AFLP5G35645T6

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Product content declaration of AFLP5G35645T6		Last Revision (GMT): Wednesday, 06 November 2024, 12:09:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFLP5G35645T6	SOT1934	HLFLGA17	34.831171 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 960 21528	2023-11-24	5	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Copper and its compounds	Copper, metal	7440-50-8	0.053050	97.000000	0.152307
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.001641	3.000000	0.004711
			Subtotal		0.054691	100.0000000	0.157017

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.147171
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029434
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058868
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.353210
			Subtotal		0.205045	100.0000000	0.588684
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024472
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024496
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000037
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036708
			Subtotal		0.012799	100.0000000	0.036744
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007356
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.330998
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029422
			Subtotal		0.128101	100.0000000	0.367775
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000086
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.085651
			Subtotal		0.029863	100.0000000	0.085737

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.147171
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029434
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058868
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.353210
			Subtotal		0.205045	100.0000000	0.588684
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024472
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024496
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000037
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036708
			Subtotal		0.012799	100.0000000	0.036744
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007356
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.330998
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029422
			Subtotal		0.128101	100.0000000	0.367775
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000086
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.085651
			Subtotal		0.029863	100.0000000	0.085737

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.147171
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029434
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058868
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.353210
			Subtotal		0.205045	100.0000000	0.588684
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024472
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024496
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000037
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036708
			Subtotal		0.012799	100.0000000	0.036744
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007356
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.330998
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029422
			Subtotal		0.128101	100.0000000	0.367775
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000086
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.085651
			Subtotal		0.029863	100.0000000	0.085737

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		1.143600	5.000000	3.283266
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	19.898640	87.000000	57.128829
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.686160	3.000000	1.969960
		Inorganic compounds	Carbon Black	1333-86-4	0.114360	0.500000	0.328327
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.022872	0.100000	0.065665
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.297336	1.300000	0.853649
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.686160	3.000000	1.969960
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.022872	0.100000	0.065665
			Subtotal		22.872000	100.0000000	65.665320

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.007050	3.000000	0.020241
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.015275	6.500000	0.043854
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.001175	0.500000	0.003373
		Silver and its compounds	Silver, metal	7440-22-4	0.211500	90.000000	0.607215
			Subtotal		0.235000	100.0000000	0.674683

Inductor 1	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000007
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.068524
			Subtotal		0.023870	100.0000000	0.068531
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.137001
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.034250
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.171251
			Subtotal		0.119298	100.0000000	0.342502
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.009143
			Subtotal		0.003185	100.0000000	0.009144
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000005
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.045666
			Subtotal		0.015908	100.0000000	0.045670
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000398	5.000000	0.001143
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.003429
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.001143
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.016002
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.001143
			Subtotal		0.007963	100.0000000	0.022860
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.013715
			Subtotal		0.004777	100.0000000	0.013716

Inductor 2	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.009799	99.990000	0.028133
			Subtotal		0.009800	100.0000000	0.028136
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.043540	40.000000	0.125003
		Boron and its compounds	Boron oxide	1303-86-2	0.010885	10.000000	0.031251
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.054425	50.000000	0.156254
			Subtotal		0.108850	100.0000000	0.312507
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.008399	99.990000	0.024114
			Subtotal		0.008400	100.0000000	0.024116
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000315	1.000000	0.000904
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002835	9.000000	0.008139
		Silver and its compounds	Silver, metal	7440-22-4	0.028350	90.000000	0.081393
			Subtotal		0.031500	100.0000000	0.090436
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000280	5.000000	0.000804
		Boron and its compounds	Boron oxide	1303-86-2	0.000840	15.000000	0.002412
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000280	5.000000	0.000804
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.003920	70.000000	0.011254
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000280	5.000000	0.000804
			Subtotal		0.005600	100.0000000	0.016078
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.010849	99.990000	0.031147
			Subtotal		0.010850	100.0000000	0.031150

Inductor 3	Inductor	Boron and its compounds	Boron oxide	1303-86-2	0.000328	0.187500	0.000942
		Copper and its compounds	Cupric oxide	1317-38-0	0.009538	5.450000	0.027382
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002953	1.687500	0.008478
		Iron and its compounds	Diiron-trioxide	1309-37-1	0.046734	26.705000	0.134172
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000954	0.545000	0.002738
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000954	0.545000	0.002738
		Nickel and its compounds	Nickel oxide	1313-99-1	0.018121	10.355000	0.052026
		Nickel and its compounds	Nickel, metal	7440-02-0	0.011375	6.500000	0.032657
		Silver and its compounds	Silver, metal	7440-22-4	0.055781	31.875000	0.160147
		Tin and its compounds	Tin oxide (SnO2)	18282-10-5	0.000954	0.545000	0.002738
		Tin and its compounds	Tin, metal	7440-31-5	0.009187	5.250000	0.026377
		Zinc and its compounds	Zinc oxide	1314-13-2	0.018121	10.355000	0.052026
			Subtotal		0.175000	100.0000000	0.502424

Resistor 1	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025214	96.100000	0.072391
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000301
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.001130
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.001507
			Subtotal		0.026238	100.0000000	0.075329
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000396
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000034
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000132
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.002308
			Subtotal		0.001000	100.0000000	0.002871
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000129
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000077
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000106
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.002552
			Subtotal		0.001000	100.0000000	0.002871
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000477
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000123
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000718
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.001553
			Subtotal		0.001000	100.0000000	0.002871
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001856	99.990000	0.005331
			Subtotal		0.001857	100.0000000	0.005331
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000192
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.002168
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000029
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000482
			Subtotal		0.001000	100.0000000	0.002871
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000078	5.510000	0.000223
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000036
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000036
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000275	19.540000	0.000791
		Lead and its compounds	Lead monooxide	1317-36-8	0.000080	5.650000	0.000229
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000073
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.020000	0.000365
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.020000	0.000365
		Silver and its compounds	Silver, metal	7440-22-4	0.000607	43.050000	0.001742
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.810000	0.000114
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000073
			Subtotal		0.001410	100.0000000	0.004047
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.001005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.001866
			Subtotal		0.001000	100.0000000	0.002871
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.002785	99.990000	0.007997
			Subtotal		0.002786	100.0000000	0.007997

Resistor 2	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025214	96.100000	0.072391
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000301
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.001130
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.001507
			Subtotal		0.026238	100.0000000	0.075329
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000396
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000034
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000132
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.002308
			Subtotal		0.001000	100.0000000	0.002871
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000129
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000077
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000106
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.002552
			Subtotal		0.001000	100.0000000	0.002871
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000477
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000123
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000718
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.001553
			Subtotal		0.001000	100.0000000	0.002871
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001856	99.990000	0.005331
			Subtotal		0.001857	100.0000000	0.005331
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000192
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.002168
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000029
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000482
			Subtotal		0.001000	100.0000000	0.002871
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000078	5.510000	0.000223
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000036
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000036
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000275	19.540000	0.000791
		Lead and its compounds	Lead monooxide	1317-36-8	0.000080	5.650000	0.000229
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000073
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.020000	0.000365
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.020000	0.000365
		Silver and its compounds	Silver, metal	7440-22-4	0.000607	43.050000	0.001742
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.810000	0.000114
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000073
			Subtotal		0.001410	100.0000000	0.004047
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.001005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.001866
			Subtotal		0.001000	100.0000000	0.002871
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.002785	99.990000	0.007997
			Subtotal		0.002786	100.0000000	0.007997

Resistor 3	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025214	96.100000	0.072391
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000301
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.001130
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.001507
			Subtotal		0.026238	100.0000000	0.075329
	Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000396
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000034
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000132
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.002308
			Subtotal		0.001000	100.0000000	0.002871
	Electrode	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000129
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000077
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000106
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.002552
			Subtotal		0.001000	100.0000000	0.002871
	Insulation	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000477
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000123
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000250	25.000000	0.000718
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.000541	54.100000	0.001553
			Subtotal		0.001000	100.0000000	0.002871
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001856	99.990000	0.005331
			Subtotal		0.001857	100.0000000	0.005331
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000192
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.002168
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000029
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000482
			Subtotal		0.001000	100.0000000	0.002871
	Resistive Layer	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000078	5.510000	0.000223
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000036
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000036
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000275	19.540000	0.000791
		Lead and its compounds	Lead monooxide	1317-36-8	0.000080	5.650000	0.000229
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000073
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.020000	0.000365
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.020000	0.000365
		Silver and its compounds	Silver, metal	7440-22-4	0.000607	43.050000	0.001742
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.810000	0.000114
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000073
			Subtotal		0.001410	100.0000000	0.004047
	Termination	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.001005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.001866
			Subtotal		0.001000	100.0000000	0.002871
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.002785	99.990000	0.007997
			Subtotal		0.002786	100.0000000	0.007997

Resistor 4	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000138	13.800000	0.000396
		Boron and its compounds	Boron oxide	1303-86-2	0.000012	1.200000	0.000034
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000046	4.600000	0.000132
		Silver and its compounds	Silver, metal	7440-22-4	0.000804	80.400000	0.002308
			Subtotal		0.001000	100.0000000	0.002871
	Ceramic	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.025207	96.100000	0.072370
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.000105	0.400000	0.000301
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000394	1.500000	0.001130
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000525	2.000000	0.001506
			Subtotal		0.026230	100.0000000	0.075307
	Conductor	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000350	35.000000	0.001005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000650	65.000000	0.001866
			Subtotal		0.001000	100.0000000	0.002871
	Insulation 1	Chromium and Chromium III compounds	C.I. Pigment Black 28	68186-91-4	0.000050	5.000000	0.000143
		Epoxy Resins	Epikote 862	28064-14-4	0.000741	74.100000	0.002127
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.000166	16.600000	0.000477
		Inorganic compounds	Proprietary Material - Other inorganic compounds		0.000043	4.300000	0.000123
			Subtotal		0.001000	100.0000000	0.002871
	Insulation 2	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000067	6.700000	0.000192
		Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000755	75.500000	0.002168
		Boron and its compounds	Boron oxide	1303-86-2	0.000010	1.000000	0.000029
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000168	16.800000	0.000482
			Subtotal		0.001000	100.0000000	0.002871
	Resistive Layer	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000078	5.500000	0.000223
		Boron and its compounds	Boron oxide	1303-86-2	0.000013	0.900000	0.000036
		Copper and its compounds	Cupric oxide	1317-38-0	0.000013	0.900000	0.000036
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000278	19.700000	0.000799
		Lead and its compounds	Lead monooxide	1317-36-8	0.000078	5.550000	0.000225
		Manganese and its compounds	Manganese tetraoxide	1317-35-7	0.000025	1.800000	0.000073
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000127	9.000000	0.000365
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000127	9.000000	0.000365
		Silver and its compounds	Silver, metal	7440-22-4	0.000609	43.050000	0.001747
		Tantalum and its compounds	Tantalum (V) oxide	1314-61-0	0.000040	2.800000	0.000114
		Zinc and its compounds	Zinc oxide	1314-13-2	0.000025	1.800000	0.000073
			Subtotal		0.001413	100.0000000	0.004058
	Termination	Nickel and its compounds	Nickel, metal	7440-02-0	0.001858	40.000000	0.005336
		Tin and its compounds	Tin, metal	7440-31-5	0.002788	60.000000	0.008004
			Subtotal		0.004646	100.0000000	0.013340
	Top Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000045	4.500000	0.000129
		Boron and its compounds	Boron oxide	1303-86-2	0.000002	0.200000	0.000006
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000027	2.700000	0.000077
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000037	3.700000	0.000106
		Silver and its compounds	Silver, metal	7440-22-4	0.000889	88.900000	0.002552
			Subtotal		0.001000	100.0000000	0.002871

Semiconductor Die 1	Copper Pillar	Copper and its compounds	Copper, metal	7440-50-8	0.011849	99.900000	0.034020
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000012	0.100000	0.000034
			Subtotal		0.011861	100.0000000	0.034054
	Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.360476	99.900000	1.034925
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000361	0.100000	0.001036
			Subtotal		0.360837	100.0000000	1.035961
	Solder Ball	Silver and its compounds	Silver, metal	7440-22-4	0.000043	1.800000	0.000124
		Tin and its compounds	Tin, metal	7440-31-5	0.002358	98.200000	0.006770
			Subtotal		0.002401	100.0000000	0.006894
	Under Bump Metal 1	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Titanium and its compounds	Titanium, metal	7440-32-6	0.000999	99.900000	0.002868
			Subtotal		0.001000	100.0000000	0.002871
	Under Bump Metal 2	Copper and its compounds	Copper, metal	7440-50-8	0.000999	99.995000	0.002871
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.005000	0.000000
			Subtotal		0.001000	100.0000000	0.002871

Semiconductor Die 2	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.328496	98.000000	0.943109
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006704	2.000000	0.019247
			Subtotal		0.335200	100.0000000	0.962356

Solder Flux	Solder Flux	Aliphatic Amines	Other aliphatic amines		0.004166	41.660000	0.011961
		Aromatic hydrocarbon compounds	Polyethylene glycol	25322-68-3	0.003334	33.340000	0.009572
		Organic compounds	Other organic compounds.		0.002500	25.000000	0.007177
			Subtotal		0.010000	100.0000000	0.028710

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.003840	0.500000	0.011025
		Silver and its compounds	Silver, metal	7440-22-4	0.023040	3.000000	0.066148
		Tin and its compounds	Tin, metal	7440-31-5	0.741120	96.500000	2.127749
			Subtotal		0.768000	100.0000000	2.204922

Substrate, Pre-plated NiPdAu	Substrate, Pre-plated NiPdAu	Acrylates	Proprietary Material-Other acrylates		0.308840	3.697800	0.886678
		Aliphatic Amines	Proprietary Material-Other aliphatic amine compounds		0.021799	0.261000	0.062584
		Barium and its compounds	Barium sulfate	7727-43-7	0.152599	1.827100	0.438112
		Copper and its compounds	Copper, metal	7440-50-8	2.616072	31.322700	7.510720
		Cyanide compounds	Phthalocyanine Blue	57455-37-5	0.007266	0.087000	0.020861
		Gold and its compounds	Gold, metal	7440-57-5	0.021799	0.261000	0.062584
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	2.260469	27.065000	6.489787
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.036331	0.435000	0.104307
		Magnesium and its compounds	Talc	14807-96-6	0.036331	0.435000	0.104307
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.342910	16.078900	3.855483
		Nickel and its compounds	Nickel, metal	7440-02-0	0.121112	1.450100	0.347712
		Organic compounds	Proprietary Material-Other organic compounds.		0.003633	0.043500	0.010431
		Palladium and its compounds	Palladium, metal	7440-05-3	0.021799	0.261000	0.062584
		Polymers	Plastic: EP - Epoxide, Epoxy		0.755021	9.040000	2.167658
		Polymers	Polyimide Resin	39355-34-5	0.646019	7.734900	1.854715
			Subtotal		8.352000	100.0000000	23.978522

			Total		34.831171	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFLP5G35645T6 Product content declaration of AFLP5G35645T6		上次修订 Last Revision (GMT): Wednesday, 06 November 2024, 12:09:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	电感 Inductor	O	O	O	O	O	O
电阻 Resistor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	电极 Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 4	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	绝缘 Insulation 1	O	O	O	O	O	O
	绝缘 Insulation 2	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	终端材料 Termination	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	铜柱 Copper Pillar	O	O	O	O	O	O
	半导体芯片 Die	O	O	O	O	O	O
	焊锡球 Solder Ball	O	O	O	O	O	O
	焊料凸点下的金属 Under Bump Metal 1	O	O	O	O	O	O
	焊料凸点下的金属 Under Bump Metal 2	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFLP5G35645T6		Last Revision (GMT): Wednesday, 06 November 2024, 12:09:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 12 Dec 2022	Test Report 12 Dec 2022
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 2	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 28 Oct 2020	Test Report 28 Oct 2020
	GLAZE (BC)	Not Available	Not Available	Test Report 27 Nov 2020	Test Report 27 Nov 2020
	GLAZE BB	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	GLAZE BC	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
Resistor 1	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Resistor 2	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Resistor 3	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020	Test Report 10 Feb 2020
Resistor 4	ALUMINA	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	BOTTOM CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 1ST OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	INSULATION 2ND OVERCOAT	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	NI PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	RESISTIVE LAYER	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019	Test Report 6 Nov 2019
	SN PLATING	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TERMINAL CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
	TOP CONDUCTOR	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023	Test Report 30 Oct 2023
Semiconductor Die 1	CU PILLAR	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
	SOLDER	Not Available	Not Available	Not Available	Not Available
	UBM CU	Not Available	Not Available	Not Available	Not Available
	UBM TI	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Solder Flux		Test Report 18 Apr 2024	Test Report 18 Apr 2024	Test Report 18 Apr 2024	Test Report 18 Apr 2024
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu		Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer