AFSC5G26E39T2

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Product content declaration of AFSC5G26E39T2		Last Revision (GMT): Friday, 08 November 2024, 11:53:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G26E39T2	SOT1831	HLLGA27	109.681958 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Not Applicable	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 007 23528	2023-11-24	7	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575040	99.990000	0.524280
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000052
			Subtotal		0.575098	100.0000000	0.524332

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.023341	25.000000	0.021280
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004668	5.000000	0.004256
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009336	10.000000	0.008512
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.056017	60.000000	0.051073
			Subtotal		0.093363	100.0000000	0.085121
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003881	99.900000	0.003538
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003885	100.0000000	0.003542
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005822	99.900000	0.005308
			Subtotal		0.005828	100.0000000	0.005313
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001167	2.000000	0.001064
		Copper and its compounds	Copper, metal	7440-50-8	0.052495	90.000000	0.047861
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004666	8.000000	0.004254
			Subtotal		0.058327	100.0000000	0.053179
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000012
		Tin and its compounds	Tin, metal	7440-31-5	0.013584	99.900000	0.012385
			Subtotal		0.013598	100.0000000	0.012397

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.010944
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.002189
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.004378
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.026266
			Subtotal		0.048015	100.0000000	0.043777
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001820
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000002
			Subtotal		0.001998	100.0000000	0.001822
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002730
			Subtotal		0.002997	100.0000000	0.002732
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000547
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.024614
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.002188
			Subtotal		0.029997	100.0000000	0.027349
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.006369
			Subtotal		0.006993	100.0000000	0.006376

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.029182	25.000000	0.026606
		Manganese and its compounds	Manganese oxide	1344-43-0	0.005836	5.000000	0.005321
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.011673	10.000000	0.010642
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.070036	60.000000	0.063854
			Subtotal		0.116727	100.0000000	0.106424
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.004908	99.990000	0.004475
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
			Subtotal		0.004909	100.0000000	0.004476
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003817	99.990000	0.003481
			Subtotal		0.003818	100.0000000	0.003481
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000873	2.000000	0.000796
		Copper and its compounds	Copper, metal	7440-50-8	0.039273	90.000000	0.035806
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003491	8.000000	0.003183
			Subtotal		0.043636	100.0000000	0.039785
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.010908	99.990000	0.009945
			Subtotal		0.010909	100.0000000	0.009946

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.048777
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.009756
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.019511
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.117066
			Subtotal		0.214000	100.0000000	0.195110
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.008205
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.008206
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006382
			Subtotal		0.007000	100.0000000	0.006382
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001459
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.065644
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.005835
			Subtotal		0.080000	100.0000000	0.072938
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.018233
			Subtotal		0.020000	100.0000000	0.018235

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.048777
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.009756
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.019511
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.117066
			Subtotal		0.214000	100.0000000	0.195110
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.008205
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.008206
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006382
			Subtotal		0.007000	100.0000000	0.006382
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001459
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.065644
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.005835
			Subtotal		0.080000	100.0000000	0.072938
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.018233
			Subtotal		0.020000	100.0000000	0.018235

Capacitor 6	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.120348
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.020058
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.060174
			Subtotal		0.220000	100.0000000	0.200580
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.007293
			Subtotal		0.008000	100.0000000	0.007294
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006382
			Subtotal		0.007000	100.0000000	0.006382
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.001386
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.062362
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.005543
			Subtotal		0.076000	100.0000000	0.069291
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.017321
			Subtotal		0.019000	100.0000000	0.017323

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.021888
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.004378
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.008755
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.052532
			Subtotal		0.096030	100.0000000	0.087553
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.003640
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000004
			Subtotal		0.003996	100.0000000	0.003643
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.005459
			Subtotal		0.005994	100.0000000	0.005465
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.001094
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.049228
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.004376
			Subtotal		0.059994	100.0000000	0.054698
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000013
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.012739
			Subtotal		0.013986	100.0000000	0.012752

Capacitor 8	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.056803
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.011361
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.022721
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.136328
			Subtotal		0.249213	100.0000000	0.227214
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.009555
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.009556
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.007431
			Subtotal		0.008152	100.0000000	0.007432
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001699
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.076446
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.006795
			Subtotal		0.093163	100.0000000	0.084940
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.021233
			Subtotal		0.023291	100.0000000	0.021235

Capacitor 9	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.056803
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.011361
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.022721
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.136328
			Subtotal		0.249213	100.0000000	0.227214
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.009555
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.009556
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.007431
			Subtotal		0.008152	100.0000000	0.007432
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001699
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.076446
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.006795
			Subtotal		0.093163	100.0000000	0.084940
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.021233
			Subtotal		0.023291	100.0000000	0.021235

Capacitor 10	Capacitor	Boron and its compounds	Boron oxide	1303-86-2	0.004422	0.670000	0.004032
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.070422	10.670000	0.064206
		Copper and its compounds	Copper, metal	7440-50-8	0.247830	37.550000	0.225953
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.017622	2.670000	0.016067
		Manganese and its compounds	Manganese carbonate	598-62-9	0.017622	2.670000	0.016067
		Nickel and its compounds	Nickel, metal	7440-02-0	0.021978	3.330000	0.020038
		Tin and its compounds	Tin, metal	7440-31-5	0.051348	7.780000	0.046815
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.228756	34.660000	0.208563
			Subtotal		0.660000	100.0000000	0.601740

Capacitor 11	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051256	25.000000	0.046732
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010251	5.000000	0.009346
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020502	10.000000	0.018693
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123014	60.000000	0.112156
			Subtotal		0.205024	100.0000000	0.186926
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008523	99.900000	0.007771
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000008
			Subtotal		0.008531	100.0000000	0.007778
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000012
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012784	99.900000	0.011656
			Subtotal		0.012797	100.0000000	0.011668
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.002336
		Copper and its compounds	Copper, metal	7440-50-8	0.115279	90.000000	0.105103
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010247	8.000000	0.009342
			Subtotal		0.128087	100.0000000	0.116780
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000027
		Tin and its compounds	Tin, metal	7440-31-5	0.029830	99.900000	0.027197
			Subtotal		0.029860	100.0000000	0.027224

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		4.891100	5.000000	4.459348
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	85.105140	87.000000	77.592652
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	2.934660	3.000000	2.675609
		Inorganic compounds	Carbon Black	1333-86-4	0.489110	0.500000	0.445935
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.097822	0.100000	0.089187
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.271686	1.300000	1.159430
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		2.934660	3.000000	2.675609
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.097822	0.100000	0.089187
			Subtotal		97.822000	100.0000000	89.186956

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.028745	3.061200	0.026207
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.028745	3.061200	0.026207
		Silver and its compounds	Silver, metal	7440-22-4	0.881511	93.877600	0.803697
			Subtotal		0.939000	100.0000000	0.856112

Inductor 1	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000796	5.000000	0.000726
		Boron and its compounds	Boron oxide	1303-86-2	0.002389	15.000000	0.002178
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000796	5.000000	0.000726
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011147	70.000000	0.010164
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000796	5.000000	0.000726
			Subtotal		0.015925	100.0000000	0.014519
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095438	40.000000	0.087013
		Boron and its compounds	Boron oxide	1303-86-2	0.023859	10.000000	0.021753
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.119298	50.000000	0.108767
			Subtotal		0.238595	100.0000000	0.217533
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000005	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.047735	99.990000	0.043521
			Subtotal		0.047740	100.0000000	0.043526
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006369	99.990000	0.005807
			Subtotal		0.006370	100.0000000	0.005808
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.031812	99.990000	0.029004
			Subtotal		0.031815	100.0000000	0.029007
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009554	99.990000	0.008711
			Subtotal		0.009555	100.0000000	0.008712

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.037541
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.009385
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.046927
			Subtotal		0.102940	100.0000000	0.093853
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.018770
			Subtotal		0.020589	100.0000000	0.018771
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.006193
			Subtotal		0.006794	100.0000000	0.006194
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.025337
			Subtotal		0.027793	100.0000000	0.025340
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000357
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.001070
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000357
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.004995
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000357
			Subtotal		0.007826	100.0000000	0.007135
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.008258
			Subtotal		0.009058	100.0000000	0.008258

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.037541
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.009385
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.046927
			Subtotal		0.102940	100.0000000	0.093853
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.018770
			Subtotal		0.020589	100.0000000	0.018771
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.006193
			Subtotal		0.006794	100.0000000	0.006194
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.025337
			Subtotal		0.027793	100.0000000	0.025340
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.000357
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.001070
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.000357
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.004995
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.000357
			Subtotal		0.007826	100.0000000	0.007135
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.008258
			Subtotal		0.009058	100.0000000	0.008258

Inductor 4	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.082352	40.000000	0.075083
		Boron and its compounds	Boron oxide	1303-86-2	0.020588	10.000000	0.018771
		Inorganic Silicon compounds	Quartz	14808-60-7	0.102940	50.000000	0.093853
			Subtotal		0.205880	100.0000000	0.187707
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.041173	99.990000	0.037539
			Subtotal		0.041177	100.0000000	0.037543
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013586	99.990000	0.012386
			Subtotal		0.013587	100.0000000	0.012388
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.010000	0.000005
		Silver and its compounds	Silver, metal	7440-22-4	0.055581	99.990000	0.050675
			Subtotal		0.055587	100.0000000	0.050680
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000783	5.000000	0.000714
		Boron and its compounds	Boron oxide	1303-86-2	0.002348	15.000000	0.002141
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000783	5.000000	0.000714
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010956	70.000000	0.009989
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000783	5.000000	0.000714
			Subtotal		0.015652	100.0000000	0.014270
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018114	99.990000	0.016515
			Subtotal		0.018116	100.0000000	0.016517

Resistor 1	Alumina Substrate	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.389169	96.000000	0.354816
		Inorganic Silicon compounds	Quartz	14808-60-7	0.008108	2.000000	0.007392
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.008108	2.000000	0.007392
			Subtotal		0.405384	100.0000000	0.369600
	Glass	Lead and its compounds	Frits, chemicals	65997-18-4	0.005182	37.230000	0.004725
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.008737	62.770000	0.007966
			Subtotal		0.013919	100.0000000	0.012691
	Inner Electrode 1	Palladium and its compounds	Palladium, metal	7440-05-3	0.000119	1.500000	0.000108
		Silver and its compounds	Silver, metal	7440-22-4	0.007806	98.500000	0.007117
			Subtotal		0.007925	100.0000000	0.007225
	Inner Electrode 2	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.011480	99.990000	0.010466
			Subtotal		0.011481	100.0000000	0.010467
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.001079	18.000000	0.000984
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.004316	72.000000	0.003935
		Silver and its compounds	Silver, metal	7440-22-4	0.000599	10.000000	0.000547
			Subtotal		0.005994	100.0000000	0.005465
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.041561	65.660000	0.037892
		Tin and its compounds	Tin, metal	7440-31-5	0.021736	34.340000	0.019817
			Subtotal		0.063297	100.0000000	0.057709

Resistor 2	Alumina Substrate	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.191826	96.000000	0.174893
		Inorganic Silicon compounds	Quartz	14808-60-7	0.003996	2.000000	0.003644
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003996	2.000000	0.003644
			Subtotal		0.199819	100.0000000	0.182180
	Glass	Lead and its compounds	Frits, chemicals	65997-18-4	0.002554	37.230000	0.002329
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.004307	62.770000	0.003927
			Subtotal		0.006861	100.0000000	0.006255
	Inner Electrode 1	Palladium and its compounds	Palladium, metal	7440-05-3	0.000059	1.500000	0.000053
		Silver and its compounds	Silver, metal	7440-22-4	0.003848	98.500000	0.003508
			Subtotal		0.003906	100.0000000	0.003561
	Inner Electrode 2	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Silver and its compounds	Silver, metal	7440-22-4	0.005658	99.990000	0.005159
			Subtotal		0.005659	100.0000000	0.005159
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.000532	18.000000	0.000485
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.002127	72.000000	0.001940
		Silver and its compounds	Silver, metal	7440-22-4	0.000296	10.000000	0.000269
			Subtotal		0.002955	100.0000000	0.002694
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.020486	65.660000	0.018677
		Tin and its compounds	Tin, metal	7440-31-5	0.010714	34.340000	0.009768
			Subtotal		0.031200	100.0000000	0.028446

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.529749	98.000000	0.482986
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010811	2.000000	0.009857
			Subtotal		0.540560	100.0000000	0.492843

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.960000	98.000000	1.786985
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.040000	2.000000	0.036469
			Subtotal		2.000000	100.0000000	1.823454

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007845	0.500000	0.007153
		Silver and its compounds	Silver, metal	7440-22-4	0.047070	3.000000	0.042915
		Tin and its compounds	Tin, metal	7440-31-5	1.514085	96.500000	1.380432
			Subtotal		1.569000	100.0000000	1.430500

Substrate	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	0.052783	99.900000	0.048124
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000053	0.100000	0.000048
			Subtotal		0.052836	100.0000000	0.048172
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.570057	99.900000	0.519737
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000571	0.100000	0.000520
			Subtotal		0.570628	100.0000000	0.520257
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.001070	99.900000	0.000975
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
			Subtotal		0.001071	100.0000000	0.000976
	Nickel Plating	Nickel and its compounds	Nickel, metal	7440-02-0	0.038407	93.000000	0.035017
		Phosphorus compounds	Phosphorus, elemental (not containing red allotrope)	7723-14-0	0.002891	7.000000	0.002636
			Subtotal		0.041298	100.0000000	0.037653
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.000027	0.100000	0.000024
		Barium and its compounds	Barium sulfate	7727-43-7	0.005204	19.500000	0.004745
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002642	9.900000	0.002409
		Magnesium and its compounds	Talc	14807-96-6	0.000774	2.900000	0.000706
		Organic compounds	Other organic compounds.		0.001441	5.400000	0.001314
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.000214	0.800000	0.000195
		Polymers	Plastic: EP - Epoxide, Epoxy		0.003309	12.400000	0.003017
		Polymers	Plastic: PAK		0.013077	49.000000	0.011923
			Subtotal		0.026688	100.0000000	0.024332
	Substrate Prepreg	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.073795	24.000000	0.067281
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.137751	44.800000	0.125591
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022446	7.300000	0.020465
		Polymers	Plastic: EP - Epoxide, Epoxy		0.073487	23.900000	0.067001
			Subtotal		0.307479	100.0000000	0.280337

			Total		109.681958	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G26E39T2 Product content declaration of AFSC5G26E39T2		上次修订 Last Revision (GMT): Friday, 08 November 2024, 11:53:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 8	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 9	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 10	电容器 Capacitor	O	O	O	O	O	O
电容器 Capacitor 11	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	玻璃 Glass	X	O	O	O	O	O
	内电极 Inner Electrode 1	O	O	O	O	O	O
	内电极 Inner Electrode 2	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
电阻 Resistor 2	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	玻璃 Glass	X	O	O	O	O	O
	内电极 Inner Electrode 1	O	O	O	O	O	O
	内电极 Inner Electrode 2	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板 Substrate	铜箔 Copper Foil	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	基材预浸料 Substrate Prepreg	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G26E39T2		Last Revision (GMT): Friday, 08 November 2024, 11:53:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 8	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 9	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 10		Not Available	Not Available	Not Available	Not Available
Capacitor 11	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Not Available	Not Available
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Not Available	Not Available
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor 1	CERAMIC SUSBTRATE	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INK	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INNER ELECTRODE 1	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INNER ELECTRODE 2	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	NI TERMINATION	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021
	OVERCOAT	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	PRIMARY GLASS	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	RESISTIVE LAYER	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	SN TERMINATION	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021
Resistor 2	CERAMIC SUSBTRATE	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INK	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INNER ELECTRODE 1	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	INNER ELECTRODE 2	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	NI TERMINATION	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021
	OVERCOAT	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	PRIMARY GLASS	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	RESISTIVE LAYER	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021	Test Report 2 Mar 2021
	SN TERMINATION	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021	Test Report 10 Dec 2021
Semiconductor Die 1	DIE	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Semiconductor Die 2		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer