AFRX5G372T4
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| NXP Semiconductors | ||
| Product content declaration of AFRX5G372T4 | Last Revision (GMT): Wednesday, 19 March 2025, 03:42:00 PM | |
| Part Type | Package Version | Package Name | Total part weight | Environment | Termination | 2nd Level Interconnect | For more information: | |||
|---|---|---|---|---|---|---|---|---|---|---|
| Halogen Free (Cl+Br) | Lead Free (Pb) | EU RoHS Compliant | Plating | Base Alloy | ||||||
| AFRX5G372T4 | SOT1996 | HLFLGA21 | 104.042699 mg | Yes | No | Yes | Nickel/Palladium/Gold (Ni/Pd/Au) | Other | e4 | contact us |
| Manufacturer Part Number (MPN) | Effective Date | Version | Pb-free soldering | SnPb soldering | Number of processing cycles | Manufacturing | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | Moisture Sensitivity Level / Floor Life | Peak Package temperature | Max time at peak temperature | |||||
| 9354 002 38528 | 2024-07-09 | 7 | Not Applicable | Not Applicable | Not Applicable | 3 / 168 hours | 260 | 40 sec. | 3 | External manufacturing |
| Subpart | Homogeneous Material | Substance | CAS number | Mass(mg) | Mass(%) of Material | Mass(%) of Total part | |
|---|---|---|---|---|---|---|---|
| Category | Description | ||||||
| Bonding Wire - Au | Bonding Wire - Au | Gold and its compounds | Gold, metal | 7440-57-5 | 0.159583 | 99.990000 | 0.153382 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000016 | 0.010000 | 0.000015 | |||
| Subtotal | 0.159599 | 100.0000000 | 0.153398 | ||||
| Capacitor 1 | Ceramic | Calcium and its compounds | Calcium monoxide | 1305-78-8 | 0.038400 | 40.000000 | 0.036908 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.009600 | 10.000000 | 0.009227 | |||
| Zirconium and its compounds | Zirconium oxide | 1314-23-4 | 0.048000 | 50.000000 | 0.046135 | ||
| Subtotal | 0.096000 | 100.0000000 | 0.092270 | ||||
| Inner Electrode | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000000 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.003999 | 99.990000 | 0.003844 | ||
| Subtotal | 0.004000 | 100.0000000 | 0.003845 | ||||
| Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.005999 | 99.990000 | 0.005766 | ||
| Subtotal | 0.006000 | 100.0000000 | 0.005767 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.001200 | 2.000000 | 0.001153 | |
| Copper and its compounds | Copper, metal | 7440-50-8 | 0.054000 | 90.000000 | 0.051902 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.004800 | 8.000000 | 0.004614 | ||
| Subtotal | 0.060000 | 100.0000000 | 0.057669 | ||||
| Tin Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.013999 | 99.990000 | 0.013455 | ||
| Subtotal | 0.014000 | 100.0000000 | 0.013456 | ||||
| Capacitor 2 | Ceramic | Barium and its compounds | Barium oxide | 1304-28-5 | 0.264000 | 60.000000 | 0.253742 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.044000 | 10.000000 | 0.042290 | |||
| Titanium and its compounds | Titanium (IV) Oxide | 13463-67-7 | 0.132000 | 30.000000 | 0.126871 | ||
| Subtotal | 0.440000 | 100.0000000 | 0.422903 | ||||
| Inner Electrode | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000002 | 0.010000 | 0.000002 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.015998 | 99.990000 | 0.015377 | ||
| Subtotal | 0.016000 | 100.0000000 | 0.015378 | ||||
| Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.013999 | 99.990000 | 0.013455 | ||
| Subtotal | 0.014000 | 100.0000000 | 0.013456 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.003040 | 2.000000 | 0.002922 | |
| Copper and its compounds | Copper, metal | 7440-50-8 | 0.136800 | 90.000000 | 0.131485 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.012160 | 8.000000 | 0.011687 | ||
| Subtotal | 0.152000 | 100.0000000 | 0.146094 | ||||
| Tin Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000004 | 0.010000 | 0.000004 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.037996 | 99.990000 | 0.036520 | ||
| Subtotal | 0.038000 | 100.0000000 | 0.036523 | ||||
| Capacitor 3 | Ceramic | Calcium and its compounds | Calcium monoxide | 1305-78-8 | 0.053500 | 25.000000 | 0.051421 |
| Manganese and its compounds | Manganese oxide | 1344-43-0 | 0.010700 | 5.000000 | 0.010284 | ||
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.021400 | 10.000000 | 0.020568 | |||
| Zirconium and its compounds | Zirconium oxide | 1314-23-4 | 0.128400 | 60.000000 | 0.123411 | ||
| Subtotal | 0.214000 | 100.0000000 | 0.205685 | ||||
| Inner Electrode | Copper and its compounds | Copper, metal | 7440-50-8 | 0.008999 | 99.990000 | 0.008649 | |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | |||
| Subtotal | 0.009000 | 100.0000000 | 0.008650 | ||||
| Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.006999 | 99.990000 | 0.006727 | ||
| Subtotal | 0.007000 | 100.0000000 | 0.006728 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.001600 | 2.000000 | 0.001538 | |
| Copper and its compounds | Copper, metal | 7440-50-8 | 0.072000 | 90.000000 | 0.069202 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.006400 | 8.000000 | 0.006151 | ||
| Subtotal | 0.080000 | 100.0000000 | 0.076891 | ||||
| Tin Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000002 | 0.010000 | 0.000002 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.019998 | 99.990000 | 0.019221 | ||
| Subtotal | 0.020000 | 100.0000000 | 0.019223 | ||||
| Capacitor 4 | Ceramic | Calcium and its compounds | Calcium monoxide | 1305-78-8 | 0.057600 | 40.000000 | 0.055362 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.014400 | 10.000000 | 0.013841 | |||
| Zirconium and its compounds | Zirconium oxide | 1314-23-4 | 0.072000 | 50.000000 | 0.069202 | ||
| Subtotal | 0.144000 | 100.0000000 | 0.138405 | ||||
| Inner Electrode | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.005999 | 99.990000 | 0.005766 | ||
| Subtotal | 0.006000 | 100.0000000 | 0.005767 | ||||
| Nickel Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.008999 | 99.990000 | 0.008649 | ||
| Subtotal | 0.009000 | 100.0000000 | 0.008650 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.001800 | 2.000000 | 0.001730 | |
| Copper and its compounds | Copper, metal | 7440-50-8 | 0.081000 | 90.000000 | 0.077853 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.007200 | 8.000000 | 0.006920 | ||
| Subtotal | 0.090000 | 100.0000000 | 0.086503 | ||||
| Tin Plating | Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.000002 | 0.010000 | 0.000002 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.020998 | 99.990000 | 0.020182 | ||
| Subtotal | 0.021000 | 100.0000000 | 0.020184 | ||||
| Die Encapsulant | Die Encapsulant | Epoxy Resins | Proprietary Material-Other Epoxy resins | 2.974000 | 5.000000 | 2.858442 | |
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 51.747600 | 87.000000 | 49.736887 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 1.784400 | 3.000000 | 1.715065 | ||
| Inorganic compounds | Carbon Black | 1333-86-4 | 0.297400 | 0.500000 | 0.285844 | ||
| Magnesium and its compounds | Proprietary Material-Other magnesium compounds | 0.059480 | 0.100000 | 0.057169 | |||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.773240 | 1.300000 | 0.743195 | |||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 1.784400 | 3.000000 | 1.715065 | |||
| Zinc and its compounds | Proprietary Material-Other zinc compounds | 0.059480 | 0.100000 | 0.057169 | |||
| Subtotal | 59.480000 | 100.0000000 | 57.168836 | ||||
| Epoxy Adhesive | Epoxy Adhesive | Anhydrides | Proprietary Material - Other anhydrides | 0.008430 | 3.000000 | 0.008102 | |
| Epoxy Resins | Proprietary Material-Other Epoxy resins | 0.018265 | 6.500000 | 0.017555 | |||
| Organic Silicon compounds | (3,4-Epoxycyclohexyl)ethyltrimethoxysilane | 3388-04-3 | 0.001405 | 0.500000 | 0.001350 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.252900 | 90.000000 | 0.243073 | ||
| Subtotal | 0.281000 | 100.0000000 | 0.270081 | ||||
| Inductor 1 | Inner Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.019598 | 99.990000 | 0.018836 | ||
| Subtotal | 0.019600 | 100.0000000 | 0.018838 | ||||
| Insulation | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.087080 | 40.000000 | 0.083696 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.021770 | 10.000000 | 0.020924 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.108850 | 50.000000 | 0.104621 | ||
| Subtotal | 0.217700 | 100.0000000 | 0.209241 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.016798 | 99.990000 | 0.016146 | ||
| Subtotal | 0.016800 | 100.0000000 | 0.016147 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.000630 | 1.000000 | 0.000606 | |
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.005670 | 9.000000 | 0.005450 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.056700 | 90.000000 | 0.054497 | ||
| Subtotal | 0.063000 | 100.0000000 | 0.060552 | ||||
| Protective Coating | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.000560 | 5.000000 | 0.000538 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.001680 | 15.000000 | 0.001615 | ||
| Cobalt and its compounds | Cobalt oxide | 1307-96-6 | 0.000560 | 5.000000 | 0.000538 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.007840 | 70.000000 | 0.007535 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000560 | 5.000000 | 0.000538 | |||
| Subtotal | 0.011200 | 100.0000000 | 0.010765 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.021698 | 99.990000 | 0.020855 | ||
| Subtotal | 0.021700 | 100.0000000 | 0.020857 | ||||
| Inductor 2 | Ceramic 1 | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000796 | 5.000000 | 0.000765 |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.002389 | 15.000000 | 0.002296 | ||
| Cobalt and its compounds | Cobalt oxide | 1307-96-6 | 0.000796 | 5.000000 | 0.000765 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.011147 | 70.000000 | 0.010714 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000796 | 5.000000 | 0.000765 | |||
| Subtotal | 0.015925 | 100.0000000 | 0.015306 | ||||
| Ceramic 2 | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.095438 | 40.000000 | 0.091730 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.023859 | 10.000000 | 0.022932 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.119298 | 50.000000 | 0.114662 | ||
| Subtotal | 0.238595 | 100.0000000 | 0.229324 | ||||
| Inner Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000005 | 0.010000 | 0.000005 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.047735 | 99.990000 | 0.045880 | ||
| Subtotal | 0.047740 | 100.0000000 | 0.045885 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.006369 | 99.990000 | 0.006122 | ||
| Subtotal | 0.006370 | 100.0000000 | 0.006123 | ||||
| Outer Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000003 | 0.010000 | 0.000003 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.031812 | 99.990000 | 0.030576 | ||
| Subtotal | 0.031815 | 100.0000000 | 0.030579 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.009554 | 99.990000 | 0.009183 | ||
| Subtotal | 0.009555 | 100.0000000 | 0.009184 | ||||
| Inductor 3 | Inner Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.019598 | 99.990000 | 0.018836 | ||
| Subtotal | 0.019600 | 100.0000000 | 0.018838 | ||||
| Insulation | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.087080 | 40.000000 | 0.083696 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.021770 | 10.000000 | 0.020924 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.108850 | 50.000000 | 0.104621 | ||
| Subtotal | 0.217700 | 100.0000000 | 0.209241 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.016798 | 99.990000 | 0.016146 | ||
| Subtotal | 0.016800 | 100.0000000 | 0.016147 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.000630 | 1.000000 | 0.000606 | |
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.005670 | 9.000000 | 0.005450 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.056700 | 90.000000 | 0.054497 | ||
| Subtotal | 0.063000 | 100.0000000 | 0.060552 | ||||
| Protective Coating | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.000560 | 5.000000 | 0.000538 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.001680 | 15.000000 | 0.001615 | ||
| Cobalt and its compounds | Cobalt oxide | 1307-96-6 | 0.000560 | 5.000000 | 0.000538 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.007840 | 70.000000 | 0.007535 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000560 | 5.000000 | 0.000538 | |||
| Subtotal | 0.011200 | 100.0000000 | 0.010765 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.021698 | 99.990000 | 0.020855 | ||
| Subtotal | 0.021700 | 100.0000000 | 0.020857 | ||||
| Inductor 4 | Ceramic 1 | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000398 | 5.000000 | 0.000383 |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.001194 | 15.000000 | 0.001148 | ||
| Cobalt and its compounds | Cobalt oxide | 1307-96-6 | 0.000398 | 5.000000 | 0.000383 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.005574 | 70.000000 | 0.005357 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000398 | 5.000000 | 0.000383 | |||
| Subtotal | 0.007963 | 100.0000000 | 0.007653 | ||||
| Ceramic 2 | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.047719 | 40.000000 | 0.045865 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.011930 | 10.000000 | 0.011466 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.059649 | 50.000000 | 0.057331 | ||
| Subtotal | 0.119298 | 100.0000000 | 0.114662 | ||||
| Inner Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.023868 | 99.990000 | 0.022940 | ||
| Subtotal | 0.023870 | 100.0000000 | 0.022943 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000000 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.003184 | 99.990000 | 0.003061 | ||
| Subtotal | 0.003185 | 100.0000000 | 0.003061 | ||||
| Outer Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.015906 | 99.990000 | 0.015288 | ||
| Subtotal | 0.015908 | 100.0000000 | 0.015289 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000000 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.004777 | 99.990000 | 0.004591 | ||
| Subtotal | 0.004777 | 100.0000000 | 0.004592 | ||||
| Inductor 5 | Inner Electrode | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.009799 | 99.990000 | 0.009418 | ||
| Subtotal | 0.009800 | 100.0000000 | 0.009419 | ||||
| Insulation | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.043540 | 40.000000 | 0.041848 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.010885 | 10.000000 | 0.010462 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.054425 | 50.000000 | 0.052310 | ||
| Subtotal | 0.108850 | 100.0000000 | 0.104621 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.008399 | 99.990000 | 0.008073 | ||
| Subtotal | 0.008400 | 100.0000000 | 0.008074 | ||||
| Outer Electrode | Boron and its compounds | Boron oxide | 1303-86-2 | 0.000315 | 1.000000 | 0.000303 | |
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.002835 | 9.000000 | 0.002725 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.028350 | 90.000000 | 0.027248 | ||
| Subtotal | 0.031500 | 100.0000000 | 0.030276 | ||||
| Protective Coating | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.000280 | 5.000000 | 0.000269 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000840 | 15.000000 | 0.000807 | ||
| Cobalt and its compounds | Cobalt oxide | 1307-96-6 | 0.000280 | 5.000000 | 0.000269 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.003920 | 70.000000 | 0.003768 | ||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000280 | 5.000000 | 0.000269 | |||
| Subtotal | 0.005600 | 100.0000000 | 0.005382 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000001 | 0.010000 | 0.000001 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.010849 | 99.990000 | 0.010427 | ||
| Subtotal | 0.010850 | 100.0000000 | 0.010428 | ||||
| Resistor 1 | Bottom Conductor | Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.000516 | 13.800000 | 0.000496 |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000045 | 1.200000 | 0.000043 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.000172 | 4.600000 | 0.000165 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.003005 | 80.400000 | 0.002888 | ||
| Subtotal | 0.003737 | 100.0000000 | 0.003592 | ||||
| Ceramic | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.119641 | 96.100000 | 0.114993 | |
| Calcium and its compounds | Calcium monoxide | 1305-78-8 | 0.000498 | 0.400000 | 0.000479 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.001868 | 1.500000 | 0.001795 | ||
| Magnesium and its compounds | Magnesium-oxide | 1309-48-4 | 0.002490 | 2.000000 | 0.002393 | ||
| Subtotal | 0.124497 | 100.0000000 | 0.119659 | ||||
| Conductor | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.000350 | 35.000000 | 0.000336 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.000650 | 65.000000 | 0.000625 | ||
| Subtotal | 0.001000 | 100.0000000 | 0.000961 | ||||
| Insulation 1 | Chromium and Chromium III compounds | C.I. Pigment Black 28 | 68186-91-4 | 0.000208 | 5.000000 | 0.000200 | |
| Epoxy Resins | Epikote 862 | 28064-14-4 | 0.003079 | 74.100000 | 0.002959 | ||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 0.000690 | 16.600000 | 0.000663 | ||
| Inorganic compounds | Proprietary Material - Other inorganic compounds | 0.000179 | 4.300000 | 0.000172 | |||
| Subtotal | 0.004154 | 100.0000000 | 0.003993 | ||||
| Insulation 2 | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000140 | 6.700000 | 0.000134 | |
| Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.001574 | 75.500000 | 0.001513 | ||
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000021 | 1.000000 | 0.000020 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.000350 | 16.800000 | 0.000337 | ||
| Subtotal | 0.002085 | 100.0000000 | 0.002004 | ||||
| Termination | Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.008309 | 40.000000 | 0.007986 | |
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.012463 | 60.000000 | 0.011979 | ||
| Subtotal | 0.020772 | 100.0000000 | 0.019965 | ||||
| Top Conductor | Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.000187 | 4.500000 | 0.000180 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000008 | 0.200000 | 0.000008 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.000112 | 2.700000 | 0.000108 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.000154 | 3.700000 | 0.000148 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.003693 | 88.900000 | 0.003550 | ||
| Subtotal | 0.004154 | 100.0000000 | 0.003993 | ||||
| Resistor 2 | Ceramic | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.403617 | 96.100000 | 0.387934 |
| Calcium and its compounds | Calcium monoxide | 1305-78-8 | 0.001680 | 0.400000 | 0.001615 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.006300 | 1.500000 | 0.006055 | ||
| Magnesium and its compounds | Magnesium-oxide | 1309-48-4 | 0.008400 | 2.000000 | 0.008074 | ||
| Subtotal | 0.419996 | 100.0000000 | 0.403677 | ||||
| Conductor | Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.001656 | 13.799000 | 0.001592 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000144 | 1.200000 | 0.000138 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.000553 | 4.608000 | 0.000531 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.009648 | 80.393000 | 0.009273 | ||
| Subtotal | 0.012001 | 100.0000000 | 0.011535 | ||||
| Electrode | Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.000720 | 4.500000 | 0.000692 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000032 | 0.200000 | 0.000031 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.000432 | 2.700000 | 0.000415 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.000592 | 3.700000 | 0.000569 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.014224 | 88.900000 | 0.013671 | ||
| Subtotal | 0.015999 | 100.0000000 | 0.015378 | ||||
| Insulation | Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 0.002656 | 16.600000 | 0.002553 | |
| Inorganic compounds | Proprietary Material - Other inorganic compounds | 0.000688 | 4.300000 | 0.000661 | |||
| Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.004000 | 25.000000 | 0.003844 | |||
| Phenols and Phenolic Resins | Proprietary Material-Other phenolic resins | 0.008656 | 54.100000 | 0.008319 | |||
| Subtotal | 0.015999 | 100.0000000 | 0.015378 | ||||
| Nickel Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000002 | 0.010000 | 0.000002 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.024000 | 99.990000 | 0.023067 | ||
| Subtotal | 0.024002 | 100.0000000 | 0.023069 | ||||
| Protective Coating | Aluminum and its compounds | Aluminum Oxides (Al2O3) | 1344-28-1 | 0.000536 | 6.698000 | 0.000515 | |
| Bismuth and its compounds | Bismuth trioxide | 1304-76-3 | 0.006040 | 75.476000 | 0.005805 | ||
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000082 | 1.031000 | 0.000079 | ||
| Inorganic Silicon compounds | Quartz | 14808-60-7 | 0.001344 | 16.795000 | 0.001292 | ||
| Subtotal | 0.008002 | 100.0000000 | 0.007692 | ||||
| Resistive Layer | Aluminum and its compounds | Aluminum oxide | 1302-74-5 | 0.001100 | 5.501000 | 0.001057 | |
| Boron and its compounds | Boron oxide | 1303-86-2 | 0.000180 | 0.900000 | 0.000173 | ||
| Copper and its compounds | Cupric oxide | 1317-38-0 | 0.000180 | 0.900000 | 0.000173 | ||
| Inorganic Silicon compounds | Silicon dioxide | 7631-86-9 | 0.003940 | 19.702000 | 0.003787 | ||
| Lead and its compounds | Lead monooxide | 1317-36-8 | 0.001128 | 5.641000 | 0.001084 | ||
| Manganese and its compounds | Manganese tetraoxide | 1317-35-7 | 0.000360 | 1.800000 | 0.000346 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.001800 | 9.001000 | 0.001730 | ||
| Ruthenium and its compounds | Ruthenium oxide | 12036-10-1 | 0.001800 | 9.001000 | 0.001730 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.008590 | 42.954000 | 0.008256 | ||
| Tantalum and its compounds | Tantalum (V) oxide | 1314-61-0 | 0.000560 | 2.800000 | 0.000538 | ||
| Zinc and its compounds | Zinc oxide | 1314-13-2 | 0.000360 | 1.800000 | 0.000346 | ||
| Subtotal | 0.019998 | 100.0000000 | 0.019221 | ||||
| Termination | Chromium and Chromium III compounds | Chromium, metal | 7440-47-3 | 0.000700 | 34.965000 | 0.000673 | |
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.001302 | 65.035000 | 0.001251 | ||
| Subtotal | 0.002002 | 100.0000000 | 0.001924 | ||||
| Tin Plating | Miscellaneous substances | Proprietary Material-Other miscellaneous substances. | 0.000003 | 0.010000 | 0.000003 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.031996 | 99.990000 | 0.030753 | ||
| Subtotal | 0.031999 | 100.0000000 | 0.030756 | ||||
| Semiconductor Die 1 | Semiconductor Die | Arsenic and its compounds | Gallium arsenide | 1303-00-0 | 0.294000 | 98.000000 | 0.282576 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.006000 | 2.000000 | 0.005767 | |||
| Subtotal | 0.300000 | 100.0000000 | 0.288343 | ||||
| Semiconductor Die 2 | Semiconductor Die | Arsenic and its compounds | Gallium arsenide | 1303-00-0 | 0.294000 | 98.000000 | 0.282576 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.006000 | 2.000000 | 0.005767 | |||
| Subtotal | 0.300000 | 100.0000000 | 0.288343 | ||||
| Semiconductor Die 3 | Semiconductor Die | Inorganic Silicon compounds | Silicon | 7440-21-3 | 0.337882 | 89.600000 | 0.324753 |
| Miscellaneous substances | Other miscellaneous substances (less than 10%). | 0.003394 | 0.900000 | 0.003262 | |||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.001886 | 0.500000 | 0.001812 | ||
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.001188 | 0.315000 | 0.001142 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.032751 | 8.685000 | 0.031479 | ||
| Subtotal | 0.377100 | 100.0000000 | 0.362447 | ||||
| Solder Flux | Solder Flux | Aliphatic Amines | Other aliphatic amines | 0.032495 | 41.660000 | 0.031232 | |
| Aromatic hydrocarbon compounds | Polyethylene glycol | 25322-68-3 | 0.026005 | 33.340000 | 0.024995 | ||
| Organic compounds | Other organic compounds. | 0.019500 | 25.000000 | 0.018742 | |||
| Subtotal | 0.078000 | 100.0000000 | 0.074969 | ||||
| Solder Paste | Solder Paste | Copper and its compounds | Copper, metal | 7440-50-8 | 0.003495 | 0.500000 | 0.003359 |
| Silver and its compounds | Silver, metal | 7440-22-4 | 0.020970 | 3.000000 | 0.020155 | ||
| Tin and its compounds | Tin, metal | 7440-31-5 | 0.674535 | 96.500000 | 0.648325 | ||
| Subtotal | 0.699000 | 100.0000000 | 0.671840 | ||||
| Substrate, Pre-plated NiPdAu | Substrate, Pre-plated NiPdAu | Barium and its compounds | Barium sulfate | 7727-43-7 | 0.926770 | 2.387500 | 0.890760 |
| Copper and its compounds | Copper, metal | 7440-50-8 | 18.892099 | 48.668900 | 18.158025 | ||
| Epoxy Resins | Other Epoxy resins | 0.245871 | 0.633400 | 0.236317 | |||
| Gold and its compounds | Gold, metal | 7440-57-5 | 0.027755 | 0.071500 | 0.026676 | ||
| Inorganic Silicon compounds | Fibrous-glass-wool | 65997-17-3 | 5.740386 | 14.788100 | 5.517336 | ||
| Inorganic Silicon compounds | Silica, vitreous | 60676-86-0 | 7.342388 | 18.915100 | 7.057091 | ||
| Magnesium and its compounds | Talc | 14807-96-6 | 0.132407 | 0.341100 | 0.127262 | ||
| Nickel and its compounds | Nickel, metal | 7440-02-0 | 0.767929 | 1.978300 | 0.738090 | ||
| Palladium and its compounds | Palladium, metal | 7440-05-3 | 0.017274 | 0.044500 | 0.016603 | ||
| Phosphorus compounds | Proprietary Material-Other inorganic phosphorous compounds | 0.132407 | 0.341100 | 0.127262 | |||
| Polymers | Plastic: PI - Polyimide | 4.592316 | 11.830500 | 4.413876 | |||
| Subtotal | 38.817600 | 100.0000000 | 37.309297 | ||||
| Total | 104.042699 | 100.0000000 | 100.0000000 | ||||
| Note(s): |
|---|
| 1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| 产品内容声明 AFRX5G372T4 Product content declaration of AFRX5G372T4 | 上次修订 Last Revision (GMT): Wednesday, 19 March 2025, 03:42:00 PM | |
| 部件名称 Name of the part | 均质材料 Homogeneous Material | 有毒或有害物质和元素 (Toxic or hazardous Substances and Elements) | |||||
|---|---|---|---|---|---|---|---|
| 铅(Pb) | 镉(Cd) | 汞(Hg) | 六价铬(Cr-VI) | 多溴联苯(PBB) | 多溴二苯醚(PBDE) | ||
| 焊丝-金 Bonding Wire - Au | 焊丝-金 Bonding Wire - Au | O | O | O | O | O | O |
| 电容器 Capacitor 1 | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电容器 Capacitor 2 | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电容器 Capacitor 3 | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电容器 Capacitor 4 | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 芯片密封胶 Die Encapsulant | 芯片密封胶 Die Encapsulant | O | O | O | O | O | O |
| 环氧树脂粘合剂 Epoxy Adhesive | 环氧树脂粘合剂 Epoxy Adhesive | O | O | O | O | O | O |
| 电感 Inductor 1 | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 绝缘 Insulation | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 防护涂料 Protective Coating | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电感 Inductor 2 | 陶瓷的 Ceramic 1 | O | O | O | O | O | O |
| | 陶瓷的 Ceramic 2 | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电感 Inductor 3 | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 绝缘 Insulation | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 防护涂料 Protective Coating | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电感 Inductor 4 | 陶瓷的 Ceramic 1 | O | O | O | O | O | O |
| | 陶瓷的 Ceramic 2 | O | O | O | O | O | O |
| | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电感 Inductor 5 | 内电极 Inner Electrode | O | O | O | O | O | O |
| | 绝缘 Insulation | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 外电极 Outer Electrode | O | O | O | O | O | O |
| | 防护涂料 Protective Coating | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 电阻 Resistor 1 | 底导体 Bottom Conductor | O | O | O | O | O | O |
| | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 导体 Conductor | O | O | O | O | O | O |
| | 绝缘 Insulation 1 | O | O | O | O | O | O |
| | 绝缘 Insulation 2 | O | O | O | O | O | O |
| | 终端材料 Termination | O | O | O | O | O | O |
| | 顶部电导体 Top Conductor | O | O | O | O | O | O |
| 电阻 Resistor 2 | 陶瓷的 Ceramic | O | O | O | O | O | O |
| | 导体 Conductor | O | O | O | O | O | O |
| | 电极 Electrode | O | O | O | O | O | O |
| | 绝缘 Insulation | O | O | O | O | O | O |
| | 镀镍层 Nickel Plating | O | O | O | O | O | O |
| | 防护涂料 Protective Coating | O | O | O | O | O | O |
| | 电阻层 Resistive Layer | X | O | O | O | O | O |
| | 终端材料 Termination | O | O | O | O | O | O |
| | 镀锡 Tin Plating | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 1 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 2 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 半导体芯片 Semiconductor Die 3 | 半导体芯片 Semiconductor Die | O | O | O | O | O | O |
| 助焊剂 Solder Flux | 助焊剂 Solder Flux | O | O | O | O | O | O |
| 焊锡膏 Solder Paste | 焊锡膏 Solder Paste | O | O | O | O | O | O |
| 基板，预镀镍钯金 Substrate, Pre-plated NiPdAu | 基板，预镀镍钯金 Substrate, Pre-plated NiPdAu | O | O | O | O | O | O |
| O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。 |
| O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit. |
| X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。 |
| X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006. |
| 备注： 该半导体产品的环保使用期限（EFUP）为50年。 |
| Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years. |
| 免责声明 Disclaimer |
|---|
| 本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |
| NXP Semiconductors | ||
| Compliance Documentation of AFRX5G372T4 | Last Revision (GMT): Wednesday, 19 March 2025, 03:42:00 PM | |
| Subpart | Homogeneous Material | Certificate of Analysis(CoA) | |||
|---|---|---|---|---|---|
| RoHS | Phthalates * | Halogens * | Antimony * | ||
| Bonding Wire - Au | Test Report 21 May 2024 | Test Report 21 May 2024 | Test Report 21 May 2024 | Test Report 21 May 2024 | |
| Capacitor 1 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Capacitor 2 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Capacitor 3 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Capacitor 4 | CERAMIC | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 | Test Report 8 Nov 2024 |
| INNER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER ELECTRODE | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | Test Report 5 Sep 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Die Encapsulant | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | Test Report 16 Jan 2025 | |
| Epoxy Adhesive | Test Report 28 Sep 2024 | Test Report 28 Sep 2024 | Test Report 28 Sep 2024 | Not Available | |
| Inductor 1 | ELECTRODE | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 |
| INNER GLAZE | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Not Available | Not Available | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER GLAZE | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | Not Available | Not Available | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Inductor 2 | ELECTRODE | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 |
| INNER GLAZE | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Not Available | Not Available | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER GLAZE | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | Not Available | Not Available | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Inductor 3 | ELECTRODE | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Test Report 16 May 2024 | Test Report 16 May 2024 |
| INNER GLAZE | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Not Available | Not Available | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER GLAZE | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | Not Available | Not Available | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Inductor 4 | ELECTRODE | Test Report 16 May 2024 | Test Report 16 May 2024 | Test Report 16 May 2024 | Test Report 16 May 2024 |
| INNER GLAZE | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| OUTER GLAZE | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | Test Report 4 Oct 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Inductor 5 | ELECTRODE | Test Report 3 Oct 2024 | Test Report 3 Oct 2024 | Test Report 24 Oct 2024 | Test Report 24 Oct 2024 |
| GLAZE BC | Test Report 15 Nov 2021 | Test Report 15 Nov 2021 | Test Report 27 Nov 2020 | Test Report 27 Nov 2020 | |
| INNER GLAZE | Test Report 19 Aug 2024 | Test Report 19 Aug 2024 | Not Available | Not Available | |
| NI PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| SN PLATING | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | Test Report 12 Apr 2024 | |
| Resistor 1 | ALUMINA | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 |
| BOTTOM CONDUCTOR | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| INSULATION 1ST OVERCOAT | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| INSULATION 2ND OVERCOAT | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| NI PLATING | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| RESISTIVE LAYER | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | |
| SN PLATING | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| TERMINAL CONDUCTOR | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| TOP CONDUCTOR | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | Test Report 30 Oct 2023 | |
| Resistor 2 | ALUMINA | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 |
| BOTTOM CONDUCTOR | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | |
| INSULATION - 1ST OVERCOAT | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | |
| INSULATION - 2ND OVERCOAT | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | |
| NI PLATING | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | |
| RESISTIVE LAYER | Test Report 15 Nov 2018 | Test Report 15 Nov 2018 | Test Report 15 Nov 2018 | Test Report 15 Nov 2018 | |
| SN PLATING | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | Test Report 22 Jul 2020 | |
| TERMINAL CONDUCTOR | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | Test Report 6 Nov 2019 | |
| TOP CONDUCTOR | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | Test Report 10 Feb 2020 | |
| Semiconductor Die 1 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | |
| Semiconductor Die 2 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | Test Report 2 May 2023 | |
| Semiconductor Die 3 | DIE | Not Available | Not Available | Not Available | Not Available |
| Solder Flux | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | Test Report 18 Apr 2024 | |
| Solder Paste | Test Report 22 Nov 2023 | Test Report 22 Nov 2023 | Test Report 22 Nov 2023 | Test Report 22 Nov 2023 | |
| Substrate, Pre-plated NiPdAu | Not Available | Not Available | Not Available | Not Available | |
| For more information: contact us | |||||
| Note(s): |
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| * NXP does not commit to providing this report for all product materials! |
| Disclaimer |
|---|
| All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. |