AFSC5G35D35T2

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Product content declaration of AFSC5G35D35T2		Last Revision (GMT): Sunday, 01 September 2024, 01:26:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G35D35T2	SOT1831	HLLGA27	191.373611 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Gold (Ni/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 631 53528	2023-11-24	9	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.091682	99.990000	0.047907
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000009	0.010000	0.000005
			Subtotal		0.091691	100.0000000	0.047912

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.012545
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002509
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.005018
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.030108
			Subtotal		0.096030	100.0000000	0.050179
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002086
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002088
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003129
			Subtotal		0.005994	100.0000000	0.003132
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000627
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.028214
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002508
			Subtotal		0.059994	100.0000000	0.031349
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.007301
			Subtotal		0.013986	100.0000000	0.007308

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.012545
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002509
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.005018
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.030108
			Subtotal		0.096030	100.0000000	0.050179
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002086
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002088
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003129
			Subtotal		0.005994	100.0000000	0.003132
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000627
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.028214
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002508
			Subtotal		0.059994	100.0000000	0.031349
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.007301
			Subtotal		0.013986	100.0000000	0.007308

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.007624
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.001525
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.003050
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.018298
			Subtotal		0.058364	100.0000000	0.030497
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001283
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001283
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.000997
			Subtotal		0.001909	100.0000000	0.000998
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000228
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.010261
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.000912
			Subtotal		0.021818	100.0000000	0.011401
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.002850
			Subtotal		0.005455	100.0000000	0.002850

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.014591	25.000000	0.007624
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002918	5.000000	0.001525
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.005836	10.000000	0.003050
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.035018	60.000000	0.018298
			Subtotal		0.058364	100.0000000	0.030497
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.002454	99.990000	0.001283
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.002455	100.0000000	0.001283
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001908	99.990000	0.000997
			Subtotal		0.001909	100.0000000	0.000998
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000436	2.000000	0.000228
		Copper and its compounds	Copper, metal	7440-50-8	0.019636	90.000000	0.010261
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001746	8.000000	0.000912
			Subtotal		0.021818	100.0000000	0.011401
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.005454	99.990000	0.002850
			Subtotal		0.005455	100.0000000	0.002850

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.012545
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.002509
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.005018
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.030108
			Subtotal		0.096030	100.0000000	0.050179
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002086
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000002
			Subtotal		0.003996	100.0000000	0.002088
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003129
			Subtotal		0.005994	100.0000000	0.003132
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000627
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.028214
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.002508
			Subtotal		0.059994	100.0000000	0.031349
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.007301
			Subtotal		0.013986	100.0000000	0.007308

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		5.710600	5.000000	2.984006
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	99.364440	87.000000	51.921704
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	3.426360	3.000000	1.790404
		Inorganic compounds	Carbon Black	1333-86-4	0.571060	0.500000	0.298401
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.114212	0.100000	0.059680
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.484756	1.300000	0.775842
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		3.426360	3.000000	1.790404
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.114212	0.100000	0.059680
			Subtotal		114.212000	100.0000000	59.680120

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.031836	3.061200	0.016636
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.031836	3.061200	0.016636
		Silver and its compounds	Silver, metal	7440-22-4	0.976327	93.877600	0.510168
			Subtotal		1.040000	100.0000000	0.543440

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.037647	40.000000	0.019672
		Boron and its compounds	Boron oxide	1303-86-2	0.009412	10.000000	0.004918
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.047059	50.000000	0.024590
			Subtotal		0.094118	100.0000000	0.049180
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000358	5.000000	0.000187
		Boron and its compounds	Boron oxide	1303-86-2	0.001073	15.000000	0.000561
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000358	5.000000	0.000187
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005007	70.000000	0.002617
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000358	5.000000	0.000187
			Subtotal		0.007154	100.0000000	0.003738
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000019	0.100000	0.000010
		Silver and its compounds	Silver, metal	7440-22-4	0.018805	99.900000	0.009826
			Subtotal		0.018824	100.0000000	0.009836
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006205	99.900000	0.003242
			Subtotal		0.006211	100.0000000	0.003246
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000025	0.100000	0.000013
		Silver and its compounds	Silver, metal	7440-22-4	0.025386	99.900000	0.013265
			Subtotal		0.025411	100.0000000	0.013278
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000008	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.008273	99.900000	0.004323
			Subtotal		0.008282	100.0000000	0.004327

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095455	40.000000	0.049879
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.012470
		Inorganic Silicon compounds	Quartz	14808-60-7	0.119318	50.000000	0.062349
			Subtotal		0.238637	100.0000000	0.124697
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000005	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.047725	99.990000	0.024938
			Subtotal		0.047730	100.0000000	0.024941
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006362	99.990000	0.003325
			Subtotal		0.006363	100.0000000	0.003325
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.031815	99.990000	0.016625
			Subtotal		0.031818	100.0000000	0.016626
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000795	5.000000	0.000416
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001247
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000416
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.005819
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000795	5.000000	0.000416
			Subtotal		0.015908	100.0000000	0.008312
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.009543	99.990000	0.004987
			Subtotal		0.009544	100.0000000	0.004987

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020000	40.000000	0.010451
		Boron and its compounds	Boron oxide	1303-86-2	0.005000	10.000000	0.002613
		Inorganic Silicon compounds	Quartz	14808-60-7	0.025000	50.000000	0.013063
			Subtotal		0.050000	100.0000000	0.026127
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Silver and its compounds	Silver, metal	7440-22-4	0.009999	99.990000	0.005225
			Subtotal		0.010000	100.0000000	0.005226
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003299	99.990000	0.001724
			Subtotal		0.003300	100.0000000	0.001724
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.013498	99.990000	0.007053
			Subtotal		0.013500	100.0000000	0.007054
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000190	5.000000	0.000099
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000298
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000099
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002661	70.000000	0.001390
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000190	5.000000	0.000099
			Subtotal		0.003801	100.0000000	0.001986
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004399	99.990000	0.002299
			Subtotal		0.004400	100.0000000	0.002299

Inductor 4	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Silver and its compounds	Silver, metal	7440-22-4	0.009407	99.990000	0.004915
			Subtotal		0.009408	100.0000000	0.004916
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.018822	40.000000	0.009835
		Boron and its compounds	Boron oxide	1303-86-2	0.004706	10.000000	0.002459
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.023528	50.000000	0.012294
			Subtotal		0.047056	100.0000000	0.024589
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003103	99.990000	0.001622
			Subtotal		0.003104	100.0000000	0.001622
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.012711	99.990000	0.006642
			Subtotal		0.012712	100.0000000	0.006642
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000179	5.000000	0.000093
		Boron and its compounds	Boron oxide	1303-86-2	0.000536	15.000000	0.000280
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000179	5.000000	0.000093
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002503	70.000000	0.001308
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000179	5.000000	0.000093
			Subtotal		0.003576	100.0000000	0.001868
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004143	99.990000	0.002165
			Subtotal		0.004144	100.0000000	0.002165

Resistor	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000215	13.800000	0.000112
		Boron and its compounds	Boron oxide	1303-86-2	0.000019	1.200000	0.000010
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000072	4.600000	0.000037
		Silver and its compounds	Silver, metal	7440-22-4	0.001251	80.400000	0.000654
			Subtotal		0.001556	100.0000000	0.000813
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.049173	96.100000	0.025695
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000205	0.400000	0.000107
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000767	1.500000	0.000401
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.001023	2.000000	0.000535
			Subtotal		0.051168	100.0000000	0.026737
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000183
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000340
			Subtotal		0.001000	100.0000000	0.000522
	Insulation	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000087	5.000000	0.000045
		Epoxy Resins	Epikote 862	28064-14-4	0.001282	74.100000	0.000670
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000287	16.600000	0.000150
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000074	4.300000	0.000039
			Subtotal		0.001730	100.0000000	0.000904
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000035
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000394
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000005
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000088
			Subtotal		0.001000	100.0000000	0.000522
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000144	5.500000	0.000075
		Boron and its compounds	Boron oxide	1303-86-2	0.000024	0.900000	0.000012
		Copper and its compounds	Cupric oxide	1317-38-0	0.000024	0.900000	0.000012
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000511	19.523000	0.000267
		Lead and its compounds	Lead monooxide	1317-36-8	0.000149	5.674000	0.000078
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000047	1.800000	0.000025
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000236	9.000000	0.000123
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000236	9.000000	0.000123
		Silver and its compounds	Silver, metal	7440-22-4	0.001129	43.103000	0.000590
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000073	2.800000	0.000038
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000047	1.800000	0.000025
			Subtotal		0.002619	100.0000000	0.001369
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.003463	40.000000	0.001809
		Tin and its compounds	Tin, metal	7440-31-5	0.005194	60.000000	0.002714
			Subtotal		0.008656	100.0000000	0.004523
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000078	4.500000	0.000041
		Boron and its compounds	Boron oxide	1303-86-2	0.000003	0.200000	0.000002
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000047	2.700000	0.000024
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000064	3.700000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.001538	88.900000	0.000804
			Subtotal		0.001730	100.0000000	0.000904

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	25.528205	89.600000	13.339459
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.256422	0.900000	0.133990
		Nickel and its compounds	Nickel, metal	7440-02-0	0.142457	0.500000	0.074439
		Silver and its compounds	Silver, metal	7440-22-4	0.089748	0.315000	0.046897
		Tin and its compounds	Tin, metal	7440-31-5	2.474469	8.685000	1.293004
			Subtotal		28.491300	100.0000000	14.887789

Semiconductor Die 2	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.005550	1.020000	0.002900
		Inorganic Silicon compounds	Silicon	7440-21-3	0.527837	97.000400	0.275815
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010772	1.979600	0.005629
			Subtotal		0.544160	100.0000000	0.284344

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.018850	0.500000	0.009850
		Silver and its compounds	Silver, metal	7440-22-4	0.113100	3.000000	0.059099
		Tin and its compounds	Tin, metal	7440-31-5	3.638050	96.500000	1.901020
			Subtotal		3.770000	100.0000000	1.969969

Substrate, Pre-plated NiAu	Substrate, Pre-plated NiAu	Barium and its compounds	Barium sulfate	7727-43-7	0.761661	1.823900	0.397997
		Copper and its compounds	Copper, metal	7440-50-8	22.569651	54.046100	11.793502
		Epoxy Resins	Other Epoxy resins		2.459664	5.890000	1.285268
		Gold and its compounds	Gold, metal	7440-57-5	0.423739	1.014700	0.221420
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	5.289697	12.666900	2.764068
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	6.347645	15.200300	3.316886
		Nickel and its compounds	Nickel, metal	7440-02-0	3.907943	9.358100	2.042049
			Subtotal		41.760000	100.0000000	21.821190

			Total		191.373611	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G35D35T2 Product content declaration of AFSC5G35D35T2		上次修订 Last Revision (GMT): Sunday, 01 September 2024, 01:26:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，镍金预镀 Substrate, Pre-plated NiAu	基板，镍金预镀 Substrate, Pre-plated NiAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G35D35T2		Last Revision (GMT): Sunday, 01 September 2024, 01:26:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available	Not Available
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 1 Jun 2023	Test Report 1 Jun 2023
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	GLAZE (BC)	Not Available	Not Available	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1	AU BUMPING	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiAu	AUS SR1	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	COPPER FOIL	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023
	E705G SERIES	Test Report 7 Mar 2024	Test Report 16 Mar 2023	Test Report 16 Mar 2023	Test Report 16 Mar 2023
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer