AFSC5G26D37T2

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Product content declaration of AFSC5G26D37T2		Last Revision (GMT): Wednesday, 28 August 2024, 03:47:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G26D37T2	SOT1831	HLLGA27	120.345438 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Gold (Ni/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 457 36528	2024-01-11	15	3 / 168 hours	260	40 sec.	Not Applicable	Not Applicable	Not Applicable	3	External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.076701	99.990000	0.063734
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.010000	0.000006
			Subtotal		0.076709	100.0000000	0.063741

Capacitor 1	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264092	60.000000	0.219445
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.044015	10.000000	0.036574
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.132046	30.000000	0.109723
			Subtotal		0.440154	100.0000000	0.365742
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015970	99.990000	0.013270
			Subtotal		0.015972	100.0000000	0.013272
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013991	99.990000	0.011625
			Subtotal		0.013992	100.0000000	0.011627
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003039	2.000000	0.002525
		Copper and its compounds	Copper, metal	7440-50-8	0.136739	90.000000	0.113622
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012155	8.000000	0.010100
			Subtotal		0.151932	100.0000000	0.126247
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.037946	99.990000	0.031531
			Subtotal		0.037950	100.0000000	0.031534

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132046	60.000000	0.109723
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022008	10.000000	0.018287
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.066023	30.000000	0.054861
			Subtotal		0.220077	100.0000000	0.182871
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007985	99.990000	0.006635
			Subtotal		0.007986	100.0000000	0.006636
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006995	99.990000	0.005813
			Subtotal		0.006996	100.0000000	0.005813
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001519	2.000000	0.001262
		Copper and its compounds	Copper, metal	7440-50-8	0.068369	90.000000	0.056811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006077	8.000000	0.005050
			Subtotal		0.075966	100.0000000	0.063123
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018973	99.990000	0.015766
			Subtotal		0.018975	100.0000000	0.015767

Capacitor 3	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132046	60.000000	0.109723
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022008	10.000000	0.018287
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.066023	30.000000	0.054861
			Subtotal		0.220077	100.0000000	0.182871
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007985	99.990000	0.006635
			Subtotal		0.007986	100.0000000	0.006636
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006995	99.990000	0.005813
			Subtotal		0.006996	100.0000000	0.005813
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001519	2.000000	0.001262
		Copper and its compounds	Copper, metal	7440-50-8	0.068369	90.000000	0.056811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006077	8.000000	0.005050
			Subtotal		0.075966	100.0000000	0.063123
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018973	99.990000	0.015766
			Subtotal		0.018975	100.0000000	0.015767

Capacitor 4	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264092	60.000000	0.219445
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.044015	10.000000	0.036574
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.132046	30.000000	0.109723
			Subtotal		0.440154	100.0000000	0.365742
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015970	99.990000	0.013270
			Subtotal		0.015972	100.0000000	0.013272
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013991	99.990000	0.011625
			Subtotal		0.013992	100.0000000	0.011627
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003039	2.000000	0.002525
		Copper and its compounds	Copper, metal	7440-50-8	0.136739	90.000000	0.113622
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012155	8.000000	0.010100
			Subtotal		0.151932	100.0000000	0.126247
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.037946	99.990000	0.031531
			Subtotal		0.037950	100.0000000	0.031534

Capacitor 5	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132046	60.000000	0.109723
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022008	10.000000	0.018287
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.066023	30.000000	0.054861
			Subtotal		0.220077	100.0000000	0.182871
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007985	99.990000	0.006635
			Subtotal		0.007986	100.0000000	0.006636
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006995	99.990000	0.005813
			Subtotal		0.006996	100.0000000	0.005813
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001519	2.000000	0.001262
		Copper and its compounds	Copper, metal	7440-50-8	0.068369	90.000000	0.056811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006077	8.000000	0.005050
			Subtotal		0.075966	100.0000000	0.063123
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018973	99.990000	0.015766
			Subtotal		0.018975	100.0000000	0.015767

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.009974
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001995
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003990
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.023939
			Subtotal		0.048015	100.0000000	0.039898
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001659
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000002
			Subtotal		0.001998	100.0000000	0.001660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002488
			Subtotal		0.002997	100.0000000	0.002490
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000499
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.022433
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001994
			Subtotal		0.029997	100.0000000	0.024926
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.005805
			Subtotal		0.006993	100.0000000	0.005811

Capacitor 7	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132046	60.000000	0.109723
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022008	10.000000	0.018287
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.066023	30.000000	0.054861
			Subtotal		0.220077	100.0000000	0.182871
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007985	99.990000	0.006635
			Subtotal		0.007986	100.0000000	0.006636
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006995	99.990000	0.005813
			Subtotal		0.006996	100.0000000	0.005813
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001519	2.000000	0.001262
		Copper and its compounds	Copper, metal	7440-50-8	0.068369	90.000000	0.056811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006077	8.000000	0.005050
			Subtotal		0.075966	100.0000000	0.063123
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018973	99.990000	0.015766
			Subtotal		0.018975	100.0000000	0.015767

Capacitor 8	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264092	60.000000	0.219445
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.044015	10.000000	0.036574
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.132046	30.000000	0.109723
			Subtotal		0.440154	100.0000000	0.365742
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015970	99.990000	0.013270
			Subtotal		0.015972	100.0000000	0.013272
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013991	99.990000	0.011625
			Subtotal		0.013992	100.0000000	0.011627
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003039	2.000000	0.002525
		Copper and its compounds	Copper, metal	7440-50-8	0.136739	90.000000	0.113622
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012155	8.000000	0.010100
			Subtotal		0.151932	100.0000000	0.126247
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.037946	99.990000	0.031531
			Subtotal		0.037950	100.0000000	0.031534

Capacitor 9	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264092	60.000000	0.219445
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.044015	10.000000	0.036574
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.132046	30.000000	0.109723
			Subtotal		0.440154	100.0000000	0.365742
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015970	99.990000	0.013270
			Subtotal		0.015972	100.0000000	0.013272
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013991	99.990000	0.011625
			Subtotal		0.013992	100.0000000	0.011627
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003039	2.000000	0.002525
		Copper and its compounds	Copper, metal	7440-50-8	0.136739	90.000000	0.113622
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012155	8.000000	0.010100
			Subtotal		0.151932	100.0000000	0.126247
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.037946	99.990000	0.031531
			Subtotal		0.037950	100.0000000	0.031534

Capacitor 10	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.009974
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001995
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003990
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.023939
			Subtotal		0.048015	100.0000000	0.039898
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001659
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000002
			Subtotal		0.001998	100.0000000	0.001660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.002488
			Subtotal		0.002997	100.0000000	0.002490
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000499
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.022433
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001994
			Subtotal		0.029997	100.0000000	0.024926
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.005805
			Subtotal		0.006993	100.0000000	0.005811

Capacitor 11	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132046	60.000000	0.109723
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022008	10.000000	0.018287
		Titanium and its compounds	Titanium dioxide	1317-70-0	0.066023	30.000000	0.054861
			Subtotal		0.220077	100.0000000	0.182871
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007985	99.990000	0.006635
			Subtotal		0.007986	100.0000000	0.006636
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006995	99.990000	0.005813
			Subtotal		0.006996	100.0000000	0.005813
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001519	2.000000	0.001262
		Copper and its compounds	Copper, metal	7440-50-8	0.068369	90.000000	0.056811
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006077	8.000000	0.005050
			Subtotal		0.075966	100.0000000	0.063123
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.018973	99.990000	0.015766
			Subtotal		0.018975	100.0000000	0.015767

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		2.855300	5.000000	2.372587
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	49.682220	87.000000	41.283011
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	1.713180	3.000000	1.423552
		Inorganic compounds	Carbon Black	1333-86-4	0.285530	0.500000	0.237259
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.057106	0.100000	0.047452
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.742378	1.300000	0.616873
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		1.713180	3.000000	1.423552
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.057106	0.100000	0.047452
			Subtotal		57.106000	100.0000000	47.451736

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.099826	3.061200	0.082949
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.099826	3.061200	0.082949
		Silver and its compounds	Silver, metal	7440-22-4	3.061349	93.877600	2.543801
			Subtotal		3.261000	100.0000000	2.709700

Inductor 1	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.008959	99.990000	0.007444
			Subtotal		0.008960	100.0000000	0.007445
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.039808	40.000000	0.033078
		Boron and its compounds	Boron oxide	1303-86-2	0.009952	10.000000	0.008270
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.049760	50.000000	0.041348
			Subtotal		0.099520	100.0000000	0.082695
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007679	99.990000	0.006381
			Subtotal		0.007680	100.0000000	0.006382
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000288	1.000000	0.000239
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002592	9.000000	0.002154
		Silver and its compounds	Silver, metal	7440-22-4	0.025920	90.000000	0.021538
			Subtotal		0.028800	100.0000000	0.023931
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000256	5.000000	0.000213
		Boron and its compounds	Boron oxide	1303-86-2	0.000768	15.000000	0.000638
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000256	5.000000	0.000213
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003584	70.000000	0.002978
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000256	5.000000	0.000213
			Subtotal		0.005120	100.0000000	0.004254
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009919	99.990000	0.008242
			Subtotal		0.009920	100.0000000	0.008243

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095455	40.000000	0.079317
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.019829
		Inorganic Silicon compounds	Quartz	14808-60-7	0.119318	50.000000	0.099147
			Subtotal		0.238637	100.0000000	0.198293
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000005	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.047725	99.990000	0.039656
			Subtotal		0.047730	100.0000000	0.039660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006362	99.990000	0.005287
			Subtotal		0.006363	100.0000000	0.005287
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.031815	99.990000	0.026437
			Subtotal		0.031818	100.0000000	0.026439
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000795	5.000000	0.000661
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001983
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000661
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.009253
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000795	5.000000	0.000661
			Subtotal		0.015908	100.0000000	0.013218
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009543	99.990000	0.007930
			Subtotal		0.009544	100.0000000	0.007931

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095455	40.000000	0.079317
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.019829
		Inorganic Silicon compounds	Quartz	14808-60-7	0.119318	50.000000	0.099147
			Subtotal		0.238637	100.0000000	0.198293
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000005	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.047725	99.990000	0.039656
			Subtotal		0.047730	100.0000000	0.039660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006362	99.990000	0.005287
			Subtotal		0.006363	100.0000000	0.005287
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.031815	99.990000	0.026437
			Subtotal		0.031818	100.0000000	0.026439
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000795	5.000000	0.000661
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001983
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000661
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.009253
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000795	5.000000	0.000661
			Subtotal		0.015908	100.0000000	0.013218
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009543	99.990000	0.007930
			Subtotal		0.009544	100.0000000	0.007931

Inductor 4	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095455	40.000000	0.079317
		Boron and its compounds	Boron oxide	1303-86-2	0.023864	10.000000	0.019829
		Inorganic Silicon compounds	Quartz	14808-60-7	0.119318	50.000000	0.099147
			Subtotal		0.238637	100.0000000	0.198293
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000005	0.010000	0.000004
		Silver and its compounds	Silver, metal	7440-22-4	0.047725	99.990000	0.039656
			Subtotal		0.047730	100.0000000	0.039660
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006362	99.990000	0.005287
			Subtotal		0.006363	100.0000000	0.005287
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.031815	99.990000	0.026437
			Subtotal		0.031818	100.0000000	0.026439
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000795	5.000000	0.000661
		Boron and its compounds	Boron oxide	1303-86-2	0.002386	15.000000	0.001983
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000795	5.000000	0.000661
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011135	70.000000	0.009253
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000795	5.000000	0.000661
			Subtotal		0.015908	100.0000000	0.013218
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009543	99.990000	0.007930
			Subtotal		0.009544	100.0000000	0.007931

Resistor	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.023154	96.100000	0.019239
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000096	0.400000	0.000080
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000361	1.500000	0.000300
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000482	2.000000	0.000400
			Subtotal		0.024093	100.0000000	0.020020
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000115
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000010
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000038
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.000668
			Subtotal		0.001000	100.0000000	0.000831
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000037
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000002
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000022
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000031
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.000739
			Subtotal		0.001000	100.0000000	0.000831
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000138
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000036
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000208
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.000449
			Subtotal		0.001000	100.0000000	0.000831
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001729	99.990000	0.001437
			Subtotal		0.001730	100.0000000	0.001437
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000056
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.000627
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000008
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000140
			Subtotal		0.001000	100.0000000	0.000831
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000072	5.510000	0.000060
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	0.900000	0.000010
		Copper and its compounds	Cupric oxide	1317-38-0	0.000012	0.900000	0.000010
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000257	19.540000	0.000213
		Lead and its compounds	Lead monooxide	1317-36-8	0.000074	5.650000	0.000062
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000024	1.800000	0.000020
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000118	9.020000	0.000098
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000118	9.020000	0.000098
		Silver and its compounds	Silver, metal	7440-22-4	0.000565	43.050000	0.000470
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000037	2.810000	0.000031
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000024	1.800000	0.000020
			Subtotal		0.001313	100.0000000	0.001091
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000291
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000540
			Subtotal		0.001000	100.0000000	0.000831
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.002593	99.990000	0.002155
			Subtotal		0.002594	100.0000000	0.002156

Semiconductor Die 1	Semiconductor Die	Gold and its compounds	Gold, metal	7440-57-5	0.055080	1.020000	0.045768
		Inorganic Silicon compounds	Silicon, doped		5.238022	97.000400	4.352489
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.106898	1.979600	0.088826
			Subtotal		5.400000	100.0000000	4.487083

Semiconductor Die 2	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	5.978000	98.000000	4.967367
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.122000	2.000000	0.101375
			Subtotal		6.100000	100.0000000	5.068742

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.004435	0.500000	0.003685
		Silver and its compounds	Silver, metal	7440-22-4	0.026610	3.000000	0.022111
		Tin and its compounds	Tin, metal	7440-31-5	0.855955	96.500000	0.711248
			Subtotal		0.887000	100.0000000	0.737045

Substrate, Pre-plated NiAu	Substrate, Pre-plated NiAu	Barium and its compounds	Barium sulfate	7727-43-7	0.762390	1.823900	0.633502
		Copper and its compounds	Copper, metal	7440-50-8	22.591269	54.046100	18.772020
		Epoxy Resins	Other Epoxy resins		2.462020	5.890000	2.045794
		Gold and its compounds	Gold, metal	7440-57-5	0.424145	1.014700	0.352439
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	5.294764	12.666900	4.399638
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	6.353725	15.200300	5.279573
		Nickel and its compounds	Nickel, metal	7440-02-0	3.911686	9.358100	3.250381
			Subtotal		41.799999	100.0000000	34.733347

			Total		120.345438	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G26D37T2 Product content declaration of AFSC5G26D37T2		上次修订 Last Revision (GMT): Wednesday, 28 August 2024, 03:47:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 8	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 9	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 10	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 11	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，镍金预镀 Substrate, Pre-plated NiAu	基板，镍金预镀 Substrate, Pre-plated NiAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

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本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G26D37T2		Last Revision (GMT): Wednesday, 28 August 2024, 03:47:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 3 Jul 2024	Test Report 3 Jul 2024	Test Report 3 Jul 2024	Test Report 3 Jul 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 8	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 9	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 10	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 11	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available	Not Available
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Resistor	ALUMINA	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	BOTTOM CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 1ST OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	INSULATION - 2ND OVERCOAT	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
	NI PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	RESISTIVE LAYER	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020	Test Report 6 Nov 2020
	SN PLATING	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020	Test Report 22 Jul 2020
	TERMINAL CONDUCTOR	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Semiconductor Die 1		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Semiconductor Die 2		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiAu	AUS SR1	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	COPPER	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023
	E705G	Test Report 7 Mar 2024	Test Report 16 Mar 2023	Test Report 16 Mar 2023	Test Report 16 Mar 2023
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer