AFSC5G23E39T2

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Product content declaration of AFSC5G23E39T2		Last Revision (GMT): Sunday, 01 September 2024, 09:52:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFSC5G23E39T2	SOT1831	HLLGA27	157.895601 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Not Applicable	Other	Not Applicable	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 435 07528	2024-07-01	4	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575044	99.990000	0.364192
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000036
			Subtotal		0.575101	100.0000000	0.364229

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.007602
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001520
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003041
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.018246
			Subtotal		0.048015	100.0000000	0.030409
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001264
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001265
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001896
			Subtotal		0.002997	100.0000000	0.001898
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000380
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.017098
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001520
			Subtotal		0.029997	100.0000000	0.018998
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004424
			Subtotal		0.006993	100.0000000	0.004429

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.033883
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006777
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013553
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.081320
			Subtotal		0.214000	100.0000000	0.135533
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005699
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005700
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004433
			Subtotal		0.007000	100.0000000	0.004433
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001013
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.045600
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004053
			Subtotal		0.080000	100.0000000	0.050666
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.012665
			Subtotal		0.020000	100.0000000	0.012667

Capacitor 3	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	1.278000	60.000000	0.809396
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.213000	10.000000	0.134899
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.639000	30.000000	0.404698
			Subtotal		2.130000	100.0000000	1.348993
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000056	0.010000	0.000035
		Nickel and its compounds	Nickel, metal	7440-02-0	0.557944	99.990000	0.353363
			Subtotal		0.558000	100.0000000	0.353398
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.035996	99.990000	0.022798
			Subtotal		0.036000	100.0000000	0.022800
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.007640	2.000000	0.004839
		Copper and its compounds	Copper, metal	7440-50-8	0.343800	90.000000	0.217739
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.030560	8.000000	0.019355
			Subtotal		0.382000	100.0000000	0.241932
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000009	0.010000	0.000006
		Tin and its compounds	Tin, metal	7440-31-5	0.093991	99.990000	0.059527
			Subtotal		0.094000	100.0000000	0.059533

Capacitor 4	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132000	60.000000	0.083599
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.022000	10.000000	0.013933
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.041800
			Subtotal		0.220000	100.0000000	0.139333
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007999	99.990000	0.005066
			Subtotal		0.008000	100.0000000	0.005067
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004433
			Subtotal		0.007000	100.0000000	0.004433
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000963
		Copper and its compounds	Copper, metal	7440-50-8	0.068400	90.000000	0.043320
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003851
			Subtotal		0.076000	100.0000000	0.048133
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.018998	99.990000	0.012032
			Subtotal		0.019000	100.0000000	0.012033

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.007602
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001520
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003041
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.018246
			Subtotal		0.048015	100.0000000	0.030409
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001264
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001265
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001896
			Subtotal		0.002997	100.0000000	0.001898
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000380
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.017098
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001520
			Subtotal		0.029997	100.0000000	0.018998
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004424
			Subtotal		0.006993	100.0000000	0.004429

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.062303	25.000000	0.039459
		Manganese and its compounds	Manganese oxide	1344-43-0	0.012461	5.000000	0.007892
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.024921	10.000000	0.015783
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.149528	60.000000	0.094700
			Subtotal		0.249213	100.0000000	0.157834
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.010480	99.990000	0.006637
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.010481	100.0000000	0.006638
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008151	99.990000	0.005162
			Subtotal		0.008152	100.0000000	0.005163
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001863	2.000000	0.001180
		Copper and its compounds	Copper, metal	7440-50-8	0.083847	90.000000	0.053103
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007453	8.000000	0.004720
			Subtotal		0.093163	100.0000000	0.059003
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.023289	99.990000	0.014749
			Subtotal		0.023291	100.0000000	0.014751

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.124606	25.000000	0.078917
		Manganese and its compounds	Manganese oxide	1344-43-0	0.024921	5.000000	0.015783
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.049843	10.000000	0.031567
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.299055	60.000000	0.189401
			Subtotal		0.498426	100.0000000	0.315668
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.020960	99.990000	0.013274
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
			Subtotal		0.020962	100.0000000	0.013276
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.016302	99.990000	0.010325
			Subtotal		0.016303	100.0000000	0.010325
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003727	2.000000	0.002360
		Copper and its compounds	Copper, metal	7440-50-8	0.167694	90.000000	0.106206
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.014906	8.000000	0.009440
			Subtotal		0.186327	100.0000000	0.118007
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000005	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.046577	99.990000	0.029499
			Subtotal		0.046582	100.0000000	0.029502

Capacitor 8	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.033883
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006777
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013553
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.081320
			Subtotal		0.214000	100.0000000	0.135533
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005699
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005700
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004433
			Subtotal		0.007000	100.0000000	0.004433
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001013
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.045600
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004053
			Subtotal		0.080000	100.0000000	0.050666
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.012665
			Subtotal		0.020000	100.0000000	0.012667

Capacitor 9	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.102480	25.000000	0.064904
		Manganese and its compounds	Manganese oxide	1344-43-0	0.020496	5.000000	0.012981
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.040992	10.000000	0.025961
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.245952	60.000000	0.155769
			Subtotal		0.409920	100.0000000	0.259615
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.017078	99.990000	0.010816
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
			Subtotal		0.017080	100.0000000	0.010817
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.025617	99.990000	0.016224
			Subtotal		0.025620	100.0000000	0.016226
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.005124	2.000000	0.003245
		Copper and its compounds	Copper, metal	7440-50-8	0.230580	90.000000	0.146033
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.020496	8.000000	0.012981
			Subtotal		0.256200	100.0000000	0.162259
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.010000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.059774	99.990000	0.037857
			Subtotal		0.059780	100.0000000	0.037861

Capacitor 10	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.044000	25.000000	0.027866
		Manganese and its compounds	Manganese oxide	1344-43-0	0.008800	5.000000	0.005573
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.017600	10.000000	0.011147
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.105600	60.000000	0.066880
			Subtotal		0.176000	100.0000000	0.111466
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.007326	99.900000	0.004640
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
			Subtotal		0.007333	100.0000000	0.004644
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000011	0.100000	0.000007
		Nickel and its compounds	Nickel, metal	7440-02-0	0.010989	99.900000	0.006960
			Subtotal		0.011000	100.0000000	0.006967
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002200	2.000000	0.001393
		Copper and its compounds	Copper, metal	7440-50-8	0.099000	90.000000	0.062700
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.008800	8.000000	0.005573
			Subtotal		0.110000	100.0000000	0.069666
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000026	0.100000	0.000016
		Tin and its compounds	Tin, metal	7440-31-5	0.025641	99.900000	0.016239
			Subtotal		0.025667	100.0000000	0.016255

Capacitor 11	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012000	25.000000	0.007600
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002400	5.000000	0.001520
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.004800	10.000000	0.003040
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028800	60.000000	0.018240
			Subtotal		0.048000	100.0000000	0.030400
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001998	99.900000	0.001265
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
			Subtotal		0.002000	100.0000000	0.001267
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002997	99.900000	0.001898
			Subtotal		0.003000	100.0000000	0.001900
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000380
		Copper and its compounds	Copper, metal	7440-50-8	0.027000	90.000000	0.017100
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001520
			Subtotal		0.030000	100.0000000	0.019000
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006993	99.900000	0.004429
			Subtotal		0.007000	100.0000000	0.004433

Die Encapsulant	Die Encapsulant	Epoxy Resins	Tetramethylbiphenyl diglycidyl ether	85954-11-6	8.314870	8.500000	5.266056
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	83.148700	85.000000	52.660555
		Inorganic compounds	Carbon Black	1333-86-4	0.684754	0.700000	0.433675
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		5.673676	5.800000	3.593309
			Subtotal		97.822000	100.0000000	61.953594

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.008571	3.061200	0.005429
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.008571	3.061200	0.005429
		Silver and its compounds	Silver, metal	7440-22-4	0.262857	93.877600	0.166475
			Subtotal		0.280000	100.0000000	0.177332

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.103530	40.000000	0.065569
		Boron and its compounds	Boron oxide	1303-86-2	0.025883	10.000000	0.016392
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.129413	50.000000	0.081961
			Subtotal		0.258826	100.0000000	0.163922
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000984	5.000000	0.000623
		Boron and its compounds	Boron oxide	1303-86-2	0.002951	15.000000	0.001869
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000984	5.000000	0.000623
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.013771	70.000000	0.008721
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000984	5.000000	0.000623
			Subtotal		0.019672	100.0000000	0.012459
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000052	0.100000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.051714	99.900000	0.032752
			Subtotal		0.051766	100.0000000	0.032785
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000017	0.100000	0.000011
		Nickel and its compounds	Nickel, metal	7440-02-0	0.017064	99.900000	0.010807
			Subtotal		0.017081	100.0000000	0.010818
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000070	0.100000	0.000044
		Silver and its compounds	Silver, metal	7440-22-4	0.069811	99.900000	0.044213
			Subtotal		0.069881	100.0000000	0.044258
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000023	0.100000	0.000014
		Tin and its compounds	Tin, metal	7440-31-5	0.022752	99.900000	0.014409
			Subtotal		0.022774	100.0000000	0.014424

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.239958	40.000000	0.151973
		Boron and its compounds	Boron oxide	1303-86-2	0.059990	10.000000	0.037993
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.299948	50.000000	0.189966
			Subtotal		0.599896	100.0000000	0.379932
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.002002	5.000000	0.001268
		Boron and its compounds	Boron oxide	1303-86-2	0.006006	15.000000	0.003804
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.002002	5.000000	0.001268
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.028028	70.000000	0.017751
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002002	5.000000	0.001268
			Subtotal		0.040040	100.0000000	0.025358
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000120	0.100000	0.000076
		Silver and its compounds	Silver, metal	7440-22-4	0.119912	99.900000	0.075944
			Subtotal		0.120032	100.0000000	0.076020
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000016	0.100000	0.000010
		Nickel and its compounds	Nickel, metal	7440-02-0	0.016000	99.900000	0.010133
			Subtotal		0.016016	100.0000000	0.010143
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000080	0.100000	0.000051
		Silver and its compounds	Silver, metal	7440-22-4	0.079912	99.900000	0.050611
			Subtotal		0.079992	100.0000000	0.050661
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000024	0.100000	0.000015
		Tin and its compounds	Tin, metal	7440-31-5	0.024000	99.900000	0.015200
			Subtotal		0.024024	100.0000000	0.015215

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.103530	40.000000	0.065569
		Boron and its compounds	Boron oxide	1303-86-2	0.025883	10.000000	0.016392
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.129413	50.000000	0.081961
			Subtotal		0.258826	100.0000000	0.163922
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000984	5.000000	0.000623
		Boron and its compounds	Boron oxide	1303-86-2	0.002951	15.000000	0.001869
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000984	5.000000	0.000623
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.013771	70.000000	0.008721
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000984	5.000000	0.000623
			Subtotal		0.019672	100.0000000	0.012459
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000052	0.100000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.051714	99.900000	0.032752
			Subtotal		0.051766	100.0000000	0.032785
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000017	0.100000	0.000011
		Nickel and its compounds	Nickel, metal	7440-02-0	0.017064	99.900000	0.010807
			Subtotal		0.017081	100.0000000	0.010818
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000070	0.100000	0.000044
		Silver and its compounds	Silver, metal	7440-22-4	0.069811	99.900000	0.044213
			Subtotal		0.069881	100.0000000	0.044258
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000023	0.100000	0.000014
		Tin and its compounds	Tin, metal	7440-31-5	0.022752	99.900000	0.014409
			Subtotal		0.022774	100.0000000	0.014424

Inductor 4	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.103530	40.000000	0.065569
		Boron and its compounds	Boron oxide	1303-86-2	0.025883	10.000000	0.016392
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.129413	50.000000	0.081961
			Subtotal		0.258826	100.0000000	0.163922
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000984	5.000000	0.000623
		Boron and its compounds	Boron oxide	1303-86-2	0.002951	15.000000	0.001869
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000984	5.000000	0.000623
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.013771	70.000000	0.008721
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000984	5.000000	0.000623
			Subtotal		0.019672	100.0000000	0.012459
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000052	0.100000	0.000033
		Silver and its compounds	Silver, metal	7440-22-4	0.051714	99.900000	0.032752
			Subtotal		0.051766	100.0000000	0.032785
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000017	0.100000	0.000011
		Nickel and its compounds	Nickel, metal	7440-02-0	0.017064	99.900000	0.010807
			Subtotal		0.017081	100.0000000	0.010818
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000070	0.100000	0.000044
		Silver and its compounds	Silver, metal	7440-22-4	0.069811	99.900000	0.044213
			Subtotal		0.069881	100.0000000	0.044258
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000023	0.100000	0.000014
		Tin and its compounds	Tin, metal	7440-31-5	0.022752	99.900000	0.014409
			Subtotal		0.022774	100.0000000	0.014424

Resistor 1	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000117	5.000000	0.000074
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000117	5.000000	0.000074
		Silver and its compounds	Silver, metal	7440-22-4	0.002101	90.000000	0.001331
			Subtotal		0.002335	100.0000000	0.001478
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.112724	96.000000	0.071392
		Inorganic Silicon compounds	Quartz	14808-60-7	0.002936	2.500000	0.001859
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.001761	1.500000	0.001115
			Subtotal		0.117421	100.0000000	0.074366
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000483	15.000000	0.000306
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000048	1.500000	0.000031
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000161	5.000000	0.000102
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000161	5.000000	0.000102
		Silver and its compounds	Silver, metal	7440-22-4	0.002366	73.500000	0.001498
			Subtotal		0.003219	100.0000000	0.002039
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.001086	99.900000	0.000688
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
			Subtotal		0.001087	100.0000000	0.000689
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006330	99.900000	0.004009
			Subtotal		0.006337	100.0000000	0.004013
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.001005	42.000000	0.000636
		Inorganic compounds	Carbon Black	1333-86-4	0.000239	10.000000	0.000151
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.001148	48.000000	0.000727
			Subtotal		0.002393	100.0000000	0.001515
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.001331	45.000000	0.000843
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000296	10.000000	0.000187
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001331	45.000000	0.000843
			Subtotal		0.002958	100.0000000	0.001873
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000249	20.000000	0.000158
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000998	80.000000	0.000632
			Subtotal		0.001247	100.0000000	0.000790
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006330	99.900000	0.004009
			Subtotal		0.006337	100.0000000	0.004013
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000038	2.300000	0.000024
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000010	0.600000	0.000006
		Polymers	Ethyl cellulose	9004-57-3	0.000068	4.100000	0.000043
		Silver and its compounds	Silver, metal	7440-22-4	0.001551	93.000000	0.000982
			Subtotal		0.001667	100.0000000	0.001056

Resistor 2	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000234	5.000000	0.000148
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000234	5.000000	0.000148
		Silver and its compounds	Silver, metal	7440-22-4	0.004202	90.000000	0.002661
			Subtotal		0.004669	100.0000000	0.002957
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.225448	96.000000	0.142783
		Inorganic Silicon compounds	Quartz	14808-60-7	0.005871	2.500000	0.003718
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003523	1.500000	0.002231
			Subtotal		0.234842	100.0000000	0.148732
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000966	15.000000	0.000612
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000097	1.500000	0.000061
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000322	5.000000	0.000204
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000322	5.000000	0.000204
		Silver and its compounds	Silver, metal	7440-22-4	0.004732	73.500000	0.002997
			Subtotal		0.006438	100.0000000	0.004078
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.002173	99.900000	0.001376
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
			Subtotal		0.002175	100.0000000	0.001378
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012660	99.900000	0.008018
			Subtotal		0.012673	100.0000000	0.008026
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.002010	42.000000	0.001273
		Inorganic compounds	Carbon Black	1333-86-4	0.000478	10.000000	0.000303
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.002297	48.000000	0.001455
			Subtotal		0.004785	100.0000000	0.003030
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.002662	45.000000	0.001686
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000592	10.000000	0.000375
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.002662	45.000000	0.001686
			Subtotal		0.005916	100.0000000	0.003747
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000499	20.000000	0.000316
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001995	80.000000	0.001264
			Subtotal		0.002494	100.0000000	0.001579
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000013	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.012660	99.900000	0.008018
			Subtotal		0.012673	100.0000000	0.008026
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000077	2.300000	0.000049
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000020	0.600000	0.000013
		Polymers	Ethyl cellulose	9004-57-3	0.000137	4.100000	0.000087
		Silver and its compounds	Silver, metal	7440-22-4	0.003102	93.000000	0.001964
			Subtotal		0.003335	100.0000000	0.002112

Semiconductor Die 1	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.646848	89.600000	1.042998
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.016542	0.900000	0.010476
		Nickel and its compounds	Nickel, metal	7440-02-0	0.009190	0.500000	0.005820
		Silver and its compounds	Silver, metal	7440-22-4	0.005790	0.315000	0.003667
		Tin and its compounds	Tin, metal	7440-31-5	0.159630	8.685000	0.101099
			Subtotal		1.838000	100.0000000	1.164060

Semiconductor Die 2	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.305850	98.000000	0.827034
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.026650	2.000000	0.016878
			Subtotal		1.332500	100.0000000	0.843912

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	1.305850	98.000000	0.827034
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.026650	2.000000	0.016878
			Subtotal		1.332500	100.0000000	0.843912

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007845	0.500000	0.004968
		Silver and its compounds	Silver, metal	7440-22-4	0.047070	3.000000	0.029811
		Tin and its compounds	Tin, metal	7440-31-5	1.514085	96.500000	0.958915
			Subtotal		1.569000	100.0000000	0.993695

Substrate	Copper Foil	Copper and its compounds	Copper, metal	7440-50-8	2.069668	99.900000	1.310783
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002072	0.100000	0.001312
			Subtotal		2.071740	100.0000000	1.312095
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	18.771410	99.900000	11.888495
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.018790	0.100000	0.011900
			Subtotal		18.790200	100.0000000	11.900395
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.214405	99.900000	0.135789
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000215	0.100000	0.000136
			Subtotal		0.214620	100.0000000	0.135925
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.001441	0.100000	0.000913
		Barium and its compounds	Barium sulfate	7727-43-7	0.280999	19.500000	0.177965
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.142661	9.900000	0.090352
		Magnesium and its compounds	Talc	14807-96-6	0.041790	2.900000	0.026467
		Organic compounds	Other organic compounds.		0.077815	5.400000	0.049283
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.011528	0.800000	0.007301
		Polymers	Plastic: EP - Epoxide, Epoxy		0.178686	12.400000	0.113168
		Polymers	Plastic: PAK		0.706100	49.000000	0.447194
			Subtotal		1.441020	100.0000000	0.912641
	Substrate Prepreg	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	4.894957	23.000000	3.100122
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	9.662219	45.400000	6.119372
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.766441	8.300000	1.118740
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1)		4.958804	23.300000	3.140559
			Subtotal		21.282420	100.0000000	13.478792

			Total		157.895601	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFSC5G23E39T2 Product content declaration of AFSC5G23E39T2		上次修订 Last Revision (GMT): Sunday, 01 September 2024, 09:52:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 8	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 9	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 10	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 11	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 2	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板 Substrate	铜箔 Copper Foil	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	基材预浸料 Substrate Prepreg	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFSC5G23E39T2		Last Revision (GMT): Sunday, 01 September 2024, 09:52:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 4 Jun 2021	Test Report 4 Jun 2021
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 6 Oct 2022	Test Report 6 Oct 2022
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 8	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 9	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 10	CERAMIC	Not Available	Not Available	Not Available	Not Available
	INNER ELECTRODE	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OUTER ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
Capacitor 11	CERAMIC	Not Available	Not Available	Not Available	Not Available
	INNER ELECTRODE	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OUTER ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Resistor 1	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Resistor 2	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 1		Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024	Test Report 18 Jun 2024
Semiconductor Die 2		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Semiconductor Die 3		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer