A5M36TG140T2

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

Download

European RoHS

Chinese RoHS

NXP Semiconductors
Product content declaration of A5M36TG140T2		Last Revision (GMT): Saturday, 31 August 2024, 10:14:00 PM

Part Type	Package Version	Package Name	Total part weight	Environment			Termination		2nd Level Interconnect	For more information:
Part Type	Package Version	Package Name	Total part weight	Halogen Free (Cl+Br)	Lead Free (Pb)	EU RoHS Compliant	Plating	Base Alloy	2nd Level Interconnect	For more information:
A5M36TG140T2	SOT1831	HLLGA27	153.513670 mg	Halogen Free (Cl+Br)	Yes	No	Yes	Other	Other	e4	contact us

Manufacturer Part Number (MPN)	Effective Date	Version	Pb-free soldering			SnPb soldering			Number of processing cycles	Manufacturing
Manufacturer Part Number (MPN)	Effective Date	Version	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Moisture Sensitivity Level / Floor Life	Peak Package temperature	Max time at peak temperature	Number of processing cycles	Manufacturing
9354 412 07528	2023-11-24	3	Not Applicable	Not Applicable	Not Applicable	3 / 168 hours	260	40 sec.	3	Kuala Lumpur, Malaysia;External manufacturing

Subpart	Homogeneous Material	Substance		CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Subpart	Homogeneous Material	Category	Description	CAS number	Mass(mg)	Mass(%) of Material	Mass(%) of Total part
Bonding Wire - Au	Bonding Wire - Au	Gold and its compounds	Gold, metal	7440-57-5	0.575032	99.990000	0.374581
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000058	0.010000	0.000037
			Subtotal		0.575090	100.0000000	0.374618

Capacitor 1	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.160500	25.000000	0.104551
		Manganese and its compounds	Manganese oxide	1344-43-0	0.032100	5.000000	0.020910
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.064200	10.000000	0.041820
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.385200	60.000000	0.250922
			Subtotal		0.642000	100.0000000	0.418204
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.026998	99.990000	0.017586
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.010000	0.000002
			Subtotal		0.027000	100.0000000	0.017588
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.020998	99.990000	0.013678
			Subtotal		0.021000	100.0000000	0.013680
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.004800	2.000000	0.003127
		Copper and its compounds	Copper, metal	7440-50-8	0.216000	90.000000	0.140704
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.019200	8.000000	0.012507
			Subtotal		0.240000	100.0000000	0.156338
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.010000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.059994	99.990000	0.039080
			Subtotal		0.060000	100.0000000	0.039084

Capacitor 2	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015639
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003128
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006255
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.037533
			Subtotal		0.096030	100.0000000	0.062555
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002600
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002603
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003901
			Subtotal		0.005994	100.0000000	0.003904
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000782
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.035173
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003126
			Subtotal		0.059994	100.0000000	0.039080
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.009102
			Subtotal		0.013986	100.0000000	0.009111

Capacitor 3	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024008	25.000000	0.015639
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004802	5.000000	0.003128
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.009603	10.000000	0.006255
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057618	60.000000	0.037533
			Subtotal		0.096030	100.0000000	0.062555
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003992	99.900000	0.002600
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000004	0.100000	0.000003
			Subtotal		0.003996	100.0000000	0.002603
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005988	99.900000	0.003901
			Subtotal		0.005994	100.0000000	0.003904
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000782
		Copper and its compounds	Copper, metal	7440-50-8	0.053995	90.000000	0.035173
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004799	8.000000	0.003126
			Subtotal		0.059994	100.0000000	0.039080
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013972	99.900000	0.009102
			Subtotal		0.013986	100.0000000	0.009111

Capacitor 4	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.012004	25.000000	0.007819
		Manganese and its compounds	Manganese oxide	1344-43-0	0.002401	5.000000	0.001564
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004802	10.000000	0.003128
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.028809	60.000000	0.018766
			Subtotal		0.048015	100.0000000	0.031277
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.001996	99.900000	0.001300
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.100000	0.000001
			Subtotal		0.001998	100.0000000	0.001301
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002994	99.900000	0.001950
			Subtotal		0.002997	100.0000000	0.001952
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000600	2.000000	0.000391
		Copper and its compounds	Copper, metal	7440-50-8	0.026997	90.000000	0.017586
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002400	8.000000	0.001563
			Subtotal		0.029997	100.0000000	0.019540
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000007	0.100000	0.000005
		Tin and its compounds	Tin, metal	7440-31-5	0.006986	99.900000	0.004551
			Subtotal		0.006993	100.0000000	0.004555

Capacitor 5	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.024000	25.000000	0.015634
		Manganese and its compounds	Manganese oxide	1344-43-0	0.004800	5.000000	0.003127
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.009600	10.000000	0.006254
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.057601	60.000000	0.037522
			Subtotal		0.096001	100.0000000	0.062536
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.003996	99.900000	0.002603
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
			Subtotal		0.004000	100.0000000	0.002605
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.005993	99.900000	0.003904
			Subtotal		0.005999	100.0000000	0.003908
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001200	2.000000	0.000782
		Copper and its compounds	Copper, metal	7440-50-8	0.053999	90.000000	0.035176
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.004800	8.000000	0.003127
			Subtotal		0.059999	100.0000000	0.039084
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000009
		Tin and its compounds	Tin, metal	7440-31-5	0.013986	99.900000	0.009111
			Subtotal		0.014000	100.0000000	0.009120

Capacitor 6	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.058364	25.000000	0.038018
		Manganese and its compounds	Manganese oxide	1344-43-0	0.011673	5.000000	0.007604
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.023346	10.000000	0.015207
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.140073	60.000000	0.091245
			Subtotal		0.233455	100.0000000	0.152074
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.009817	99.990000	0.006395
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009818	100.0000000	0.006396
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007635	99.990000	0.004974
			Subtotal		0.007636	100.0000000	0.004974
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001746	2.000000	0.001137
		Copper and its compounds	Copper, metal	7440-50-8	0.078545	90.000000	0.051165
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006982	8.000000	0.004548
			Subtotal		0.087273	100.0000000	0.056850
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.021816	99.990000	0.014211
			Subtotal		0.021818	100.0000000	0.014212

Capacitor 7	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.034850
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006970
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013940
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.083641
			Subtotal		0.214000	100.0000000	0.139401
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005862
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005863
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004559
			Subtotal		0.007000	100.0000000	0.004560
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001042
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.046901
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004169
			Subtotal		0.080000	100.0000000	0.052113
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.013027
			Subtotal		0.020000	100.0000000	0.013028

Capacitor 8	Ceramic	Barium and its compounds	Barium titanate	12047-27-7	0.101149	99.900000	0.065889
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000101	0.100000	0.000066
			Subtotal		0.101250	100.0000000	0.065955
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.002248	99.900000	0.001464
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000002
			Subtotal		0.002250	100.0000000	0.001466
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000023	0.100000	0.000015
		Nickel and its compounds	Nickel, metal	7440-02-0	0.022478	99.900000	0.014642
			Subtotal		0.022500	100.0000000	0.014657
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002248	99.900000	0.001464
			Subtotal		0.002250	100.0000000	0.001466
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000047	0.100000	0.000031
		Nickel and its compounds	Nickel, metal	7440-02-0	0.047203	99.900000	0.030748
			Subtotal		0.047250	100.0000000	0.030779
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000005	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004496	99.900000	0.002928
			Subtotal		0.004500	100.0000000	0.002931

Capacitor 9	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.034851
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006970
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.021400	10.000000	0.013940
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128401	60.000000	0.083641
			Subtotal		0.214002	100.0000000	0.139402
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008990	99.900000	0.005856
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000009	0.100000	0.000006
			Subtotal		0.008999	100.0000000	0.005862
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006992	99.900000	0.004555
			Subtotal		0.006999	100.0000000	0.004559
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001042
		Copper and its compounds	Copper, metal	7440-50-8	0.071999	90.000000	0.046900
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004169
			Subtotal		0.079999	100.0000000	0.052112
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000020	0.100000	0.000013
		Tin and its compounds	Tin, metal	7440-31-5	0.019981	99.900000	0.013016
			Subtotal		0.020001	100.0000000	0.013029

Capacitor 10	Ceramic	Calcium and its compounds	Calcium monoxide	1305-78-8	0.053500	25.000000	0.034850
		Manganese and its compounds	Manganese oxide	1344-43-0	0.010700	5.000000	0.006970
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.021400	10.000000	0.013940
		Zirconium and its compounds	Zirconium oxide	1314-23-4	0.128400	60.000000	0.083641
			Subtotal		0.214000	100.0000000	0.139401
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.008999	99.990000	0.005862
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
			Subtotal		0.009000	100.0000000	0.005863
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006999	99.990000	0.004559
			Subtotal		0.007000	100.0000000	0.004560
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001600	2.000000	0.001042
		Copper and its compounds	Copper, metal	7440-50-8	0.072000	90.000000	0.046901
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006400	8.000000	0.004169
			Subtotal		0.080000	100.0000000	0.052113
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000002	0.010000	0.000001
		Tin and its compounds	Tin, metal	7440-31-5	0.019998	99.990000	0.013027
			Subtotal		0.020000	100.0000000	0.013028

Capacitor 11	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.132001	60.000000	0.085986
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.022000	10.000000	0.014331
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.066000	30.000000	0.042993
			Subtotal		0.220001	100.0000000	0.143310
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.007991	99.900000	0.005206
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000008	0.100000	0.000005
			Subtotal		0.007999	100.0000000	0.005211
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006992	99.900000	0.004555
			Subtotal		0.006999	100.0000000	0.004559
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.001520	2.000000	0.000990
		Copper and its compounds	Copper, metal	7440-50-8	0.068399	90.000000	0.044556
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006080	8.000000	0.003960
			Subtotal		0.075999	100.0000000	0.049506
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000019	0.100000	0.000012
		Tin and its compounds	Tin, metal	7440-31-5	0.018982	99.900000	0.012365
			Subtotal		0.019001	100.0000000	0.012378

Capacitor 12	Ceramic	Barium and its compounds	Barium oxide	1304-28-5	0.264001	60.000000	0.171973
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.044000	10.000000	0.028662
		Titanium and its compounds	Titanium (IV) Oxide	13463-67-7	0.132001	30.000000	0.085986
			Subtotal		0.440002	100.0000000	0.286621
	Inner Electrode	Copper and its compounds	Copper, metal	7440-50-8	0.015982	99.900000	0.010411
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000016	0.100000	0.000010
			Subtotal		0.015998	100.0000000	0.010422
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000014	0.100000	0.000009
		Nickel and its compounds	Nickel, metal	7440-02-0	0.013985	99.900000	0.009110
			Subtotal		0.013999	100.0000000	0.009119
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.003040	2.000000	0.001980
		Copper and its compounds	Copper, metal	7440-50-8	0.136798	90.000000	0.089111
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.012160	8.000000	0.007921
			Subtotal		0.151998	100.0000000	0.099013
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000038	0.100000	0.000025
		Tin and its compounds	Tin, metal	7440-31-5	0.037965	99.900000	0.024731
			Subtotal		0.038003	100.0000000	0.024755

Die Encapsulant	Die Encapsulant	Epoxy Resins	Tetramethylbiphenyl diglycidyl ether	85954-11-6	8.314870	8.500000	5.416371
		Inorganic Silicon compounds	Silica, vitreous	60676-86-0	83.148700	85.000000	54.163711
		Inorganic compounds	Carbon Black	1333-86-4	0.684754	0.700000	0.446054
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		5.673676	5.800000	3.695877
			Subtotal		97.822000	100.0000000	63.722012

Epoxy Adhesive	Epoxy Adhesive	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.028745	3.061200	0.018725
		Phenols and Phenolic Resins	Proprietary Material-Other phenolic resins		0.028745	3.061200	0.018725
		Silver and its compounds	Silver, metal	7440-22-4	0.881511	93.877600	0.574223
			Subtotal		0.939000	100.0000000	0.611672

Inductor 1	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.018814	99.990000	0.012256
			Subtotal		0.018816	100.0000000	0.012257
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.037645	40.000000	0.024522
		Boron and its compounds	Boron oxide	1303-86-2	0.009411	10.000000	0.006130
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.047056	50.000000	0.030653
			Subtotal		0.094112	100.0000000	0.061305
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006207	99.990000	0.004044
			Subtotal		0.006208	100.0000000	0.004044
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.010000	0.000002
		Silver and its compounds	Silver, metal	7440-22-4	0.025421	99.990000	0.016560
			Subtotal		0.025424	100.0000000	0.016561
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000358	5.000000	0.000233
		Boron and its compounds	Boron oxide	1303-86-2	0.001073	15.000000	0.000699
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000358	5.000000	0.000233
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.005006	70.000000	0.003261
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000358	5.000000	0.000233
			Subtotal		0.007152	100.0000000	0.004659
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.008287	99.990000	0.005398
			Subtotal		0.008288	100.0000000	0.005399

Inductor 2	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.060001	40.000000	0.039085
		Boron and its compounds	Boron oxide	1303-86-2	0.015000	10.000000	0.009771
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.075001	50.000000	0.048856
			Subtotal		0.150003	100.0000000	0.097713
	Glass	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000500	5.000000	0.000326
		Boron and its compounds	Boron oxide	1303-86-2	0.001500	15.000000	0.000977
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000500	5.000000	0.000326
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.006999	70.000000	0.004559
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000500	5.000000	0.000326
			Subtotal		0.009999	100.0000000	0.006514
	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000030	0.100000	0.000019
		Silver and its compounds	Silver, metal	7440-22-4	0.029969	99.900000	0.019522
			Subtotal		0.029999	100.0000000	0.019542
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003996	99.900000	0.002603
			Subtotal		0.004000	100.0000000	0.002605
	Outer Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000020	0.100000	0.000013
		Silver and its compounds	Silver, metal	7440-22-4	0.019980	99.900000	0.013015
			Subtotal		0.020000	100.0000000	0.013028
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.005993	99.900000	0.003904
			Subtotal		0.005999	100.0000000	0.003908

Inductor 3	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020000	40.000000	0.013028
		Boron and its compounds	Boron oxide	1303-86-2	0.005000	10.000000	0.003257
		Inorganic Silicon compounds	Quartz	14808-60-7	0.025000	50.000000	0.016285
			Subtotal		0.050000	100.0000000	0.032570
	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.009999	99.990000	0.006514
			Subtotal		0.010000	100.0000000	0.006514
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003299	99.990000	0.002149
			Subtotal		0.003300	100.0000000	0.002149
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.013498	99.990000	0.008793
			Subtotal		0.013500	100.0000000	0.008794
	Protective Coating	Aluminum and its compounds	Aluminum oxide	1302-74-5	0.000190	5.000000	0.000124
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000371
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000124
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002661	70.000000	0.001733
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000190	5.000000	0.000124
			Subtotal		0.003801	100.0000000	0.002476
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004399	99.990000	0.002866
			Subtotal		0.004400	100.0000000	0.002866

Inductor 4	Inner Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.009999	99.990000	0.006514
			Subtotal		0.010000	100.0000000	0.006514
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020000	40.000000	0.013028
		Boron and its compounds	Boron oxide	1303-86-2	0.005000	10.000000	0.003257
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.025000	50.000000	0.016285
			Subtotal		0.050000	100.0000000	0.032571
	Nickel Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003299	99.990000	0.002149
			Subtotal		0.003300	100.0000000	0.002149
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000001
		Silver and its compounds	Silver, metal	7440-22-4	0.013498	99.990000	0.008793
			Subtotal		0.013500	100.0000000	0.008794
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000190	5.000000	0.000124
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000371
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000124
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002660	70.000000	0.001733
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000190	5.000000	0.000124
			Subtotal		0.003800	100.0000000	0.002476
	Tin Plating	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000001	0.010000	0.000000
		Tin and its compounds	Tin, metal	7440-31-5	0.004399	99.990000	0.002866
			Subtotal		0.004400	100.0000000	0.002866

Inductor 5	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.112292	80.000000	0.073148
		Calcium and its compounds	Calcium monoxide	1305-78-8	0.007018	5.000000	0.004572
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.014037	10.000000	0.009144
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.007018	5.000000	0.004572
			Subtotal		0.140365	100.0000000	0.091435
	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	0.002920	99.900000	0.001902
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
			Subtotal		0.002923	100.0000000	0.001904
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002133	99.900000	0.001389
			Subtotal		0.002135	100.0000000	0.001391
	Outer Electrode	Boron and its compounds	Boron oxide	1303-86-2	0.000039	1.000000	0.000025
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.000350	9.000000	0.000228
		Silver and its compounds	Silver, metal	7440-22-4	0.003496	90.000000	0.002278
			Subtotal		0.003885	100.0000000	0.002531
	Protective Coating 1	Epoxy Resins	Proprietary Material-Other Epoxy resins		0.004788	60.000000	0.003119
		Magnesium and its compounds	Talc	14807-96-6	0.002394	30.000000	0.001559
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000798	10.000000	0.000520
			Subtotal		0.007980	100.0000000	0.005198
	Protective Coating 2	Anhydrides	Coconut fatty acids, pentaerythritol, phthalic anhydride, benzoic acid resin	68604-67-1	0.000900	90.000000	0.000586
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000100	10.000000	0.000065
			Subtotal		0.001000	100.0000000	0.000651
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
		Tin and its compounds	Tin, metal	7440-31-5	0.007185	99.900000	0.004681
			Subtotal		0.007193	100.0000000	0.004685
	Wire	Copper and its compounds	Copper, metal	7440-50-8	0.009510	99.900000	0.006195
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
			Subtotal		0.009520	100.0000000	0.006201

Inductor 6	Inner Electrode	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000010	0.100000	0.000006
		Silver and its compounds	Silver, metal	7440-22-4	0.009986	99.900000	0.006505
			Subtotal		0.009996	100.0000000	0.006511
	Insulation	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.020002	40.000000	0.013030
		Boron and its compounds	Boron oxide	1303-86-2	0.005001	10.000000	0.003257
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.025003	50.000000	0.016287
			Subtotal		0.050006	100.0000000	0.032574
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003295	99.900000	0.002146
			Subtotal		0.003298	100.0000000	0.002148
	Outer Electrode	Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000013	0.100000	0.000009
		Silver and its compounds	Silver, metal	7440-22-4	0.013484	99.900000	0.008784
			Subtotal		0.013498	100.0000000	0.008793
	Protective Coating	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.000190	5.000000	0.000124
		Boron and its compounds	Boron oxide	1303-86-2	0.000570	15.000000	0.000371
		Cobalt and its compounds	Cobalt oxide	1307-96-6	0.000190	5.000000	0.000124
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	0.002660	70.000000	0.001733
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000190	5.000000	0.000124
			Subtotal		0.003799	100.0000000	0.002475
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004399	99.900000	0.002865
			Subtotal		0.004403	100.0000000	0.002868

Resistor 1	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000150	5.000000	0.000098
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000150	5.000000	0.000098
		Silver and its compounds	Silver, metal	7440-22-4	0.002704	90.000000	0.001762
			Subtotal		0.003005	100.0000000	0.001957
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.204302	96.000000	0.133084
		Inorganic Silicon compounds	Quartz	14808-60-7	0.005320	2.500000	0.003466
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.003192	1.500000	0.002079
			Subtotal		0.212815	100.0000000	0.138629
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000342	15.000000	0.000223
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000034	1.500000	0.000022
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000114	5.000000	0.000074
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000114	5.000000	0.000074
		Silver and its compounds	Silver, metal	7440-22-4	0.001675	73.500000	0.001091
			Subtotal		0.002279	100.0000000	0.001484
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.003627	99.900000	0.002363
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000002
			Subtotal		0.003631	100.0000000	0.002365
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
		Nickel and its compounds	Nickel, metal	7440-02-0	0.007354	99.900000	0.004791
			Subtotal		0.007362	100.0000000	0.004796
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.001925	42.000000	0.001254
		Inorganic compounds	Carbon Black	1333-86-4	0.000458	10.000000	0.000298
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.002200	48.000000	0.001433
			Subtotal		0.004582	100.0000000	0.002985
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.000822	45.000000	0.000536
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000183	10.000000	0.000119
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000823	45.000000	0.000536
			Subtotal		0.001828	100.0000000	0.001191
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000756	20.000000	0.000493
		Nickel and its compounds	Nickel, metal	7440-02-0	0.003025	80.000000	0.001970
			Subtotal		0.003781	100.0000000	0.002463
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000007	0.100000	0.000005
		Tin and its compounds	Tin, metal	7440-31-5	0.007354	99.900000	0.004791
			Subtotal		0.007362	100.0000000	0.004796
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000086	2.300000	0.000056
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000023	0.600000	0.000015
		Polymers	Ethyl cellulose	9004-57-3	0.000154	4.100000	0.000100
		Silver and its compounds	Silver, metal	7440-22-4	0.003493	93.000000	0.002275
			Subtotal		0.003756	100.0000000	0.002447

Resistor 2	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000350	5.000000	0.000228
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000350	5.000000	0.000228
		Silver and its compounds	Silver, metal	7440-22-4	0.006303	90.000000	0.004106
			Subtotal		0.007004	100.0000000	0.004562
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.338172	96.000000	0.220288
		Inorganic Silicon compounds	Quartz	14808-60-7	0.008807	2.500000	0.005737
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.005284	1.500000	0.003442
			Subtotal		0.352263	100.0000000	0.229467
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.001449	15.000000	0.000944
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000145	1.500000	0.000094
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000483	5.000000	0.000315
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000483	5.000000	0.000315
		Silver and its compounds	Silver, metal	7440-22-4	0.007098	73.500000	0.004624
			Subtotal		0.009657	100.0000000	0.006291
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.003259	99.900000	0.002123
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000003	0.100000	0.000002
			Subtotal		0.003263	100.0000000	0.002125
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000019	0.100000	0.000012
		Nickel and its compounds	Nickel, metal	7440-02-0	0.018991	99.900000	0.012371
			Subtotal		0.019009	100.0000000	0.012383
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.003014	42.000000	0.001964
		Inorganic compounds	Carbon Black	1333-86-4	0.000718	10.000000	0.000467
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.003445	48.000000	0.002244
			Subtotal		0.007177	100.0000000	0.004675
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.003993	45.000000	0.002601
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000887	10.000000	0.000578
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.003993	45.000000	0.002601
			Subtotal		0.008874	100.0000000	0.005781
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000748	20.000000	0.000487
		Nickel and its compounds	Nickel, metal	7440-02-0	0.002993	80.000000	0.001950
			Subtotal		0.003741	100.0000000	0.002437
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000019	0.100000	0.000012
		Tin and its compounds	Tin, metal	7440-31-5	0.018991	99.900000	0.012371
			Subtotal		0.019009	100.0000000	0.012383
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000115	2.300000	0.000075
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000030	0.600000	0.000020
		Polymers	Ethyl cellulose	9004-57-3	0.000205	4.100000	0.000134
		Silver and its compounds	Silver, metal	7440-22-4	0.004652	93.000000	0.003031
			Subtotal		0.005003	100.0000000	0.003259

Resistor 3	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000117	5.000000	0.000076
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000117	5.000000	0.000076
		Silver and its compounds	Silver, metal	7440-22-4	0.002101	90.000000	0.001369
			Subtotal		0.002335	100.0000000	0.001521
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.112724	96.000000	0.073429
		Inorganic Silicon compounds	Quartz	14808-60-7	0.002936	2.500000	0.001912
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.001761	1.500000	0.001147
			Subtotal		0.117421	100.0000000	0.076489
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000483	15.000000	0.000315
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000048	1.500000	0.000031
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000161	5.000000	0.000105
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000161	5.000000	0.000105
		Silver and its compounds	Silver, metal	7440-22-4	0.002366	73.500000	0.001541
			Subtotal		0.003219	100.0000000	0.002097
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.001086	99.900000	0.000708
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000001	0.100000	0.000001
			Subtotal		0.001087	100.0000000	0.000708
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Nickel and its compounds	Nickel, metal	7440-02-0	0.006330	99.900000	0.004124
			Subtotal		0.006337	100.0000000	0.004128
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.001005	42.000000	0.000655
		Inorganic compounds	Carbon Black	1333-86-4	0.000239	10.000000	0.000156
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.001148	48.000000	0.000748
			Subtotal		0.002393	100.0000000	0.001558
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.001331	45.000000	0.000867
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000296	10.000000	0.000193
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001331	45.000000	0.000867
			Subtotal		0.002958	100.0000000	0.001927
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000249	20.000000	0.000162
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000998	80.000000	0.000650
			Subtotal		0.001247	100.0000000	0.000812
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
		Tin and its compounds	Tin, metal	7440-31-5	0.006330	99.900000	0.004124
			Subtotal		0.006337	100.0000000	0.004128
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000038	2.300000	0.000025
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000010	0.600000	0.000006
		Polymers	Ethyl cellulose	9004-57-3	0.000068	4.100000	0.000044
		Silver and its compounds	Silver, metal	7440-22-4	0.001551	93.000000	0.001010
			Subtotal		0.001667	100.0000000	0.001086

Resistor 4	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000082	5.000000	0.000053
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000082	5.000000	0.000053
		Silver and its compounds	Silver, metal	7440-22-4	0.001478	90.000000	0.000963
			Subtotal		0.001643	100.0000000	0.001070
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.111680	96.000000	0.072749
		Inorganic Silicon compounds	Quartz	14808-60-7	0.002908	2.500000	0.001894
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.001745	1.500000	0.001137
			Subtotal		0.116333	100.0000000	0.075781
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000187	15.000000	0.000122
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000019	1.500000	0.000012
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000062	5.000000	0.000041
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000062	5.000000	0.000041
		Silver and its compounds	Silver, metal	7440-22-4	0.000915	73.500000	0.000596
			Subtotal		0.001246	100.0000000	0.000812
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.001983	99.900000	0.001292
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000002	0.100000	0.000001
			Subtotal		0.001985	100.0000000	0.001293
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Nickel and its compounds	Nickel, metal	7440-02-0	0.004020	99.900000	0.002619
			Subtotal		0.004024	100.0000000	0.002621
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.001052	42.000000	0.000685
		Inorganic compounds	Carbon Black	1333-86-4	0.000251	10.000000	0.000163
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.001202	48.000000	0.000783
			Subtotal		0.002505	100.0000000	0.001632
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.000450	45.000000	0.000293
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000100	10.000000	0.000065
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.000450	45.000000	0.000293
			Subtotal		0.001000	100.0000000	0.000651
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.000413	20.000000	0.000269
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001654	80.000000	0.001077
			Subtotal		0.002067	100.0000000	0.001346
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000004	0.100000	0.000003
		Tin and its compounds	Tin, metal	7440-31-5	0.004020	99.900000	0.002619
			Subtotal		0.004024	100.0000000	0.002621
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000047	2.300000	0.000031
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000012	0.600000	0.000008
		Polymers	Ethyl cellulose	9004-57-3	0.000084	4.100000	0.000055
		Silver and its compounds	Silver, metal	7440-22-4	0.001909	93.000000	0.001244
			Subtotal		0.002053	100.0000000	0.001337

Resistor 5	Bottom Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000246	5.000000	0.000160
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000246	5.000000	0.000160
		Silver and its compounds	Silver, metal	7440-22-4	0.004435	90.000000	0.002889
			Subtotal		0.004928	100.0000000	0.003210
	Ceramic	Aluminum and its compounds	Aluminum Oxides (Al2O3)	1344-28-1	0.335043	96.000000	0.218250
		Inorganic Silicon compounds	Quartz	14808-60-7	0.008725	2.500000	0.005684
		Magnesium and its compounds	Magnesium-oxide	1309-48-4	0.005235	1.500000	0.003410
			Subtotal		0.349003	100.0000000	0.227343
	Conductor	Epoxy Resins	Epichlorohydrin, o-cresol, formaldehyde polymer	29690-82-2	0.000561	15.000000	0.000365
		Nickel and its compounds	Nickel, metal	7440-02-0	0.000056	1.500000	0.000036
		Phenols and Phenolic Resins	Phenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane	25068-38-6	0.000187	5.000000	0.000122
		Phenols and Phenolic Resins	Phenol, polymer with formaldehyde	9003-35-4	0.000187	5.000000	0.000122
		Silver and its compounds	Silver, metal	7440-22-4	0.002747	73.500000	0.001789
			Subtotal		0.003737	100.0000000	0.002434
	Glaze	Lead and its compounds	Frits, chemicals	65997-18-4	0.005948	99.900000	0.003875
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000006	0.100000	0.000004
			Subtotal		0.005954	100.0000000	0.003879
	Nickel Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000012	0.100000	0.000008
		Nickel and its compounds	Nickel, metal	7440-02-0	0.012061	99.900000	0.007857
			Subtotal		0.012073	100.0000000	0.007864
	Protective Coating	Inorganic Silicon compounds	Silica, vitreous	60676-86-0	0.003156	42.000000	0.002056
		Inorganic compounds	Carbon Black	1333-86-4	0.000751	10.000000	0.000490
		Phenols and Phenolic Resins	Diglycidyl bisphenol A resin	25085-99-8	0.003607	48.000000	0.002350
			Subtotal		0.007515	100.0000000	0.004895
	Resistive Layer	Lead and its compounds	Frits, chemicals	65997-18-4	0.001349	45.000000	0.000879
		Palladium and its compounds	Palladium, metal	7440-05-3	0.000300	10.000000	0.000195
		Ruthenium and its compounds	Ruthenium oxide	12036-10-1	0.001349	45.000000	0.000879
			Subtotal		0.002998	100.0000000	0.001953
	Sputter	Chromium and Chromium III compounds	Chromium, metal	7440-47-3	0.001240	20.000000	0.000808
		Nickel and its compounds	Nickel, metal	7440-02-0	0.004961	80.000000	0.003231
			Subtotal		0.006201	100.0000000	0.004039
	Tin Plating	Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000012	0.100000	0.000008
		Tin and its compounds	Tin, metal	7440-31-5	0.012061	99.900000	0.007857
			Subtotal		0.012073	100.0000000	0.007864
	Top Conductor	Copper and its compounds	Cupric oxide	1317-38-0	0.000142	2.300000	0.000092
		Lead and its compounds	Frits, chemicals	65997-18-4	0.000037	0.600000	0.000024
		Polymers	Ethyl cellulose	9004-57-3	0.000253	4.100000	0.000164
		Silver and its compounds	Silver, metal	7440-22-4	0.005728	93.000000	0.003732
			Subtotal		0.006160	100.0000000	0.004012

Semiconductor Die 1	Die	Inorganic Silicon compounds	Silicon carbide	409-21-2	0.393041	95.200000	0.256030
		Inorganic compounds	Gallium nitride	25617-97-4	0.015276	3.700000	0.009951
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004541	1.100000	0.002958
			Subtotal		0.412858	100.0000000	0.268939
	Metallization Layer	Gold and its compounds	Gold, metal	7440-57-5	0.238322	98.288400	0.155245
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000243	0.100100	0.000158
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001456	0.600500	0.000949
		Titanium and its compounds	Titanium, metal	7440-32-6	0.001238	0.510500	0.000806
		Tungsten and its compounds	Tungsten, metal	7440-33-7	0.001214	0.500500	0.000790
			Subtotal		0.242472	100.0000000	0.157948

Semiconductor Die 2	Die	Inorganic Silicon compounds	Silicon carbide	409-21-2	0.393041	95.200000	0.256030
		Inorganic compounds	Gallium nitride	25617-97-4	0.015276	3.700000	0.009951
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.004541	1.100000	0.002958
			Subtotal		0.412858	100.0000000	0.268939
	Metallization Layer	Gold and its compounds	Gold, metal	7440-57-5	0.238322	98.288400	0.155245
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.000243	0.100100	0.000158
		Nickel and its compounds	Nickel, metal	7440-02-0	0.001456	0.600500	0.000949
		Titanium and its compounds	Titanium, metal	7440-32-6	0.001238	0.510500	0.000806
		Tungsten and its compounds	Tungsten, metal	7440-33-7	0.001214	0.500500	0.000790
			Subtotal		0.242472	100.0000000	0.157948

Semiconductor Die 3	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.519400	98.000000	0.338341
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.010600	2.000000	0.006905
			Subtotal		0.530000	100.0000000	0.345246

Semiconductor Die 4	Semiconductor Die	Inorganic Silicon compounds	Silicon	7440-21-3	0.627200	98.000000	0.408563
		Miscellaneous substances	Other miscellaneous substances (less than 10%).		0.012800	2.000000	0.008338
			Subtotal		0.640000	100.0000000	0.416901

Solder Paste	Solder Paste	Copper and its compounds	Copper, metal	7440-50-8	0.007845	0.500000	0.005110
		Silver and its compounds	Silver, metal	7440-22-4	0.047070	3.000000	0.030662
		Tin and its compounds	Tin, metal	7440-31-5	1.514085	96.500000	0.986287
			Subtotal		1.569000	100.0000000	1.022059

Substrate, Pre-plated Au	Copper Plating	Copper and its compounds	Copper, metal	7440-50-8	29.967810	99.990000	19.521265
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.002997	0.010000	0.001952
			Subtotal		29.970807	100.0000000	19.523217
	Gold Plating	Gold and its compounds	Gold, metal	7440-57-5	0.317360	99.990000	0.206731
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		0.000032	0.010000	0.000021
			Subtotal		0.317391	100.0000000	0.206751
	Substrate Core	Inorganic Silicon compounds	Fibrous-glass-wool	65997-17-3	3.107714	23.000000	2.024389
		Inorganic Silicon compounds	Silicon dioxide	7631-86-9	6.134358	45.400000	3.995968
		Miscellaneous substances	Proprietary Material-Other miscellaneous substances.		1.121479	8.300000	0.730541
		Polymers	BT Resin (CAS# 13676-54-5/25722-66-1)		3.148250	23.300000	2.050794
			Subtotal		13.511801	100.0000000	8.801692

			Total		153.513670	100.0000000	100.0000000

Note(s):
¹Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
产品内容声明 A5M36TG140T2 Product content declaration of A5M36TG140T2		上次修订 Last Revision (GMT): Saturday, 31 August 2024, 10:14:00 PM

部件名称 Name of the part	均质材料 Homogeneous Material	有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
部件名称 Name of the part	均质材料 Homogeneous Material	铅(Pb)	镉(Cd)	汞(Hg)	六价铬(Cr-VI)	多溴联苯(PBB)	多溴二苯醚(PBDE)
焊丝-金 Bonding Wire - Au	焊丝-金 Bonding Wire - Au	O	O	O	O	O	O
电容器 Capacitor 1	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 4	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 6	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 7	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 8	陶瓷的 Ceramic	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 9	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 10	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 11	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电容器 Capacitor 12	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
芯片密封胶 Die Encapsulant	芯片密封胶 Die Encapsulant	O	O	O	O	O	O
环氧树脂粘合剂 Epoxy Adhesive	环氧树脂粘合剂 Epoxy Adhesive	O	O	O	O	O	O
电感 Inductor 1	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 2	陶瓷的 Ceramic	O	O	O	O	O	O
	玻璃 Glass	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 3	陶瓷的 Ceramic	O	O	O	O	O	O
	内电极 Inner Electrode	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 4	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电感 Inductor 5	陶瓷的 Ceramic	O	O	O	O	O	O
	镀铜 Copper Plating	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating 1	O	O	O	O	O	O
	防护涂料 Protective Coating 2	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	线 Wire	O	O	O	O	O	O
电感 Inductor 6	内电极 Inner Electrode	O	O	O	O	O	O
	绝缘 Insulation	O	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	外电极 Outer Electrode	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
电阻 Resistor 1	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 2	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 3	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 4	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
电阻 Resistor 5	底导体 Bottom Conductor	O	O	O	O	O	O
	陶瓷的 Ceramic	O	O	O	O	O	O
	导体 Conductor	O	O	O	O	O	O
	釉 Glaze	X	O	O	O	O	O
	镀镍层 Nickel Plating	O	O	O	O	O	O
	防护涂料 Protective Coating	O	O	O	O	O	O
	电阻层 Resistive Layer	X	O	O	O	O	O
	溅射 Sputter	O	O	O	O	O	O
	镀锡 Tin Plating	O	O	O	O	O	O
	顶部电导体 Top Conductor	X	O	O	O	O	O
半导体芯片 Semiconductor Die 1	半导体芯片 Die	O	O	O	O	O	O
	金属化层 Metallization Layer	O	O	O	O	O	O
半导体芯片 Semiconductor Die 2	半导体芯片 Die	O	O	O	O	O	O
	金属化层 Metallization Layer	O	O	O	O	O	O
半导体芯片 Semiconductor Die 3	半导体芯片 Semiconductor Die	O	O	O	O	O	O
半导体芯片 Semiconductor Die 4	半导体芯片 Semiconductor Die	O	O	O	O	O	O
焊锡膏 Solder Paste	焊锡膏 Solder Paste	O	O	O	O	O	O
基材，预镀金 Substrate, Pre-plated Au	镀铜 Copper Plating	O	O	O	O	O	O
	镀金材料 Gold Plating	O	O	O	O	O	O
	有机基质芯 Substrate Core	O	O	O	O	O	O

O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。

O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.

X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。

X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.

备注： 该半导体产品的环保使用期限（EFUP）为50年。

Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.

免责声明 Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。 All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

免责声明
Disclaimer

本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而，恩智浦不对该等信息的精确性和完整性给予任何陈述和保证，且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改，无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约，或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

NXP Semiconductors
Compliance Documentation of A5M36TG140T2		Last Revision (GMT): Saturday, 31 August 2024, 10:14:00 PM

Subpart	Homogeneous Material	Certificate of Analysis(CoA)
Subpart	Homogeneous Material	RoHS	Phthalates *	Halogens *	Antimony *
Bonding Wire - Au		Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024	Test Report 21 May 2024
Capacitor 1	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 2	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 3	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 4	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 20 May 2022	Test Report 20 May 2022
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Test Report 20 May 2022
Capacitor 5	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 6	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 7	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 8	CERAMIC	Test Report 3 Oct 2019	Test Report 3 Oct 2019	Test Report 3 Oct 2019	Test Report 3 Oct 2019
	CU PLATING	Test Report 5 Sep 2019	Test Report 5 Sep 2019	Test Report 5 Sep 2019	Test Report 5 Sep 2019
	INNER ELECTRODE	Test Report 18 Oct 2019	Test Report 18 Oct 2019	Test Report 18 Oct 2019	Test Report 18 Oct 2019
	NI PLATING	Test Report 24 Jul 2019	Test Report 24 Jul 2019	Test Report 24 Jul 2019	Test Report 24 Jul 2019
	OUTER ELECTRODE	Test Report 17 Sep 2019	Test Report 17 Sep 2019	Test Report 17 Sep 2019	Test Report 17 Sep 2019
	SN PLATING	Test Report 24 Jul 2019	Test Report 24 Jul 2019	Test Report 24 Jul 2019	Test Report 24 Jul 2019
Capacitor 9	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 10	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 11	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Capacitor 12	CERAMIC	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023	Test Report 27 Nov 2023
	INNER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 29 Sep 2023	Test Report 29 Sep 2023
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER ELECTRODE	Test Report 5 Sep 2024	Test Report 5 Sep 2024	Test Report 21 Sep 2023	Test Report 21 Sep 2023
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Die Encapsulant		Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024	Test Report 30 Jan 2024
Epoxy Adhesive		Test Report 26 Jul 2024	Test Report 26 Jul 2024	Test Report 26 Jul 2024	Test Report 26 Jul 2024
Inductor 1	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	GLAZE (BC)	Not Available	Not Available	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 2	ELECTRODE	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	GLAZE (BC)	Not Available	Not Available	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	INNER GLAZE	Test Report 14 Sep 2022	Test Report 14 Sep 2022	Not Available	Not Available
	NI PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 27 Apr 2023	Test Report 20 May 2022
Inductor 3	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 4	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 5	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Test Report 14 Jun 2022	Test Report 14 Jun 2022
	GLAZE (BB)	Not Available	Not Available	Test Report 24 Sep 2021	Test Report 24 Sep 2021
	GLAZE (BC)	Not Available	Not Available	Test Report 15 Nov 2021	Test Report 15 Nov 2021
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 27 Apr 2023	Not Available
	OUTER GLAZE	Test Report 1 Nov 2022	Test Report 1 Nov 2022	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Inductor 6	ELECTRODE	Test Report 16 May 2024	Test Report 16 May 2024	Not Available	Not Available
	INNER GLAZE	Test Report 31 Aug 2023	Test Report 31 Aug 2023	Not Available	Not Available
	NI PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Not Available
	OUTER GLAZE	Test Report 18 Oct 2023	Test Report 18 Oct 2023	Not Available	Not Available
	SN PLATING	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024	Test Report 12 Apr 2024
Resistor 1	INTERNAL ELECTRODE	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SUSBTRATE	Not Available	Not Available	Not Available	Not Available
Resistor 2	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Resistor 3	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Resistor 4	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Resistor 5	BOTTOM CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	CONDUCTOR	Not Available	Not Available	Not Available	Not Available
	NI PLATING	Not Available	Not Available	Not Available	Not Available
	OVERCOAT	Not Available	Not Available	Not Available	Not Available
	OVERGLAZE	Not Available	Not Available	Not Available	Not Available
	RESISTIVE ELECTRODE	Not Available	Not Available	Not Available	Not Available
	SN PLATING	Not Available	Not Available	Not Available	Not Available
	SPUTTER	Not Available	Not Available	Not Available	Not Available
	SUBSTRATE	Not Available	Not Available	Not Available	Not Available
	TOP CONDUCTOR	Not Available	Not Available	Not Available	Not Available
Semiconductor Die 1		Test Report 28 May 2024	Test Report 28 May 2024	Test Report 28 May 2024	Test Report 28 May 2024
Semiconductor Die 2		Not Available	Not Available	Not Available	Not Available
Semiconductor Die 3		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Semiconductor Die 4		Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023	Test Report 2 Aug 2023
Solder Paste		Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023	Test Report 22 Nov 2023
Substrate, Pre-plated Au	AUS SR-1	Test Report 6 Mar 2024	Test Report 6 Mar 2024	Test Report 23 Mar 2023	Test Report 23 Mar 2023
	CU FOIL	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Test Report 4 Jan 2024	Not Available
	GHPL-970LF	Test Report 8 Feb 2023	Test Report 8 Feb 2023	Test Report 8 Feb 2023	Not Available
For more information: contact us

Note(s):
* NXP does not commit to providing this report for all product materials!

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer