AFLP5G25641T6

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Product content declaration of AFLP5G25641T6		Last Revision (GMT): Wednesday, 06 November 2024, 12:10:00 AM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
AFLP5G25641T6	SOT1934	HLFLGA17	35.266171 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Nickel/Palladium/Gold (Ni/Pd/Au)	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9353 921 81528	2023-11-24	7	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Copper and its compounds	Copper, metal	7440-50-8	0.053050	97.000000	0.150428
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.001641	3.000000	0.004652
			Subtotal		0.054691	100.0000000	0.155081

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.145356
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029071
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058142
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.348854
			Subtotal		0.205045	100.0000000	0.581423
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024170
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024194
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000036
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036255
			Subtotal		0.012799	100.0000000	0.036291
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007265
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.326915
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029059
			Subtotal		0.128101	100.0000000	0.363239
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000085
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.084595
			Subtotal		0.029863	100.0000000	0.084680

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.145356
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029071
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058142
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.348854
			Subtotal		0.205045	100.0000000	0.581423
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024170
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024194
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000036
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036255
			Subtotal		0.012799	100.0000000	0.036291
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007265
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.326915
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029059
			Subtotal		0.128101	100.0000000	0.363239
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000085
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.084595
			Subtotal		0.029863	100.0000000	0.084680

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.051261	25.000000	0.145356
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010252	5.000000	0.029071
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.020505	10.000000	0.058142
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.123027	60.000000	0.348854
			Subtotal		0.205045	100.0000000	0.581423
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008524	99.900000	0.024170
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000008	0.100000	0.000024
			Subtotal		0.008532	100.0000000	0.024194
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000036
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012786	99.900000	0.036255
			Subtotal		0.012799	100.0000000	0.036291
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.002562	2.000000	0.007265
		Copper and its compounds	Copper, metal	7440-50-8	0.115291	90.000000	0.326915
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.010248	8.000000	0.029059
			Subtotal		0.128101	100.0000000	0.363239
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000030	0.100000	0.000085
		Tin and its compounds	Tin, metal	7440-31-5	0.029833	99.900000	0.084595
			Subtotal		0.029863	100.0000000	0.084680

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.019200	40.000000	0.054443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004800	10.000000	0.013611
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.024000	50.000000	0.068054
			Subtotal		0.048000	100.0000000	0.136108
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001999	99.990000	0.005671
			Subtotal		0.002000	100.0000000	0.005671
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002999	99.990000	0.008506
			Subtotal		0.003000	100.0000000	0.008507
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.001701
		Copper and its compounds	Copper, metal	7440-50-8	0.027000	90.000000	0.076561
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.006805
			Subtotal		0.030000	100.0000000	0.085067
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.006999	99.990000	0.019847
			Subtotal		0.007000	100.0000000	0.019849

Capacitor 5	Capacitor	Boron and its compounds	Boron oxide	1303-86-2	0.000603	0.670000	0.001710
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.009603	10.670000	0.027230
		Copper and its compounds	Copper, metal	7440-50-8	0.033795	37.550000	0.095828
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002403	2.670000	0.006814
		Manganese and its compounds	Manganese carbonate	598-62-9	0.002403	2.670000	0.006814
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002997	3.330000	0.008498
		Tin and its compounds	Tin, metal	7440-31-5	0.007002	7.780000	0.019855
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.031194	34.660000	0.088453
			Subtotal		0.090000	100.0000000	0.255202

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.019200	40.000000	0.054443
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004800	10.000000	0.013611
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.024000	50.000000	0.068054
			Subtotal		0.048000	100.0000000	0.136108
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001999	99.990000	0.005671
			Subtotal		0.002000	100.0000000	0.005671
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002999	99.990000	0.008506
			Subtotal		0.003000	100.0000000	0.008507
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.001701
		Copper and its compounds	Copper, metal	7440-50-8	0.027000	90.000000	0.076561
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.006805
			Subtotal		0.030000	100.0000000	0.085067
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000002
		Tin and its compounds	Tin, metal	7440-31-5	0.006999	99.990000	0.019847
			Subtotal		0.007000	100.0000000	0.019849

Die Encapsulant	Die Encapsulant	Epoxy Resins	Proprietary Material-Other Epoxy resins		1.143600	5.000000	3.242768
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	19.898640	87.000000	56.424158
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.686160	3.000000	1.945661
		Inorganic compounds	Carbon Black	1333-86-4	0.114360	0.500000	0.324277
		Magnesium and its compounds	Proprietary Material-Other magnesium compounds		0.022872	0.100000	0.064855
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.297336	1.300000	0.843120
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.686160	3.000000	1.945661
		Zinc and its compounds	Proprietary Material-Other zinc compounds		0.022872	0.100000	0.064855
			Subtotal		22.872000	100.0000000	64.855354

Epoxy Adhesive	Epoxy Adhesive	Anhydrides	Proprietary Material - Other anhydrides		0.007050	3.000000	0.019991
		Epoxy Resins	Proprietary Material-Other Epoxy resins		0.015275	6.500000	0.043313
		Organic Silicon compounds	(3,4-Epoxycyclohexyl)ethyltrimethoxysilane	3388-04-3	0.001175	0.500000	0.003332
		Silver and its compounds	Silver, metal	7440-22-4	0.211500	90.000000	0.599725
			Subtotal		0.235000	100.0000000	0.666361

Inductor 1	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.116758
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.029190
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.145948
			Subtotal		0.102940	100.0000000	0.291895
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.058375
			Subtotal		0.020589	100.0000000	0.058381
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.019262
			Subtotal		0.006794	100.0000000	0.019263
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.078803
			Subtotal		0.027793	100.0000000	0.078811
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.001110
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.003329
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.001110
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.015534
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.001110
			Subtotal		0.007826	100.0000000	0.022191
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.025682
			Subtotal		0.009058	100.0000000	0.025685

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.116758
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.029190
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.145948
			Subtotal		0.102940	100.0000000	0.291895
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.058375
			Subtotal		0.020589	100.0000000	0.058381
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.019262
			Subtotal		0.006794	100.0000000	0.019263
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.078803
			Subtotal		0.027793	100.0000000	0.078811
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.001110
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.003329
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.001110
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.015534
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.001110
			Subtotal		0.007826	100.0000000	0.022191
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.025682
			Subtotal		0.009058	100.0000000	0.025685

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.041176	40.000000	0.116758
		Boron and its compounds	Boron oxide	1303-86-2	0.010294	10.000000	0.029190
		Inorganic Silicon compounds	Quartz	14808-60-7	0.051470	50.000000	0.145948
			Subtotal		0.102940	100.0000000	0.291895
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.020587	99.990000	0.058375
			Subtotal		0.020589	100.0000000	0.058381
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006792	99.990000	0.019262
			Subtotal		0.006794	100.0000000	0.019263
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000008
		Silver and its compounds	Silver, metal	7440-22-4	0.027791	99.990000	0.078803
			Subtotal		0.027793	100.0000000	0.078811
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000391	5.000000	0.001110
		Boron and its compounds	Boron oxide	1303-86-2	0.001174	15.000000	0.003329
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000391	5.000000	0.001110
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005478	70.000000	0.015534
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000391	5.000000	0.001110
			Subtotal		0.007826	100.0000000	0.022191
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.009057	99.990000	0.025682
			Subtotal		0.009058	100.0000000	0.025685

Inductor 4	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000007
		Silver and its compounds	Silver, metal	7440-22-4	0.023868	99.990000	0.067679
			Subtotal		0.023870	100.0000000	0.067685
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.047719	40.000000	0.135311
		Boron and its compounds	Boron oxide	1303-86-2	0.011930	10.000000	0.033828
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.059649	50.000000	0.169139
			Subtotal		0.119298	100.0000000	0.338277
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003184	99.990000	0.009030
			Subtotal		0.003185	100.0000000	0.009031
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000005
		Silver and its compounds	Silver, metal	7440-22-4	0.015906	99.990000	0.045102
			Subtotal		0.015908	100.0000000	0.045107
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000398	5.000000	0.001129
		Boron and its compounds	Boron oxide	1303-86-2	0.001194	15.000000	0.003387
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000398	5.000000	0.001129
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005574	70.000000	0.015805
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000398	5.000000	0.001129
			Subtotal		0.007963	100.0000000	0.022578
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.004777	99.990000	0.013546
			Subtotal		0.004777	100.0000000	0.013547

Resistor 1	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.027393	96.000000	0.077675
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000713	2.500000	0.002023
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000428	1.500000	0.001214
			Subtotal		0.028534	100.0000000	0.080911
	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000023	2.350000	0.000067
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000071	7.050000	0.000200
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000006	0.600000	0.000017
		Polymers	Ethyl cellulose	9004-57-3	0.000077	7.650000	0.000217
		Silver and its compounds	Silver, metal	7440-22-4	0.000824	82.350000	0.002335
			Subtotal		0.001000	100.0000000	0.002835
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.002833
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
			Subtotal		0.001000	100.0000000	0.002835
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001658	99.900000	0.004701
			Subtotal		0.001659	100.0000000	0.004705
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000420	42.014200	0.001191
		Inorganic compounds	Carbon Black	1333-86-4	0.000050	5.030500	0.000143
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000109	10.941100	0.000310
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000420	42.014200	0.001191
			Subtotal		0.001000	100.0000000	0.002835
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000380	38.000000	0.001077
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000120	12.000000	0.000340
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000500	50.000000	0.001418
			Subtotal		0.001000	100.0000000	0.002836
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000200	20.000000	0.000567
		Tin and its compounds	Tin, metal	7440-31-5	0.000800	80.000000	0.002269
			Subtotal		0.001000	100.0000000	0.002836
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.001095	99.900000	0.003106
			Subtotal		0.001096	100.0000000	0.003109
	Top Conductor	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.000999	99.900000	0.002833
			Subtotal		0.001000	100.0000000	0.002835

Resistor 2	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.027393	96.000000	0.077675
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000713	2.500000	0.002023
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000428	1.500000	0.001214
			Subtotal		0.028534	100.0000000	0.080911
	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000023	2.350000	0.000067
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000071	7.050000	0.000200
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000006	0.600000	0.000017
		Polymers	Ethyl cellulose	9004-57-3	0.000077	7.650000	0.000217
		Silver and its compounds	Silver, metal	7440-22-4	0.000824	82.350000	0.002335
			Subtotal		0.001000	100.0000000	0.002835
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.002833
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
			Subtotal		0.001000	100.0000000	0.002835
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001658	99.900000	0.004701
			Subtotal		0.001659	100.0000000	0.004705
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000420	42.014200	0.001191
		Inorganic compounds	Carbon Black	1333-86-4	0.000050	5.030500	0.000143
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000109	10.941100	0.000310
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000420	42.014200	0.001191
			Subtotal		0.001000	100.0000000	0.002835
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000380	38.000000	0.001077
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000120	12.000000	0.000340
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000500	50.000000	0.001418
			Subtotal		0.001000	100.0000000	0.002836
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000200	20.000000	0.000567
		Tin and its compounds	Tin, metal	7440-31-5	0.000800	80.000000	0.002269
			Subtotal		0.001000	100.0000000	0.002836
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.001095	99.900000	0.003106
			Subtotal		0.001096	100.0000000	0.003109
	Top Conductor	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.000999	99.900000	0.002833
			Subtotal		0.001000	100.0000000	0.002835

Resistor 3	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.027393	96.000000	0.077675
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000713	2.500000	0.002023
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000428	1.500000	0.001214
			Subtotal		0.028534	100.0000000	0.080911
	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000023	2.350000	0.000067
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000071	7.050000	0.000200
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000006	0.600000	0.000017
		Polymers	Ethyl cellulose	9004-57-3	0.000077	7.650000	0.000217
		Silver and its compounds	Silver, metal	7440-22-4	0.000824	82.350000	0.002335
			Subtotal		0.001000	100.0000000	0.002835
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.002833
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
			Subtotal		0.001000	100.0000000	0.002835
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001658	99.900000	0.004701
			Subtotal		0.001659	100.0000000	0.004705
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000420	42.014200	0.001191
		Inorganic compounds	Carbon Black	1333-86-4	0.000050	5.030500	0.000143
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000109	10.941100	0.000310
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000420	42.014200	0.001191
			Subtotal		0.001000	100.0000000	0.002835
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000380	38.000000	0.001077
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000120	12.000000	0.000340
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000500	50.000000	0.001418
			Subtotal		0.001000	100.0000000	0.002836
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000200	20.000000	0.000567
		Tin and its compounds	Tin, metal	7440-31-5	0.000800	80.000000	0.002269
			Subtotal		0.001000	100.0000000	0.002836
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.001095	99.900000	0.003106
			Subtotal		0.001096	100.0000000	0.003109
	Top Conductor	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.000999	99.900000	0.002833
			Subtotal		0.001000	100.0000000	0.002835

Resistor 4	Alumina Substrate	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.027393	96.000000	0.077675
		Inorganic Silicon compounds	Quartz	14808-60-7	0.000713	2.500000	0.002023
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.000428	1.500000	0.001214
			Subtotal		0.028534	100.0000000	0.080911
	Bottom Conductor	Bismuth and its compounds	Bismuth trioxide	1304-76-3	0.000023	2.350000	0.000067
		Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	0.000071	7.050000	0.000200
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000006	0.600000	0.000017
		Polymers	Ethyl cellulose	9004-57-3	0.000077	7.650000	0.000217
		Silver and its compounds	Silver, metal	7440-22-4	0.000824	82.350000	0.002335
			Subtotal		0.001000	100.0000000	0.002835
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.000999	99.900000	0.002833
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
			Subtotal		0.001000	100.0000000	0.002835
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001658	99.900000	0.004701
			Subtotal		0.001659	100.0000000	0.004705
	Protective Coating	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000420	42.014200	0.001191
		Inorganic compounds	Carbon Black	1333-86-4	0.000050	5.030500	0.000143
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000109	10.941100	0.000310
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000420	42.014200	0.001191
			Subtotal		0.001000	100.0000000	0.002835
	Resistive Layer	Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000380	38.000000	0.001077
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000120	12.000000	0.000340
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000500	50.000000	0.001418
			Subtotal		0.001000	100.0000000	0.002836
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000200	20.000000	0.000567
		Tin and its compounds	Tin, metal	7440-31-5	0.000800	80.000000	0.002269
			Subtotal		0.001000	100.0000000	0.002836
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.001095	99.900000	0.003106
			Subtotal		0.001096	100.0000000	0.003109
	Top Conductor	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Silver and its compounds	Silver, metal	7440-22-4	0.000999	99.900000	0.002833
			Subtotal		0.001000	100.0000000	0.002835

Semiconductor Die 1	Copper Pillar	Copper and its compounds	Copper, metal	7440-50-8	0.011849	99.900000	0.033600
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000012	0.100000	0.000034
			Subtotal		0.011861	100.0000000	0.033634
	Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.360476	99.900000	1.022159
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000361	0.100000	0.001023
			Subtotal		0.360837	100.0000000	1.023183
	Solder Ball	Silver and its compounds	Silver, metal	7440-22-4	0.000043	1.800000	0.000123
		Tin and its compounds	Tin, metal	7440-31-5	0.002358	98.200000	0.006687
			Subtotal		0.002401	100.0000000	0.006809
	Under Bump Metal 1	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000003
		Titanium and its compounds	Titanium, metal	7440-32-6	0.000999	99.900000	0.002833
			Subtotal		0.001000	100.0000000	0.002835
	Under Bump Metal 2	Copper and its compounds	Copper, metal	7440-50-8	0.000999	99.995000	0.002835
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.005000	0.000000
			Subtotal		0.001000	100.0000000	0.002835

Semiconductor Die 2	Semiconductor Die	Arsenic and its compounds	Gallium arsenide	1303-00-0	0.328496	98.000000	0.931476
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.006704	2.000000	0.019010
			Subtotal		0.335200	100.0000000	0.950486

Solder Flux	Solder Flux	Aliphatic Amines	Other aliphatic amines		0.004166	41.660000	0.011813
		Aromatic hydrocarbon compounds	Polyethylene glycol	25322-68-3	0.003334	33.340000	0.009454
		Organic compounds	Other organic compounds.		0.002500	25.000000	0.007089
			Subtotal		0.010000	100.0000000	0.028356

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.003790	0.500000	0.010747
		Silver and its compounds	Silver, metal	7440-22-4	0.022740	3.000000	0.064481
		Tin and its compounds	Tin, metal	7440-31-5	0.731470	96.500000	2.074141
			Subtotal		0.758000	100.0000000	2.149369

Substrate, Pre-plated NiPdAu	Copper Foil	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000027	0.006000	0.000075
		Copper and its compounds	Copper, metal	7440-50-8	0.442300	99.882000	1.254178
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000398	0.090000	0.001130
		Zinc and its compounds	Zinc, metal	7440-66-6	0.000097	0.022000	0.000276
			Subtotal		0.442823	100.0000000	1.255659
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	4.789588	99.900000	13.581252
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.004794	0.100000	0.013595
			Subtotal		4.794382	100.0000000	13.594847
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.015269	99.900000	0.043296
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000015	0.100000	0.000043
			Subtotal		0.015284	100.0000000	0.043340
	Nickel Plating	Nickel and its compounds	Nickel, metal	7440-02-0	0.283975	93.000000	0.805233
		Phosphorus compounds	Phosphorus, elemental (not containing red allotrope)	7723-14-0	0.021374	7.000000	0.060609
			Subtotal		0.305349	100.0000000	0.865841
	Palladium Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000008	0.100000	0.000022
		Palladium and its compounds	Palladium, metal	7440-05-3	0.007593	99.900000	0.021530
			Subtotal		0.007600	100.0000000	0.021551
	Solder Mask	Aromatic amines and their salts	1,3,5-Triazine-2,4,6-triamine	108-78-1	0.000221	0.100000	0.000628
		Barium and its compounds	Barium sulfate	7727-43-7	0.043175	19.500000	0.122427
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.021920	9.900000	0.062155
		Magnesium and its compounds	Talc	14807-96-6	0.006421	2.900000	0.018207
		Organic compounds	Other organic compounds.		0.011956	5.400000	0.033903
		Phosphorus compounds	Diphenyl(2,4,6-trimethylbenzoyl)phosphine oxide	75980-60-8	0.001771	0.800000	0.005023
		Polymers	Plastic: EP - Epoxide, Epoxy		0.027455	12.400000	0.077851
		Polymers	Plastic: PAK		0.108492	49.000000	0.307637
			Subtotal		0.221412	100.0000000	0.627830
	Substrate Build Up	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	1.026060	40.000000	2.909474
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.897802	35.000000	2.545789
		Polymers	Plastic: PI - Polyimide		0.641288	25.000000	1.818421
			Subtotal		2.565150	100.0000000	7.273684

			Total		35.266171	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 AFLP5G25641T6 Product content declaration of AFLP5G25641T6		上次修订 Last Revision (GMT): Wednesday, 06 November 2024, 12:10:00 AM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	电容器 Capacitor	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
电阻 Resistor 2	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
电阻 Resistor 3	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
电阻 Resistor 4	氧化铝基材 Alumina Substrate	O	O	O	O	O	O
	底导体 Bottom Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	O	O	O	O	O	O
半导体芯片 Semiconductor Die 1	铜柱 Copper Pillar	O	O	O	O	O	O
	半导体芯片 Die	O	O	O	O	O	O
	焊锡球 Solder Ball	O	O	O	O	O	O
	焊料凸点下的金属 Under Bump Metal 1	O	O	O	O	O	O
	焊料凸点下的金属 Under Bump Metal 2	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Semiconductor Die	O	O	O	O	O	O
助焊剂 Solder Flux	助焊剂 Solder Flux	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基板，预镀镍钯金 Substrate, Pre-plated NiPdAu	铜箔 Copper Foil	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	钯镀层 Palladium Plating	O	O	O	O	O	O
	阻焊层 Solder Mask	O	O	O	O	O	O
	有机底物堆积 Substrate Build Up	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of AFLP5G25641T6		Last Revision (GMT): Wednesday, 06 November 2024, 12:10:00 AM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 21 Oct 2023	Test Report 21 Oct 2023	Test Report 21 Oct 2023	Not Available
Inductor 1	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 3 Oct 2024	Test Report 3 Oct 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 1 Jun 2023	Test Report 1 Jun 2023
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Test Report 31 Aug 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 27 Apr 2023
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Test Report 18 Oct 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor 1	CERAMIC	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	OVERCOAT	Test Report 28 Jul 2020	Test Report 28 Jul 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE LAYER	Test Report 16 Nov 2020	Test Report 16 Nov 2020	Not Available	Not Available
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
Resistor 2	CERAMIC	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	OVERCOAT	Test Report 28 Jul 2020	Test Report 28 Jul 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE LAYER	Test Report 16 Nov 2020	Test Report 16 Nov 2020	Not Available	Not Available
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
Resistor 3	CERAMIC	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	OVERCOAT	Test Report 28 Jul 2020	Test Report 28 Jul 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE LAYER	Test Report 16 Nov 2020	Test Report 16 Nov 2020	Not Available	Not Available
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
Resistor 4	CERAMIC	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020	Test Report 13 Feb 2020
	INTERNAL ELECTRODE	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019Test Report 15 Sep 2020	Test Report 27 Dec 2019
	NI PLATING	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020	Test Report 1 Sep 2020
	OVERCOAT	Test Report 28 Jul 2020	Test Report 28 Jul 2020	Not Available	Not Available
	OVERGLAZE	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020	Test Report 12 Nov 2020
	RESISTIVE LAYER	Test Report 16 Nov 2020	Test Report 16 Nov 2020	Not Available	Not Available
	SN PLATING	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020	Test Report 1 Jun 2020
Semiconductor Die 1	CU PILLAR	Not Available	Not Available	Not Available	Not Available
	DIE	Not Available	Not Available	Not Available	Not Available
	SOLDER	Not Available	Not Available	Not Available	Not Available
	UBM CU	Not Available	Not Available	Not Available	Not Available
	UBM TI	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 2		Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023	Test Report 2 May 2023
Solder Flux		Test Report 18 Apr 2024	Test Report 18 Apr 2024	Test Report 18 Apr 2024	Test Report 18 Apr 2024
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated NiPdAu	AU PLATING	Test Report 19 Jan 2024	Test Report 19 Jan 2024	Test Report 19 Jan 2024	Test Report 19 Jan 2024
	AUS SR-1	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 6 Mar 2024
	COPPER FOIL	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023	Test Report 7 Dec 2023
	CU PLATING	Not Available	Not Available	Not Available	Not Available
	E-705G	Test Report 7 Mar 2024	Test Report 7 Mar 2024	Test Report 7 Mar 2024	Test Report 7 Mar 2024
	NI PLATING	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023	Test Report 26 Jun 2023
	PD PLATING	Not Available	Not Available	Not Available	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer