AFSC5G26F38T2

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Product content declaration of AFSC5G26F38T2		Last Revision (GMT): Friday, 07 June 2024, 12:40:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G26F38T2	SOT1831	HLLGA27	151.784208 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 011 29528	2024-07-09	7	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.378854
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000038
			Subtotal		0.575098	100.0000000	0.378892

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015817
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003163
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006327
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.037961
			Subtotal		0.096030	100.0000000	0.063268
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002630
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002633
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003945
			Subtotal		0.005994	100.0000000	0.003949
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000790
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.035573
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003162
			Subtotal		0.059994	100.0000000	0.039526
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.009205
			Subtotal		0.013986	100.0000000	0.009214

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015817
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003163
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006327
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.037961
			Subtotal		0.096030	100.0000000	0.063268
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002630
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002633
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003945
			Subtotal		0.005994	100.0000000	0.003949
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000790
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.035573
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003162
			Subtotal		0.059994	100.0000000	0.039526
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.009205
			Subtotal		0.013986	100.0000000	0.009214

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015817
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003163
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.009603	10.000000	0.006327
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.037961
			Subtotal		0.096030	100.0000000	0.063268
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002630
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002633
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003945
			Subtotal		0.005994	100.0000000	0.003949
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.053995	90.000000	0.035573
		Copper and its compounds	Copper, metal	7440-50-8	0.001200	2.000000	0.000790
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003162
			Subtotal		0.059994	100.0000000	0.039526
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.009205
			Subtotal		0.013986	100.0000000	0.009214

Capacitor 4	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.086966
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.014494
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.043483
			Subtotal		0.220000	100.0000000	0.144943
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.005270
			Subtotal		0.008000	100.0000000	0.005271
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004611
			Subtotal		0.007000	100.0000000	0.004612
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.001001
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.045064
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.004006
			Subtotal		0.076000	100.0000000	0.050071
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.012516
			Subtotal		0.019000	100.0000000	0.012518

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.035247
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.007050
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.014099
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.084594
			Subtotal		0.214000	100.0000000	0.140990
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005929
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005929
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004611
			Subtotal		0.007000	100.0000000	0.004612
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001054
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.047436
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004216
			Subtotal		0.080000	100.0000000	0.052706
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.013175
			Subtotal		0.020000	100.0000000	0.013177

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.035247
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.007050
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.014099
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.084594
			Subtotal		0.214000	100.0000000	0.140990
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005929
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005929
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004611
			Subtotal		0.007000	100.0000000	0.004612
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001054
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.047436
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004216
			Subtotal		0.080000	100.0000000	0.052706
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.013175
			Subtotal		0.020000	100.0000000	0.013177

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.035247
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.007050
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.014099
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.084594
			Subtotal		0.214000	100.0000000	0.140990
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005929
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005929
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004611
			Subtotal		0.007000	100.0000000	0.004612
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001054
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.047436
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004216
			Subtotal		0.080000	100.0000000	0.052706
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.013175
			Subtotal		0.020000	100.0000000	0.013177

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	3.222404
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	56.069825
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	1.933442
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.322240
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.064448
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	0.837825
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	1.933442
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.064448
			Subtotal		97.822000	100.0000000	64.448075

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.028745	3.061200	0.018938
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.028745	3.061200	0.018938
		Silver and its compounds	Silver, metal	7440-22-4	0.881511	93.877600	0.580766
			Subtotal		0.939000	100.0000000	0.618641

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095456	40.000000	0.062889
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.015722
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.119320	50.000000	0.078612
			Subtotal		0.238641	100.0000000	0.157224
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000048	0.100000	0.000031
		Silver and its compounds	Silver, metal	7440-22-4	0.047678	99.900000	0.031412
			Subtotal		0.047726	100.0000000	0.031443
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006357	99.900000	0.004188
			Subtotal		0.006363	100.0000000	0.004192
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000032	0.100000	0.000021
		Silver and its compounds	Silver, metal	7440-22-4	0.031787	99.900000	0.020942
			Subtotal		0.031818	100.0000000	0.020963
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000795	5.000000	0.000524
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001572
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000524
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.007336
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000795	5.000000	0.000524
			Subtotal		0.015908	100.0000000	0.010480
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.009535	99.900000	0.006282
			Subtotal		0.009544	100.0000000	0.006288

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.027128
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.006782
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.033910
			Subtotal		0.102940	100.0000000	0.067820
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.013563
			Subtotal		0.020589	100.0000000	0.013565
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.004475
			Subtotal		0.006794	100.0000000	0.004476
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.018309
			Subtotal		0.027793	100.0000000	0.018311
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000258
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000773
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000258
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.003609
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000258
			Subtotal		0.007826	100.0000000	0.005156
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.005967
			Subtotal		0.009058	100.0000000	0.005968

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.027128
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.006782
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.033910
			Subtotal		0.102940	100.0000000	0.067820
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.013563
			Subtotal		0.020589	100.0000000	0.013565
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.004475
			Subtotal		0.006794	100.0000000	0.004476
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.018309
			Subtotal		0.027793	100.0000000	0.018311
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000258
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.000773
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000258
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.003609
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000258
			Subtotal		0.007826	100.0000000	0.005156
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.005967
			Subtotal		0.009058	100.0000000	0.005968

Inductor 4	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.041173	99.990000	0.027126
			Subtotal		0.041177	100.0000000	0.027129
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.082354	40.000000	0.054257
		Boron and its compounds	Boron oxide	1303-86-2	0.020588	10.000000	0.013564
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.102942	50.000000	0.067821
			Subtotal		0.205884	100.0000000	0.135643
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013586	99.990000	0.008951
			Subtotal		0.013587	100.0000000	0.008951
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.055581	99.990000	0.036619
			Subtotal		0.055587	100.0000000	0.036622
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000782	5.000000	0.000516
		Boron and its compounds	Boron oxide	1303-86-2	0.002347	15.000000	0.001546
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000782	5.000000	0.000516
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010954	70.000000	0.007217
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000782	5.000000	0.000516
			Subtotal		0.015648	100.0000000	0.010310
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018114	99.990000	0.011934
			Subtotal		0.018116	100.0000000	0.011935

Resistor	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.027393	96.000000	0.018047
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000713	2.500000	0.000470
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000428	1.500000	0.000282
			Subtotal		0.028534	100.0000000	0.018799
	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000023	2.350000	0.000016
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000071	7.050000	0.000046
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000006	0.600000	0.000004
		Polymers	Ethyl cellulose	9004-57-3	0.000077	7.650000	0.000050
		Silver and its compounds	Silver, metal	7440-22-4	0.000824	82.350000	0.000543
			Subtotal		0.001000	100.0000000	0.000659
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.000658
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
			Subtotal		0.001000	100.0000000	0.000659
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001658	99.900000	0.001092
			Subtotal		0.001659	100.0000000	0.001093
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000420	42.014200	0.000277
		Inorganic compounds	Carbon Black	1333-86-4	0.000050	5.030500	0.000033
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000109	10.941100	0.000072
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000420	42.014200	0.000277
			Subtotal		0.001000	100.0000000	0.000659
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000380	38.000000	0.000250
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000120	12.000000	0.000079
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000500	50.000000	0.000329
			Subtotal		0.001000	100.0000000	0.000659
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000200	20.000000	0.000132
		Tin and its compounds	Tin, metal	7440-31-5	0.000800	80.000000	0.000527
			Subtotal		0.001000	100.0000000	0.000659
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.001095	99.900000	0.000722
			Subtotal		0.001096	100.0000000	0.000722
	Top Conductor	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.000999	99.900000	0.000658
			Subtotal		0.001000	100.0000000	0.000659

Semiconductor Die 1	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.018205	1.020000	0.011994
		Inorganic Silicon compounds	Silicon, doped		1.731283	97.000400	1.140621
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.035332	1.979600	0.023278
			Subtotal		1.784820	100.0000000	1.175893

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.646848	89.600000	1.084993
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.016542	0.900000	0.010898
		Nickel and its compounds	Nickel, metal	7440-02-0	0.009190	0.500000	0.006055
		Silver and its compounds	Silver, metal	7440-22-4	0.005790	0.315000	0.003814
		Tin and its compounds	Tin, metal	7440-31-5	0.159630	8.685000	0.105169
			Subtotal		1.838000	100.0000000	1.210930

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.015201	2.986400	0.010015
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.013835	2.718100	0.009115
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.063375	12.450900	0.041753
		Silver and its compounds	Silver, metal	7440-22-4	0.021914	4.305300	0.014438
		Tin and its compounds	Tin, metal	7440-31-5	0.394675	77.539300	0.260024
			Subtotal		0.509000	100.0000000	0.335344

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007845	0.500000	0.005169
		Silver and its compounds	Silver, metal	7440-22-4	0.047070	3.000000	0.031011
		Tin and its compounds	Tin, metal	7440-31-5	1.514085	96.500000	0.997525
			Subtotal		1.569000	100.0000000	1.033704

Substrate, Pre-plated NiPdAu	Substrate, Pre-plated NiPdAu	Acrylates	Proprietary Material-Other acrylates		0.815994	1.863000	0.537601
		Aliphatic Amines	Proprietary Material-Other aliphatic amines		0.060006	0.137000	0.039534
		Azo compounds	Other azo-dyes (other than those that can release carcinogenic amines)		0.011826	0.027000	0.007791
		Barium and its compounds	Barium sulfate	7727-43-7	0.360036	0.822000	0.237203
		Cyanide compounds	Phthalocyanine Blue	57455-37-5	0.011826	0.027000	0.007791
		Epoxy Resins	Other Epoxy resins		0.360036	0.822000	0.237203
		Gold and its compounds	Gold, metal	7440-57-5	0.010950	0.025000	0.007214
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	12.233340	27.930000	8.059692
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.360036	0.822000	0.237203
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	16.830588	38.426000	11.088497
		Magnesium and its compounds	Talc	14807-96-6	0.060006	0.137000	0.039534
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		3.256968	7.436000	2.145788
		Nickel and its compounds	Nickel, metal	7440-02-0	0.600060	1.370000	0.395338
		Palladium and its compounds	Palladium, metal	7440-05-3	0.010950	0.025000	0.007214
		Polymers	Acrylic acid ester copolymer	78506-70-4	0.180018	0.411000	0.118601
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1)		8.637360	19.720000	5.690552
			Subtotal		43.800000	100.0000000	28.856757

			Total		151.784208	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G26F38T2 Product content declaration of AFSC5G26F38T2		上次修订 Last Revision (GMT): Friday, 07 June 2024, 12:40:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G26F38T2		Last Revision (GMT): Friday, 07 June 2024, 12:40:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 7	CERAMIC	Test Report 12 Dec 2022	Test Report 12 Dec 2022	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	ELECTRODE (BA)	Not Available	Not Available	Test Report 18 Jul 2020	Test Report 18 Jul 2020
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor	CERAMIC	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	OVERCOAT	Test Report 28 Jul 2020	Test Report 28 Jul 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE LAYER	Test Report 16 Nov 2020	Test Report 16 Nov 2020	Not Available	Not Available
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
Semiconductor Die 1		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Semiconductor Die 2		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Flux		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Not Available
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu	AU PLATING	Test Report 21 Mar 2024	Test Report 21 Mar 2024	Test Report 21 Mar 2024	Test Report 21 Mar 2024
	AUS SR-1	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	COPPER FOIL	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Test Report 4 Jan 2024
	CU PLATING	Test Report 2 May 2022	Test Report 2 May 2022	Test Report 2 May 2022	Test Report 2 May 2022
	GHPL-970LF	Test Report 6 Apr 2020	Test Report 6 Apr 2020	Test Report 8 Feb 2023	Test Report 6 Apr 2020
	NI PLATING	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023
	PD PLATING	Test Report 5 Dec 2022	Test Report 5 Dec 2022	Test Report 5 Dec 2022	Test Report 5 Dec 2022
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Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer