000.000184
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00469670.0000000.002578
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003355.0000000.000184
Subtotal0.006708100.00000000.003683
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00776399.9900000.004262
Subtotal0.007764100.00000000.004262
Inductor 3CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.03529440.0000000.019377
Boron and its compoundsBoron oxide1303-86-20.00882310.0000000.004844
Inorganic Silicon compoundsQuartz14808-60-70.04411750.0000000.024221
Subtotal0.088234100.00000000.048442
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01764699.9900000.009688
Subtotal0.017647100.00000000.009689
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00582299.9900000.003197
Subtotal0.005823100.00000000.003197
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.02382199.9900000.013078
Subtotal0.023823100.00000000.013079
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0003355.0000000.000184
Boron and its compoundsBoron oxide1303-86-20.00100615.0000000.000552
Cobalt and its compoundsCobalt oxide1307-96-60.0003355.0000000.000184
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00469670.0000000.002578
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0003355.0000000.000184
Subtotal0.006708100.00000000.003683
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00776399.9900000.004262
Subtotal0.007764100.00000000.004262
Inductor 4InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04340024.8000000.023827
Boron and its compoundsBoron oxide1303-86-20.0119006.8000000.006533
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0007000.4000000.000384
Inorganic Silicon compoundsSilicon dioxide7631-86-90.06160035.2000000.033819
Nickel and its compoundsNickel, metal7440-02-00.0084004.8000000.004612
Silver and its compoundsSilver, metal7440-22-40.03815021.8000000.020945
Tin and its compoundsTin, metal7440-31-50.0108506.2000000.005957
Subtotal0.175000100.00000000.096077
Resistor 1CeramicAluminum and its compoundsAluminum oxide1302-74-50.02315496.1000000.012712
Calcium and its compoundsCalcium monoxide1305-78-80.0000960.4000000.000053
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003611.5000000.000198
Magnesium and its compoundsMagnesium-oxide1309-48-40.0004822.0000000.000264
Subtotal0.024093100.00000000.013227
ConductorBismuth and its compoundsBismuth trioxide1304-76-30.00013813.8000000.000076
Boron and its compoundsBoron oxide1303-86-20.0000121.2000000.000007
Inorganic Silicon compoundsQuartz14808-60-70.0000464.6000000.000025
Silver and its compoundsSilver, metal7440-22-40.00080480.4000000.000441
Subtotal0.001000100.00000000.000549
ElectrodeBismuth and its compoundsBismuth trioxide1304-76-30.0000454.5000000.000025
Boron and its compoundsBoron oxide1303-86-20.0000020.2000000.000001
Inorganic Silicon compoundsQuartz14808-60-70.0000272.7000000.000015
Palladium and its compoundsPalladium, metal7440-05-30.0000373.7000000.000020
Silver and its compoundsSilver, metal7440-22-40.00088988.9000000.000488
Subtotal0.001000100.00000000.000549
InsulationInorganic Silicon compoundsSilica, vitreous60676-86-00.00016616.6000000.000091
Inorganic compoundsProprietary Material - Other inorganic compounds0.0000434.3000000.000024
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00025025.0000000.000137
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.00054154.1000000.000297
Subtotal0.001000100.00000000.000549
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00172999.9900000.000950
Subtotal0.001730100.00000000.000950
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0000676.7000000.000037
Bismuth and its compoundsBismuth trioxide1304-76-30.00075575.5000000.000414
Boron and its compoundsBoron oxide1303-86-20.0000101.0000000.000005
Inorganic Silicon compoundsQuartz14808-60-70.00016816.8000000.000092
Subtotal0.001000100.00000000.000549
Resistive LayerAluminum and its compoundsAluminum oxide1302-74-50.0000725.5100000.000040
Boron and its compoundsBoron oxide1303-86-20.0000120.9000000.000006
Copper and its compoundsCupric oxide1317-38-00.0000120.9000000.000006
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00025719.5400000.000141
Lead and its compoundsLead monooxide1317-36-80.0000745.6500000.000041
Manganese and its compoundsManganese tetraoxide1317-35-70.0000241.8000000.000013
Palladium and its compoundsPalladium, metal7440-05-30.0001189.0200000.000065
Ruthenium and its compoundsRuthenium oxide12036-10-10.0001189.0200000.000065
Silver and its compoundsSilver, metal7440-22-40.00056543.0500000.000310
Tantalum and its compoundsTantalum (V) oxide1314-61-00.0000372.8100000.000020
Zinc and its compoundsZinc oxide1314-13-20.0000241.8000000.000013
Subtotal0.001313100.00000000.000721
TerminationChromium and Chromium III compoundsChromium, metal7440-47-30.00035035.0000000.000192
Nickel and its compoundsNickel, metal7440-02-00.00065065.0000000.000357
Subtotal0.001000100.00000000.000549
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00259399.9900000.001424
Subtotal0.002594100.00000000.001424
Resistor 2Bottom ConductorBismuth and its compoundsBismuth trioxide1304-76-30.00013813.8000000.000076
Boron and its compoundsBoron oxide1303-86-20.0000121.2000000.000007
Inorganic Silicon compoundsQuartz14808-60-70.0000464.6000000.000025
Silver and its compoundsSilver, metal7440-22-40.00080480.4000000.000441
Subtotal0.001000100.00000000.000549
CeramicAluminum and its compoundsAluminum oxide1302-74-50.02315396.1000000.012711
Calcium and its compoundsCalcium monoxide1305-78-80.0000960.4000000.000053
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0003611.5000000.000198
Magnesium and its compoundsMagnesium-oxide1309-48-40.0004822.0000000.000264
Subtotal0.024092100.00000000.013227
ConductorChromium and Chromium III compoundsChromium, metal7440-47-30.00035035.0000000.000192
Nickel and its compoundsNickel, metal7440-02-00.00065065.0000000.000357
Subtotal0.001000100.00000000.000549
InsulationChromium and Chromium III compoundsC.I. Pigment Black 2868186-91-40.0000505.0000000.000028
Epoxy ResinsEpikote 86228064-14-40.00074174.1000000.000407
Inorganic Silicon compoundsSilica, vitreous60676-86-00.00016616.6000000.000091
Inorganic compoundsProprietary Material - Other inorganic compounds0.0000434.3000000.000024
Subtotal0.001000100.00000000.000549
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0000676.7000000.000037
Bismuth and its compoundsBismuth trioxide1304-76-30.00075575.5000000.000414
Boron and its compoundsBoron oxide1303-86-20.0000101.0000000.000005
Inorganic Silicon compoundsQuartz14808-60-70.00016816.8000000.000092
Subtotal0.001000100.00000000.000549
Resistive LayerAluminum and its compoundsAluminum oxide1302-74-50.0000725.5000000.000039
Boron and its compoundsBoron oxide1303-86-20.0000120.9000000.000006
Copper and its compoundsCupric oxide1317-38-00.0000120.9000000.000006
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00025619.5230000.000140
Lead and its compoundsLead monooxide1317-36-80.0000745.6740000.000041
Manganese and its compoundsManganese tetraoxide1317-35-70.0000241.8000000.000013
Palladium and its compoundsPalladium, metal7440-05-30.0001189.0000000.000065
Ruthenium and its compoundsRuthenium oxide12036-10-10.0001189.0000000.000065
Silver and its compoundsSilver, metal7440-22-40.00056443.1030000.000310
Tantalum and its compoundsTantalum (V) oxide1314-61-00.0000372.8000000.000020
Zinc and its compoundsZinc oxide1314-13-20.0000241.8000000.000013
Subtotal0.001310100.00000000.000719
TerminationNickel and its compoundsNickel, metal7440-02-00.00173140.0000000.000950
Tin and its compoundsTin, metal7440-31-50.00259760.0000000.001426
Subtotal0.004328100.00000000.002376
Top ConductorBismuth and its compoundsBismuth trioxide1304-76-30.0000454.5000000.000025
Boron and its compoundsBoron oxide1303-86-20.0000020.2000000.000001
Inorganic Silicon compoundsQuartz14808-60-70.0000272.7000000.000015
Palladium and its compoundsPalladium, metal7440-05-30.0000373.7000000.000020
Silver and its compoundsSilver, metal7440-22-40.00088988.9000000.000488
Subtotal0.001000100.00000000.000549
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-317.01880389.6000009.343502
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.1709480.9000000.093852
Nickel and its compoundsNickel, metal7440-02-00.0949710.5000000.052140
Silver and its compoundsSilver, metal7440-22-40.0598320.3150000.032848
Tin and its compoundsTin, metal7440-31-51.6496468.6850000.905673
Subtotal18.994200100.000000010.428015
Semiconductor Die 2Semiconductor DieGold and its compoundsGold, metal7440-57-50.0027751.0200000.001524
Inorganic Silicon compoundsSilicon, doped0.26391997.0004000.144894
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0053861.9796000.002957
Subtotal0.272080100.00000000.149375
Semiconductor Die 3Semiconductor DieGold and its compoundsGold, metal7440-57-50.0055141.0200000.003027
Inorganic Silicon compoundsSilicon, doped0.52434597.0004000.287871
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0107011.9796000.005875
Subtotal0.540560100.00000000.296773
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0188500.5000000.010349
Silver and its compoundsSilver, metal7440-22-40.1131003.0000000.062093
Tin and its compoundsTin, metal7440-31-53.63805096.5000001.997328
Subtotal3.770000100.00000002.069770
SubstrateSubstrateCopper and its compoundsCopper, metal7440-50-812.52800030.0000006.878004
Epoxy ResinsProprietary Material-Other Epoxy resins12.94560031.0000007.107270
Gold and its compoundsGold, metal7440-57-50.4176001.0000000.229267
Inorganic Silicon compoundsFibrous-glass-wool65997-17-312.52800030.0000006.878004
Miscellaneous substancesOther miscellaneous substances (less than 10%).2.0880005.0000001.146334
Nickel and its compoundsNickel, metal7440-02-01.2528003.0000000.687800
Subtotal41.760000100.000000022.926678
Total182.145880100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 AFSC5G37D37T2
Product content declaration of AFSC5G37D37T2
上次修订 Last Revision (GMT):
Monday, 16 September 2024, 04:35:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
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电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
陶瓷的
Ceramic
OOOOOO

玻璃
Glass
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 4
电感
Inductor
OOOOOO
电阻
Resistor 1
陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

电极
Electrode
OOOOOO

绝缘
Insulation
OOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

终端材料
Termination
OOOOOO

镀锡
Tin Plating
OOOOOO
电阻
Resistor 2
底导体
Bottom Conductor
OOOOOO

陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO

绝缘
Insulation
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

终端材料
Termination
OOOOOO

顶部电导体
Top Conductor
XOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 3
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板
Substrate
基板
Substrate
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of AFSC5G37D37T2Last Revision (GMT):
Monday, 16 September 2024, 04:35:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Test Report
3 Jul 2024
Capacitor 1CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
Capacitor 2CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
Capacitor 3CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 4CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 5CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Epoxy AdhesiveTest Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Inductor 1ELECTRODETest Report
1 Jun 2023
Test Report
1 Jun 2023
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 2ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 3ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 4ELECTRODETest Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
27 Apr 2023
Test Report
27 Apr 2023
Test Report
25 Jun 2021
Test Report
25 Jun 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Resistor 1ALUMINATest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
BOTTOM CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 1ST OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 2ND OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
NI PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
RESISTIVE LAYERTest Report
6 Nov 2020
Test Report
6 Nov 2020
Test Report
6 Nov 2020
Test Report
6 Nov 2020
SN PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
TERMINAL CONDUCTORTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
TOP CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Resistor 2ALUMINATest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
BOTTOM CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 1ST OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
INSULATION - 2ND OVERCOATTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
NI PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
RESISTIVE LAYERTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
SN PLATINGTest Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
Test Report
22 Jul 2020
TERMINAL CONDUCTORTest Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
Test Report
6 Nov 2019
TOP CONDUCTORTest Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Test Report
10 Feb 2020
Semiconductor Die 1AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 2AU BUMPINGNot AvailableNot AvailableNot AvailableNot Available
DIENot AvailableNot AvailableNot AvailableNot Available
Semiconductor Die 3Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Test Report
2 Aug 2023
Solder PasteTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
SubstrateNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.