AFSC5G35E38T2

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Product content declaration of AFSC5G35E38T2		Last Revision (GMT): Wednesday, 12 June 2024, 09:07:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G35E38T2	SOT1831	HLLGA27	159.155578 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 089 76528	2023-11-24	4	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.361307
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000036
			Subtotal		0.575098	100.0000000	0.361343

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.033615
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006723
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013446
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.080676
			Subtotal		0.214000	100.0000000	0.134460
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005654
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005655
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004398
			Subtotal		0.007000	100.0000000	0.004398
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001005
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.045239
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004021
			Subtotal		0.080000	100.0000000	0.050265
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.012565
			Subtotal		0.020000	100.0000000	0.012566

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.082938
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.013823
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.041469
			Subtotal		0.220000	100.0000000	0.138229
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.005026
			Subtotal		0.008000	100.0000000	0.005027
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004398
			Subtotal		0.007000	100.0000000	0.004398
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000955
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.042977
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003820
			Subtotal		0.076000	100.0000000	0.047752
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.011937
			Subtotal		0.019000	100.0000000	0.011938

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.102512	25.000000	0.064410
		Manganese and its compounds	Manganese oxide	1344-43-0	0.020502	5.000000	0.012882
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.041005	10.000000	0.025764
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.246029	60.000000	0.154584
			Subtotal		0.410048	100.0000000	0.257640
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017046	99.900000	0.010710
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000017	0.100000	0.000011
			Subtotal		0.017063	100.0000000	0.010721
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000026	0.100000	0.000016
		Nickel and its compounds	Nickel, metal	7440-02-0	0.025569	99.900000	0.016065
			Subtotal		0.025594	100.0000000	0.016081
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.005123	2.000000	0.003219
		Copper and its compounds	Copper, metal	7440-50-8	0.230557	90.000000	0.144863
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.020494	8.000000	0.012877
			Subtotal		0.256174	100.0000000	0.160959
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000060	0.100000	0.000037
		Tin and its compounds	Tin, metal	7440-31-5	0.059660	99.900000	0.037486
			Subtotal		0.059720	100.0000000	0.037523

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015084
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003017
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006034
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.036202
			Subtotal		0.096030	100.0000000	0.060337
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002508
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002511
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003762
			Subtotal		0.005994	100.0000000	0.003766
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000754
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.033926
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003016
			Subtotal		0.059994	100.0000000	0.037695
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008779
			Subtotal		0.013986	100.0000000	0.008788

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015084
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003017
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006034
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.036202
			Subtotal		0.096030	100.0000000	0.060337
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002508
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002511
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003762
			Subtotal		0.005994	100.0000000	0.003766
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000754
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.033926
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003016
			Subtotal		0.059994	100.0000000	0.037695
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.008779
			Subtotal		0.013986	100.0000000	0.008788

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039146
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007829
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015658
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.093951
			Subtotal		0.249213	100.0000000	0.156584
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006585
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006585
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005121
			Subtotal		0.008152	100.0000000	0.005122
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001171
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.052683
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004683
			Subtotal		0.093163	100.0000000	0.058536
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014633
			Subtotal		0.023291	100.0000000	0.014634

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039146
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007829
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015658
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.093951
			Subtotal		0.249213	100.0000000	0.156584
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006585
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006585
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005121
			Subtotal		0.008152	100.0000000	0.005122
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001171
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.052683
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004683
			Subtotal		0.093163	100.0000000	0.058536
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014633
			Subtotal		0.023291	100.0000000	0.014634

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.073157
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	53.472923
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	1.843894
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.307316
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.061463
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	0.799021
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	1.843894
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.061463
			Subtotal		97.822000	100.0000000	61.463130

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.028170	3.000000	0.017700
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.061035	6.500000	0.038349
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.004695	0.500000	0.002950
		Silver and its compounds	Silver, metal	7440-22-4	0.845100	90.000000	0.530990
			Subtotal		0.939000	100.0000000	0.589989

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.018824	40.000000	0.011827
		Boron and its compounds	Boron oxide	1303-86-2	0.004706	10.000000	0.002957
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.023530	50.000000	0.014784
			Subtotal		0.047059	100.0000000	0.029568
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000179	5.000000	0.000112
		Boron and its compounds	Boron oxide	1303-86-2	0.000536	15.000000	0.000337
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000179	5.000000	0.000112
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002504	70.000000	0.001573
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000179	5.000000	0.000112
			Subtotal		0.003577	100.0000000	0.002247
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.009403	99.900000	0.005908
			Subtotal		0.009412	100.0000000	0.005914
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003102	99.900000	0.001949
			Subtotal		0.003106	100.0000000	0.001951
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.012693	99.900000	0.007975
			Subtotal		0.012706	100.0000000	0.007983
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004137	99.900000	0.002599
			Subtotal		0.004141	100.0000000	0.002602

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020000	40.000000	0.012566
		Boron and its compounds	Boron oxide	1303-86-2	0.005000	10.000000	0.003142
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.025000	50.000000	0.015708
			Subtotal		0.050000	100.0000000	0.031416
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000190	5.000000	0.000119
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000358
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000119
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002660	70.000000	0.001672
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000190	5.000000	0.000119
			Subtotal		0.003800	100.0000000	0.002388
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.009990	99.900000	0.006277
			Subtotal		0.010000	100.0000000	0.006283
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003296	99.900000	0.002071
			Subtotal		0.003300	100.0000000	0.002073
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.013486	99.900000	0.008474
			Subtotal		0.013500	100.0000000	0.008482
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004395	99.900000	0.002762
			Subtotal		0.004400	100.0000000	0.002764

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.040000	40.000000	0.025132
		Boron and its compounds	Boron oxide	1303-86-2	0.010000	10.000000	0.006283
		Inorganic Silicon compounds	Quartz	14808-60-7	0.050000	50.000000	0.031415
			Subtotal		0.099999	100.0000000	0.062831
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.019998	99.990000	0.012565
			Subtotal		0.020001	100.0000000	0.012567
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006598	99.990000	0.004146
			Subtotal		0.006599	100.0000000	0.004147
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.026997	99.990000	0.016962
			Subtotal		0.026999	100.0000000	0.016964
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000380	5.000000	0.000239
		Boron and its compounds	Boron oxide	1303-86-2	0.001140	15.000000	0.000717
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000380	5.000000	0.000239
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005322	70.000000	0.003344
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000380	5.000000	0.000239
			Subtotal		0.007602	100.0000000	0.004777
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.008798	99.990000	0.005528
			Subtotal		0.008799	100.0000000	0.005529

Resistor	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.195841	96.000000	0.123050
		Inorganic Silicon compounds	Quartz	14808-60-7	0.005100	2.500000	0.003204
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003060	1.500000	0.001923
			Subtotal		0.204001	100.0000000	0.128177
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.001501	99.900000	0.000943
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001502	100.0000000	0.000944
	Inner Electrode 1	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000685	6.000000	0.000431
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000057	0.500000	0.000036
		Polymers	Ethyl cellulose	9004-57-3	0.000742	6.500000	0.000466
		Silver and its compounds	Silver, metal	7440-22-4	0.009934	87.000000	0.006242
			Subtotal		0.011418	100.0000000	0.007174
	Inner Electrode 2	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013158	99.900000	0.008267
			Subtotal		0.013171	100.0000000	0.008276
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000011	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.011007	99.900000	0.006916
			Subtotal		0.011018	100.0000000	0.006922
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001942	46.730000	0.001220
		Inorganic compounds	Carbon Black	1333-86-4	0.000272	6.540000	0.000171
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.001942	46.730000	0.001220
			Subtotal		0.004157	100.0000000	0.002612
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002875	56.000000	0.001806
		Lead and its compounds	Lead, metallic lead and lead alloys	7439-92-1	0.000177	3.440000	0.000111
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.002082	40.560000	0.001308
			Subtotal		0.005133	100.0000000	0.003225

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	8.509402	89.600000	5.346593
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.085474	0.900000	0.053705
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047485	0.500000	0.029836
		Silver and its compounds	Silver, metal	7440-22-4	0.029916	0.315000	0.018797
		Tin and its compounds	Tin, metal	7440-31-5	0.824823	8.685000	0.518250
			Subtotal		9.497100	100.0000000	5.967180

Semiconductor Die 2	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.002775	1.020000	0.001744
		Inorganic Silicon compounds	Silicon, doped		0.263919	97.000400	0.165824
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005386	1.979600	0.003384
			Subtotal		0.272080	100.0000000	0.170952

Semiconductor Die 3	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.016766	1.020000	0.010534
		Inorganic Silicon compounds	Silicon	7440-21-3	1.594396	97.000400	1.001784
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.032539	1.979600	0.020445
			Subtotal		1.643700	100.0000000	1.032763

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.000627	2.986400	0.000394
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.000571	2.718100	0.000359
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002615	12.450900	0.001643
		Silver and its compounds	Silver, metal	7440-22-4	0.000904	4.305300	0.000568
		Tin and its compounds	Tin, metal	7440-31-5	0.016283	77.539300	0.010231
			Subtotal		0.021000	100.0000000	0.013195

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007215	0.500000	0.004533
		Silver and its compounds	Silver, metal	7440-22-4	0.043290	3.000000	0.027200
		Tin and its compounds	Tin, metal	7440-31-5	1.392495	96.500000	0.874927
			Subtotal		1.443000	100.0000000	0.906660

Substrate, Pre-plated NiPdAu	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	2.281387	99.900000	1.433432
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002284	0.100000	0.001435
			Subtotal		2.283671	100.0000000	1.434867
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	25.074469	99.900000	15.754691
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.025100	0.100000	0.015770
			Subtotal		25.099569	100.0000000	15.770461
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.228312	99.900000	0.143452
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000228	0.100000	0.000144
			Subtotal		0.228541	100.0000000	0.143596
	Solder Mask	Barium and its compounds	Barium sulfate	7727-43-7	0.276706	19.400000	0.173859
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.142632	10.000000	0.089618
		Magnesium and its compounds	Talc	14807-96-6	0.042790	3.000000	0.026885
		Organic compounds	Other organic compounds.		0.078448	5.500000	0.049290
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.011411	0.800000	0.007169
		Polymers	Plastic: EP - Epoxide, Epoxy		0.176864	12.400000	0.111126
		Polymers	Plastic: PAK		0.697470	48.900000	0.438232
			Subtotal		1.426319	100.0000000	0.896179
	Substrate Prepreg	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	3.542856	24.000000	2.226033
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	6.613332	44.800000	4.155262
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		1.077619	7.300000	0.677085
		Polymers	Plastic: EP - Epoxide, Epoxy		3.528094	23.900000	2.216758
			Subtotal		14.761901	100.0000000	9.275139

			Total		159.155578	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G35E38T2 Product content declaration of AFSC5G35E38T2		上次修订 Last Revision (GMT): Wednesday, 12 June 2024, 09:07:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	内电极 Inner Electrode 1	O	O	O	O	O	O
	内电极 Inner Electrode 2	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	铜箔 Copper Foil	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	基材预浸料 Substrate Prepreg	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G35E38T2		Last Revision (GMT): Wednesday, 12 June 2024, 09:07:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Test Report 1 Jun 2023
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 1 Jun 2023	Test Report 1 Jun 2023	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor	CERAMIC	Not Available	Not Available	Test Report 13 Feb 2020	Not Available
	EXTERNAL ELECTRODE	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019	Test Report 27 Dec 2019	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Not Available	Not Available	Test Report 4 Oct 2020	Test Report 4 Oct 2020
	OVERCOAT	Test Report 27 Aug 2020	Test Report 27 Aug 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE ELECTRODE	Test Report 19 Oct 2020	Test Report 19 Oct 2020	Not Available	Not Available
	SECONDARY ELECTRODE	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
	SUSBTRATE	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Not Available	Test Report 13 Feb 2020
Semiconductor Die 1	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Semiconductor Die 3		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Flux		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Not Available
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu	AU PLATING	Test Report 25 Nov 2022	Test Report 25 Nov 2022	Test Report 25 Nov 2022	Test Report 25 Nov 2022
	AUS SR-1	Test Report 23 Mar 2023	Test Report 23 Mar 2023	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	COPPER FOIL	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Test Report 4 Jan 2024
	CU PLATING	Test Report 2 May 2022	Test Report 2 May 2022	Test Report 2 May 2022	Test Report 2 May 2022
	GHPL-970LF	Test Report 6 Apr 2020	Test Report 6 Apr 2020	Test Report 8 Feb 2023	Test Report 6 Apr 2020
	NI PLATING	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023
	PD PLATING	Test Report 5 Dec 2022	Test Report 5 Dec 2022	Test Report 5 Dec 2022	Test Report 5 Dec 2022
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
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Disclaimer