AFRX5G372T4

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Product content declaration of AFRX5G372T4		Last Revision (GMT): Friday, 08 November 2024, 11:38:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFRX5G372T4	SOT1996	HLFLGA21	103.653099 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 002 38528	2024-07-09	7	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.159583	99.990000	0.153959
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000016	0.010000	0.000015
			Subtotal		0.159599	100.0000000	0.153974

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.038400	40.000000	0.037047
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009600	10.000000	0.009262
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.048000	50.000000	0.046308
			Subtotal		0.096000	100.0000000	0.092617
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003999	99.990000	0.003859
			Subtotal		0.004000	100.0000000	0.003859
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005999	99.990000	0.005788
			Subtotal		0.006000	100.0000000	0.005789
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.001158
		Copper and its compounds	Copper, metal	7440-50-8	0.054000	90.000000	0.052097
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004800	8.000000	0.004631
			Subtotal		0.060000	100.0000000	0.057885
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.013999	99.990000	0.013505
			Subtotal		0.014000	100.0000000	0.013507

Capacitor 2	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264000	60.000000	0.254696
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.044000	10.000000	0.042449
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.132000	30.000000	0.127348
			Subtotal		0.440000	100.0000000	0.424493
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.015998	99.990000	0.015435
			Subtotal		0.016000	100.0000000	0.015436
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013999	99.990000	0.013506
			Subtotal		0.014000	100.0000000	0.013507
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003040	2.000000	0.002933
		Copper and its compounds	Copper, metal	7440-50-8	0.136800	90.000000	0.131979
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012160	8.000000	0.011731
			Subtotal		0.152000	100.0000000	0.146643
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.010000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.037996	99.990000	0.036657
			Subtotal		0.038000	100.0000000	0.036661

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.051615
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.010323
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.020646
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.123875
			Subtotal		0.214000	100.0000000	0.206458
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.008682
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.008683
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.006753
			Subtotal		0.007000	100.0000000	0.006753
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001544
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.069462
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.006174
			Subtotal		0.080000	100.0000000	0.077180
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.019293
			Subtotal		0.020000	100.0000000	0.019295

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.057600	40.000000	0.055570
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.014400	10.000000	0.013893
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.072000	50.000000	0.069462
			Subtotal		0.144000	100.0000000	0.138925
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005999	99.990000	0.005788
			Subtotal		0.006000	100.0000000	0.005789
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008999	99.990000	0.008682
			Subtotal		0.009000	100.0000000	0.008683
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001800	2.000000	0.001737
		Copper and its compounds	Copper, metal	7440-50-8	0.081000	90.000000	0.078145
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007200	8.000000	0.006946
			Subtotal		0.090000	100.0000000	0.086828
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.020998	99.990000	0.020258
			Subtotal		0.021000	100.0000000	0.020260

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		2.974000	5.000000	2.869186
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	51.747600	87.000000	49.923833
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	1.784400	3.000000	1.721512
		Inorganic compounds	Carbon Black	1333-86-4	0.297400	0.500000	0.286919
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.059480	0.100000	0.057384
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.773240	1.300000	0.745988
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		1.784400	3.000000	1.721512
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.059480	0.100000	0.057384
			Subtotal		59.480000	100.0000000	57.383716

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.008602	3.061200	0.008299
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.008602	3.061200	0.008299
		Silver and its compounds	Silver, metal	7440-22-4	0.263796	93.877600	0.254499
			Subtotal		0.281000	100.0000000	0.271097

Inductor 1	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.019598	99.990000	0.018907
			Subtotal		0.019600	100.0000000	0.018909
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.087080	40.000000	0.084011
		Boron and its compounds	Boron oxide	1303-86-2	0.021770	10.000000	0.021003
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.108850	50.000000	0.105014
			Subtotal		0.217700	100.0000000	0.210027
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.016798	99.990000	0.016206
			Subtotal		0.016800	100.0000000	0.016208
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000630	1.000000	0.000608
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005670	9.000000	0.005470
		Silver and its compounds	Silver, metal	7440-22-4	0.056700	90.000000	0.054702
			Subtotal		0.063000	100.0000000	0.060780
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000560	5.000000	0.000540
		Boron and its compounds	Boron oxide	1303-86-2	0.001680	15.000000	0.001621
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000560	5.000000	0.000540
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007840	70.000000	0.007564
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000560	5.000000	0.000540
			Subtotal		0.011200	100.0000000	0.010805
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.021698	99.990000	0.020933
			Subtotal		0.021700	100.0000000	0.020935

Inductor 2	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000796	5.000000	0.000768
		Boron and its compounds	Boron oxide	1303-86-2	0.002389	15.000000	0.002305
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000796	5.000000	0.000768
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.011147	70.000000	0.010755
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000796	5.000000	0.000768
			Subtotal		0.015925	100.0000000	0.015364
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.095438	40.000000	0.092074
		Boron and its compounds	Boron oxide	1303-86-2	0.023859	10.000000	0.023019
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.119298	50.000000	0.115093
			Subtotal		0.238595	100.0000000	0.230186
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000005	0.010000	0.000005
		Silver and its compounds	Silver, metal	7440-22-4	0.047735	99.990000	0.046053
			Subtotal		0.047740	100.0000000	0.046058
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006369	99.990000	0.006145
			Subtotal		0.006370	100.0000000	0.006145
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.031812	99.990000	0.030691
			Subtotal		0.031815	100.0000000	0.030694
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.009554	99.990000	0.009217
			Subtotal		0.009555	100.0000000	0.009218

Inductor 3	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.019598	99.990000	0.018907
			Subtotal		0.019600	100.0000000	0.018909
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.087080	40.000000	0.084011
		Boron and its compounds	Boron oxide	1303-86-2	0.021770	10.000000	0.021003
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.108850	50.000000	0.105014
			Subtotal		0.217700	100.0000000	0.210027
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.016798	99.990000	0.016206
			Subtotal		0.016800	100.0000000	0.016208
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000630	1.000000	0.000608
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005670	9.000000	0.005470
		Silver and its compounds	Silver, metal	7440-22-4	0.056700	90.000000	0.054702
			Subtotal		0.063000	100.0000000	0.060780
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000560	5.000000	0.000540
		Boron and its compounds	Boron oxide	1303-86-2	0.001680	15.000000	0.001621
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000560	5.000000	0.000540
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.007840	70.000000	0.007564
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000560	5.000000	0.000540
			Subtotal		0.011200	100.0000000	0.010805
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.021698	99.990000	0.020933
			Subtotal		0.021700	100.0000000	0.020935

Inductor 4	Ceramic 1	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000398	5.000000	0.000384
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.001152
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.000384
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.005377
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.000384
			Subtotal		0.007963	100.0000000	0.007682
	Ceramic 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.046037
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.011509
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.057547
			Subtotal		0.119298	100.0000000	0.115093
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.023026
			Subtotal		0.023870	100.0000000	0.023029
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.003072
			Subtotal		0.003185	100.0000000	0.003073
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.015345
			Subtotal		0.015908	100.0000000	0.015347
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.004609
			Subtotal		0.004777	100.0000000	0.004609

Inductor 5	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.009799	99.990000	0.009454
			Subtotal		0.009800	100.0000000	0.009455
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.043540	40.000000	0.042006
		Boron and its compounds	Boron oxide	1303-86-2	0.010885	10.000000	0.010501
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.054425	50.000000	0.052507
			Subtotal		0.108850	100.0000000	0.105014
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008399	99.990000	0.008103
			Subtotal		0.008400	100.0000000	0.008104
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000315	1.000000	0.000304
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002835	9.000000	0.002735
		Silver and its compounds	Silver, metal	7440-22-4	0.028350	90.000000	0.027351
			Subtotal		0.031500	100.0000000	0.030390
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000280	5.000000	0.000270
		Boron and its compounds	Boron oxide	1303-86-2	0.000840	15.000000	0.000810
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000280	5.000000	0.000270
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003920	70.000000	0.003782
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000280	5.000000	0.000270
			Subtotal		0.005600	100.0000000	0.005403
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.010849	99.990000	0.010467
			Subtotal		0.010850	100.0000000	0.010468

Resistor 1	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000516	13.800000	0.000498
		Boron and its compounds	Boron oxide	1303-86-2	0.000045	1.200000	0.000043
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000172	4.600000	0.000166
		Silver and its compounds	Silver, metal	7440-22-4	0.003005	80.400000	0.002899
			Subtotal		0.003737	100.0000000	0.003606
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.119641	96.100000	0.115425
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000498	0.400000	0.000480
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001868	1.500000	0.001802
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.002490	2.000000	0.002402
			Subtotal		0.124497	100.0000000	0.120109
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.000338
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.000627
			Subtotal		0.001000	100.0000000	0.000965
	Insulation 1	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000208	5.000000	0.000200
		Epoxy Resins	Epikote 862	28064-14-4	0.003079	74.100000	0.002970
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000690	16.600000	0.000665
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000179	4.300000	0.000172
			Subtotal		0.004154	100.0000000	0.004008
	Insulation 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000140	6.700000	0.000135
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.001574	75.500000	0.001519
		Boron and its compounds	Boron oxide	1303-86-2	0.000021	1.000000	0.000020
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000350	16.800000	0.000338
			Subtotal		0.002085	100.0000000	0.002012
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.008309	40.000000	0.008016
		Tin and its compounds	Tin, metal	7440-31-5	0.012463	60.000000	0.012024
			Subtotal		0.020772	100.0000000	0.020040
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000187	4.500000	0.000180
		Boron and its compounds	Boron oxide	1303-86-2	0.000008	0.200000	0.000008
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000112	2.700000	0.000108
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000154	3.700000	0.000148
		Silver and its compounds	Silver, metal	7440-22-4	0.003693	88.900000	0.003563
			Subtotal		0.004154	100.0000000	0.004008

Resistor 2	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.125415	96.000000	0.120995
		Inorganic Silicon compounds	Quartz	14808-60-7	0.003266	2.500000	0.003151
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.001960	1.500000	0.001891
			Subtotal		0.130640	100.0000000	0.126036
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.000964
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.100000	0.000001
			Subtotal		0.001000	100.0000000	0.000965
	Inner Electrode 1	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000439	6.000000	0.000423
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	0.500000	0.000035
		Polymers	Ethyl cellulose	9004-57-3	0.000475	6.500000	0.000459
		Silver and its compounds	Silver, metal	7440-22-4	0.006363	87.000000	0.006139
			Subtotal		0.007314	100.0000000	0.007057
	Inner Electrode 2	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008429	99.900000	0.008131
			Subtotal		0.008437	100.0000000	0.008140
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000007
		Tin and its compounds	Tin, metal	7440-31-5	0.007051	99.900000	0.006802
			Subtotal		0.007058	100.0000000	0.006809
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001244	46.730000	0.001200
		Inorganic compounds	Carbon Black	1333-86-4	0.000174	6.540000	0.000168
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.001244	46.730000	0.001200
			Subtotal		0.002663	100.0000000	0.002569
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.001841	56.000000	0.001777
		Lead and its compounds	Lead, metallic lead and lead alloys	7439-92-1	0.000113	3.440000	0.000109
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001334	40.560000	0.001287
			Subtotal		0.003288	100.0000000	0.003172

Semiconductor Die 1	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.294000	98.000000	0.283638
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006000	2.000000	0.005789
			Subtotal		0.300000	100.0000000	0.289427

Semiconductor Die 2	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.294000	98.000000	0.283638
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006000	2.000000	0.005789
			Subtotal		0.300000	100.0000000	0.289427

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.337882	89.600000	0.325974
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.003394	0.900000	0.003274
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001886	0.500000	0.001819
		Silver and its compounds	Silver, metal	7440-22-4	0.001188	0.315000	0.001146
		Tin and its compounds	Tin, metal	7440-31-5	0.032751	8.685000	0.031597
			Subtotal		0.377100	100.0000000	0.363810

Solder Flux	Solder Flux	Copper and its compounds	Copper, metal	7440-50-8	0.002329	2.986400	0.002247
		Glycol Ethers and Acetates - Specific	2-(2-butoxyethoxy)ethanol	112-34-5	0.002120	2.718100	0.002045
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.009712	12.450900	0.009369
		Silver and its compounds	Silver, metal	7440-22-4	0.003358	4.305300	0.003240
		Tin and its compounds	Tin, metal	7440-31-5	0.060481	77.539300	0.058349
			Subtotal		0.078000	100.0000000	0.075251

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.003495	0.500000	0.003372
		Silver and its compounds	Silver, metal	7440-22-4	0.020970	3.000000	0.020231
		Tin and its compounds	Tin, metal	7440-31-5	0.674535	96.500000	0.650762
			Subtotal		0.699000	100.0000000	0.674365

Substrate, Pre-plated NiPdAu	Substrate, Pre-plated NiPdAu	Barium and its compounds	Barium sulfate	7727-43-7	0.926770	2.387500	0.894108
		Copper and its compounds	Copper, metal	7440-50-8	18.892099	48.668900	18.226275
		Epoxy Resins	Other Epoxy resins		0.245871	0.633400	0.237205
		Gold and its compounds	Gold, metal	7440-57-5	0.027755	0.071500	0.026776
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	5.740386	14.788100	5.538074
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	7.342388	18.915100	7.083616
		Magnesium and its compounds	Talc	14807-96-6	0.132407	0.341100	0.127740
		Nickel and its compounds	Nickel, metal	7440-02-0	0.767929	1.978300	0.740864
		Palladium and its compounds	Palladium, metal	7440-05-3	0.017274	0.044500	0.016665
		Phosphorus compounds	Proprietary Material-Other inorganic phosphorous compounds		0.132407	0.341100	0.127740
		Polymers	Plastic: PI - Polyimide		4.592316	11.830500	4.430467
			Subtotal		38.817600	100.0000000	37.449532

			Total		103.653099	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFRX5G372T4 Product content declaration of AFRX5G372T4		上次修订 Last Revision (GMT): Friday, 08 November 2024, 11:38:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	陶瓷的 Ceramic 1	O	O	O	O	O	O
	陶瓷的 Ceramic 2	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 5	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation 1	O	O	O	O	O	O
	绝缘 Insulation 2	O	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 2	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	内电极 Inner Electrode 1	O	O	O	O	O	O
	内电极 Inner Electrode 2	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFRX5G372T4		Last Revision (GMT): Friday, 08 November 2024, 11:38:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023	Test Report 14 Apr 2023
Inductor 1	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 16 May 2024
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 31 Aug 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Test Report 18 Oct 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 5	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE BB	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE BC	Test Report 15 Nov 2021	Test Report 15 Nov 2021	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 25 Jun 2021
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor 1	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Resistor 2	EXTERNAL ELECTRODE	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019	Test Report 27 Dec 2019	Test Report 27 Dec 2019	Test Report 27 Dec 2019
	OVERCOAT	Test Report 27 Aug 2020	Test Report 27 Aug 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE ELECTRODE	Test Report 19 Oct 2020	Test Report 19 Oct 2020	Not Available	Not Available
	SECONDARY ELECTRODE	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	SUSBTRATE	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Not Available	Test Report 13 Feb 2020
Semiconductor Die 1		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Semiconductor Die 2		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Semiconductor Die 3	DIE	Not Available	Not Available	Not Available	Not Available
Solder Flux		Test Report 12 Oct 2023	Test Report 12 Oct 2023	Not Available	Not Available
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
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Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

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