A3M34TL139T2

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Product content declaration of A3M34TL139T2Last Revision (GMT):
Friday, 08 November 2024, 11:59:00 AM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
A3M34TL139T2SOT1831HLLGA27157.077738 mg YesNoYesNickel/Palladium/Gold (Ni/Pd/Au)Othere4contact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9354 265 575282023-11-244Not ApplicableNot ApplicableNot Applicable3 / 168 hours26040 sec.3Kuala Lumpur, Malaysia;External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Bonding Wire - AuBonding Wire - AuGold and its compoundsGold, metal7440-57-50.57504099.9900000.366087
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000580.0100000.000037
Subtotal0.575098100.00000000.366123
Capacitor 1CeramicCalcium and its compoundsCalcium monoxide1305-78-80.02400825.0000000.015284
Manganese and its compoundsManganese oxide1344-43-00.0048025.0000000.003057
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00960310.0000000.006114
Zirconium and its compoundsZirconium oxide1314-23-40.05761860.0000000.036681
Subtotal0.096030100.00000000.061135
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00399299.9000000.002541
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.1000000.000003
Subtotal0.003996100.00000000.002544
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000060.1000000.000004
Nickel and its compoundsNickel, metal7440-02-00.00598899.9000000.003812
Subtotal0.005994100.00000000.003816
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0012002.0000000.000764
Copper and its compoundsCopper, metal7440-50-80.05399590.0000000.034374
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0047998.0000000.003056
Subtotal0.059994100.00000000.038194
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000140.1000000.000009
Tin and its compoundsTin, metal7440-31-50.01397299.9000000.008895
Subtotal0.013986100.00000000.008904
Capacitor 2CeramicCalcium and its compoundsCalcium monoxide1305-78-80.10700025.0000000.068119
Manganese and its compoundsManganese oxide1344-43-00.0214005.0000000.013624
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.04280010.0000000.027248
Zirconium and its compoundsZirconium oxide1314-23-40.25680060.0000000.163486
Subtotal0.428000100.00000000.272477
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.01799899.9900000.011458
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Subtotal0.018000100.00000000.011459
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01399999.9900000.008912
Subtotal0.014000100.00000000.008913
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0032002.0000000.002037
Copper and its compoundsCopper, metal7440-50-80.14400090.0000000.091674
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0128008.0000000.008149
Subtotal0.160000100.00000000.101860
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000003
Tin and its compoundsTin, metal7440-31-50.03999699.9900000.025463
Subtotal0.040000100.00000000.025465
Capacitor 3CeramicCalcium and its compoundsCalcium monoxide1305-78-80.05350025.0000000.034060
Manganese and its compoundsManganese oxide1344-43-00.0107005.0000000.006812
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02140010.0000000.013624
Zirconium and its compoundsZirconium oxide1314-23-40.12840060.0000000.081743
Subtotal0.214000100.00000000.136238
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00899999.9900000.005729
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Subtotal0.009000100.00000000.005730
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004456
Subtotal0.007000100.00000000.004456
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0016002.0000000.001019
Copper and its compoundsCopper, metal7440-50-80.07200090.0000000.045837
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0064008.0000000.004074
Subtotal0.080000100.00000000.050930
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01999899.9900000.012731
Subtotal0.020000100.00000000.012733
Capacitor 4CeramicBarium and its compoundsBarium oxide1304-28-51.27800060.0000000.813610
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.21300010.0000000.135602
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.63900030.0000000.406805
Subtotal2.130000100.00000001.356016
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000560.0100000.000036
Nickel and its compoundsNickel, metal7440-02-00.55794499.9900000.355203
Subtotal0.558000100.00000000.355238
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000040.0100000.000002
Nickel and its compoundsNickel, metal7440-02-00.03599699.9900000.022916
Subtotal0.036000100.00000000.022919
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0076402.0000000.004864
Copper and its compoundsCopper, metal7440-50-80.34380090.0000000.218872
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0305608.0000000.019455
Subtotal0.382000100.00000000.243192
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000090.0100000.000006
Tin and its compoundsTin, metal7440-31-50.09399199.9900000.059837
Subtotal0.094000100.00000000.059843
Capacitor 5CeramicBarium and its compoundsBarium oxide1304-28-50.13200060.0000000.084035
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.02200010.0000000.014006
Titanium and its compoundsTitanium (IV) Oxide13463-67-70.06600030.0000000.042017
Subtotal0.220000100.00000000.140058
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00799999.9900000.005093
Subtotal0.008000100.00000000.005093
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00699999.9900000.004456
Subtotal0.007000100.00000000.004456
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0015202.0000000.000968
Copper and its compoundsCopper, metal7440-50-80.06840090.0000000.043545
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0060808.0000000.003871
Subtotal0.076000100.00000000.048384
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.0100000.000001
Tin and its compoundsTin, metal7440-31-50.01899899.9900000.012095
Subtotal0.019000100.00000000.012096
Capacitor 6CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200425.0000000.007642
Manganese and its compoundsManganese oxide1344-43-00.0024015.0000000.001528
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.00480210.0000000.003057
Zirconium and its compoundsZirconium oxide1314-23-40.02880960.0000000.018341
Subtotal0.048015100.00000000.030568
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199699.9000000.001271
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001998100.00000000.001272
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00299499.9000000.001906
Subtotal0.002997100.00000000.001908
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000382
Copper and its compoundsCopper, metal7440-50-80.02699790.0000000.017187
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001528
Subtotal0.029997100.00000000.019097
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000070.1000000.000005
Tin and its compoundsTin, metal7440-31-50.00698699.9000000.004448
Subtotal0.006993100.00000000.004452
Capacitor 7CeramicCalcium and its compoundsCalcium monoxide1305-78-80.01200025.0000000.007640
Manganese and its compoundsManganese oxide1344-43-00.0024005.0000000.001528
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.00480010.0000000.003056
Zirconium and its compoundsZirconium oxide1314-23-40.02880060.0000000.018335
Subtotal0.048001100.00000000.030558
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00199899.9000000.001272
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.1000000.000001
Subtotal0.002000100.00000000.001273
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.1000000.000002
Nickel and its compoundsNickel, metal7440-02-00.00299799.9000000.001908
Subtotal0.003000100.00000000.001910
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0006002.0000000.000382
Copper and its compoundsCopper, metal7440-50-80.02700090.0000000.017189
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0024008.0000000.001528
Subtotal0.030000100.00000000.019099
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000070.1000000.000005
Tin and its compoundsTin, metal7440-31-50.00699399.9000000.004452
Subtotal0.007000100.00000000.004457
Capacitor 8CeramicCalcium and its compoundsCalcium monoxide1305-78-80.04401425.0000000.028020
Manganese and its compoundsManganese oxide1344-43-00.0088035.0000000.005604
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.01760510.0000000.011208
Zirconium and its compoundsZirconium oxide1314-23-40.10563360.0000000.067249
Subtotal0.176055100.00000000.112082
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00732599.9900000.004664
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Subtotal0.007326100.00000000.004664
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01098899.9900000.006995
Subtotal0.010989100.00000000.006996
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0022002.0000000.001400
Copper and its compoundsCopper, metal7440-50-80.09899090.0000000.063020
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0087998.0000000.005602
Subtotal0.109989100.00000000.070022
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02563899.9900000.016322
Subtotal0.025641100.00000000.016324
Capacitor 9CeramicCalcium and its compoundsCalcium monoxide1305-78-80.04401425.0000000.028020
Manganese and its compoundsManganese oxide1344-43-00.0088035.0000000.005604
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.01760510.0000000.011208
Zirconium and its compoundsZirconium oxide1314-23-40.10563360.0000000.067249
Subtotal0.176055100.00000000.112082
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00732599.9900000.004664
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Subtotal0.007326100.00000000.004664
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01098899.9900000.006995
Subtotal0.010989100.00000000.006996
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0022002.0000000.001400
Copper and its compoundsCopper, metal7440-50-80.09899090.0000000.063020
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0087998.0000000.005602
Subtotal0.109989100.00000000.070022
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02563899.9900000.016322
Subtotal0.025641100.00000000.016324
Capacitor 10CeramicCalcium and its compoundsCalcium monoxide1305-78-80.04401425.0000000.028020
Manganese and its compoundsManganese oxide1344-43-00.0088035.0000000.005604
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.01760510.0000000.011208
Zirconium and its compoundsZirconium oxide1314-23-40.10563360.0000000.067249
Subtotal0.176055100.00000000.112082
Inner ElectrodeCopper and its compoundsCopper, metal7440-50-80.00732599.9900000.004664
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Subtotal0.007326100.00000000.004664
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Nickel and its compoundsNickel, metal7440-02-00.01098899.9900000.006995
Subtotal0.010989100.00000000.006996
Outer ElectrodeBoron and its compoundsBoron oxide1303-86-20.0022002.0000000.001400
Copper and its compoundsCopper, metal7440-50-80.09899090.0000000.063020
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0087998.0000000.005602
Subtotal0.109989100.00000000.070022
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.0100000.000002
Tin and its compoundsTin, metal7440-31-50.02563899.9900000.016322
Subtotal0.025641100.00000000.016324
Die EncapsulantDie EncapsulantEpoxy ResinsProprietary Material-Other Epoxy resins4.8911005.0000003.113809
Inorganic Silicon compoundsSilica, vitreous60676-86-085.10514087.00000054.180268
Inorganic Silicon compoundsSilicon dioxide7631-86-92.9346603.0000001.868285
Inorganic compoundsCarbon Black1333-86-40.4891100.5000000.311381
Magnesium and its compoundsProprietary Material-Other magnesium compounds0.0978220.1000000.062276
Miscellaneous substancesProprietary Material-Other miscellaneous substances.1.2716861.3000000.809590
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins2.9346603.0000001.868285
Zinc and its compoundsProprietary Material-Other zinc compounds0.0978220.1000000.062276
Subtotal97.822000100.000000062.276171
Epoxy AdhesiveEpoxy AdhesiveEpoxy ResinsProprietary Material-Other Epoxy resins0.0287453.0612000.018300
Phenols and Phenolic ResinsProprietary Material-Other phenolic resins0.0287453.0612000.018300
Silver and its compoundsSilver, metal7440-22-40.88151193.8776000.561194
Subtotal0.939000100.00000000.597793
Inductor 1CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.12352840.0000000.078642
Boron and its compoundsBoron oxide1303-86-20.03088210.0000000.019660
Inorganic Silicon compoundsSilicon dioxide7631-86-90.15441050.0000000.098302
Subtotal0.308821100.00000000.196604
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000620.1000000.000039
Silver and its compoundsSilver, metal7440-22-40.06170599.9000000.039283
Subtotal0.061766100.00000000.039322
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000200.1000000.000013
Nickel and its compoundsNickel, metal7440-02-00.02036099.9000000.012962
Subtotal0.020380100.00000000.012975
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000830.1000000.000053
Silver and its compoundsSilver, metal7440-22-40.08329799.9000000.053029
Subtotal0.083380100.00000000.053082
Protective CoatingAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0011745.0000000.000747
Boron and its compoundsBoron oxide1303-86-20.00352215.0000000.002242
Cobalt and its compoundsCobalt oxide1307-96-60.0011745.0000000.000747
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01643570.0000000.010463
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0011745.0000000.000747
Subtotal0.023478100.00000000.014947
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000270.1000000.000017
Tin and its compoundsTin, metal7440-31-50.02714799.9000000.017282
Subtotal0.027174100.00000000.017300
Inductor 2InductorAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.04340024.8000000.027630
Boron and its compoundsBoron oxide1303-86-20.0119006.8000000.007576
Cobalt and its compoundsC.I. Pigment Blue 281345-16-00.0007000.4000000.000446
Inorganic Silicon compoundsSilicon dioxide7631-86-90.06160035.2000000.039216
Nickel and its compoundsNickel, metal7440-02-00.0084004.8000000.005348
Silver and its compoundsSilver, metal7440-22-40.03815021.8000000.024287
Tin and its compoundsTin, metal7440-31-50.0108506.2000000.006907
Subtotal0.175000100.00000000.111410
Inductor 3Ceramic 1Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.0007965.0000000.000507
Boron and its compoundsBoron oxide1303-86-20.00238915.0000000.001521
Cobalt and its compoundsCobalt oxide1307-96-60.0007965.0000000.000507
Inorganic Silicon compoundsSilicon dioxide7631-86-90.01114770.0000000.007097
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0007965.0000000.000507
Subtotal0.015925100.00000000.010138
Ceramic 2Aluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.09543840.0000000.060759
Boron and its compoundsBoron oxide1303-86-20.02385910.0000000.015190
Inorganic Silicon compoundsSilicon dioxide7631-86-90.11929850.0000000.075948
Subtotal0.238595100.00000000.151896
Inner ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000050.0100000.000003
Silver and its compoundsSilver, metal7440-22-40.04773599.9900000.030390
Subtotal0.047740100.00000000.030393
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00636999.9900000.004055
Subtotal0.006370100.00000000.004055
Outer ElectrodeMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000030.0100000.000002
Silver and its compoundsSilver, metal7440-22-40.03181299.9900000.020252
Subtotal0.031815100.00000000.020254
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000010.0100000.000001
Tin and its compoundsTin, metal7440-31-50.00955499.9900000.006082
Subtotal0.009555100.00000000.006083
Inductor 4CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.02000040.0000000.012732
Boron and its compoundsBoron oxide1303-86-20.00500010.0000000.003183
Inorganic Silicon compoundsQuartz14808-60-70.02500050.0000000.015915
Subtotal0.050000100.00000000.031831
Inner ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.00999999.9900000.006366
Subtotal0.010000100.00000000.006366
Nickel PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Nickel and its compoundsNickel, metal7440-02-00.00329999.9900000.002100
Subtotal0.003300100.00000000.002101
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000001
Silver and its compoundsSilver, metal7440-22-40.01349899.9900000.008593
Subtotal0.013500100.00000000.008594
Protective CoatingAluminum and its compoundsAluminum oxide1302-74-50.0001905.0000000.000121
Boron and its compoundsBoron oxide1303-86-20.00057015.0000000.000363
Cobalt and its compoundsCobalt oxide1307-96-60.0001905.0000000.000121
Inorganic Silicon compoundsSilicon dioxide7631-86-90.00266170.0000000.001694
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0001905.0000000.000121
Subtotal0.003801100.00000000.002420
Tin PlatingMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000010.0100000.000000
Tin and its compoundsTin, metal7440-31-50.00439999.9900000.002801
Subtotal0.004400100.00000000.002801
Resistor 1Alumina SubstrateAluminum and its compoundsAluminum oxide1302-74-50.19584196.0000000.124678
Inorganic Silicon compoundsQuartz14808-60-70.0051002.5000000.003247
Magnesium and its compoundsMagnesium-oxide1309-48-40.0030601.5000000.001948
Subtotal0.204001100.00000000.129873
GlazeLead and its compoundsFrits, chemicals65997-18-40.00150199.9000000.000955
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000020.1000000.000001
Subtotal0.001502100.00000000.000956
Inner Electrode 1Inorganic Silicon compoundsFibrous-glass-wool65997-17-30.0006856.0000000.000436
Palladium and its compoundsPalladium, metal7440-05-30.0000570.5000000.000036
PolymersEthyl cellulose9004-57-30.0007426.5000000.000472
Silver and its compoundsSilver, metal7440-22-40.00993487.0000000.006324
Subtotal0.011418100.00000000.007269
Inner Electrode 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0000130.1000000.000008
Nickel and its compoundsNickel, metal7440-02-00.01315899.9000000.008377
Subtotal0.013171100.00000000.008385
Outer ElectrodeMiscellaneous substancesOther miscellaneous substances (less than 10%).0.0000110.1000000.000007
Tin and its compoundsTin, metal7440-31-50.01100799.9000000.007007
Subtotal0.011018100.00000000.007014
Protective CoatingInorganic Silicon compoundsSilicon dioxide7631-86-90.00194246.7300000.001237
Inorganic compoundsCarbon Black1333-86-40.0002726.5400000.000173
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00194246.7300000.001237
Subtotal0.004157100.00000000.002646
Resistive LayerInorganic Silicon compoundsSilicon dioxide7631-86-90.00287556.0000000.001830
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0001773.4400000.000112
Ruthenium and its compoundsRuthenium oxide12036-10-10.00208240.5600000.001326
Subtotal0.005133100.00000000.003268
Resistor 2Bottom ConductorCopper and its compoundsCupric oxide1317-38-00.0002345.0000000.000149
Nickel and its compoundsNickel, metal7440-02-00.0002345.0000000.000149
Silver and its compoundsSilver, metal7440-22-40.00421690.0000000.002684
Subtotal0.004685100.00000000.002982
CeramicAluminum and its compoundsAluminum Oxides (Al2O3)1344-28-10.22619496.0000000.144002
Inorganic Silicon compoundsQuartz14808-60-70.0058902.5000000.003750
Magnesium and its compoundsMagnesium-oxide1309-48-40.0035341.5000000.002250
Subtotal0.235619100.00000000.150002
ConductorEpoxy ResinsEpichlorohydrin, o-cresol, formaldehyde polymer29690-82-20.00096915.0000000.000617
Nickel and its compoundsNickel, metal7440-02-00.0000971.5000000.000062
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.0003235.0000000.000206
Phenols and Phenolic ResinsPhenol, polymer with formaldehyde9003-35-40.0003235.0000000.000206
Silver and its compoundsSilver, metal7440-22-40.00474773.5000000.003022
Subtotal0.006459100.00000000.004112
GlazeLead and its compoundsFrits, chemicals65997-18-40.00218099.9000000.001388
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000020.1000000.000001
Subtotal0.002182100.00000000.001389
Nickel PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000130.1000000.000008
Nickel and its compoundsNickel, metal7440-02-00.01270299.9000000.008087
Subtotal0.012715100.00000000.008095
Protective CoatingInorganic Silicon compoundsSilica, vitreous60676-86-00.00201642.0000000.001284
Inorganic compoundsCarbon Black1333-86-40.00048010.0000000.000306
Phenols and Phenolic ResinsDiglycidyl bisphenol A resin25085-99-80.00230448.0000000.001467
Subtotal0.004801100.00000000.003056
Resistive LayerLead and its compoundsFrits, chemicals65997-18-40.00267145.0000000.001700
Palladium and its compoundsPalladium, metal7440-05-30.00059410.0000000.000378
Ruthenium and its compoundsRuthenium oxide12036-10-10.00267145.0000000.001700
Subtotal0.005936100.00000000.003779
SputterChromium and Chromium III compoundsChromium, metal7440-47-30.00050020.0000000.000319
Nickel and its compoundsNickel, metal7440-02-00.00200280.0000000.001274
Subtotal0.002502100.00000000.001593
Tin PlatingMiscellaneous substancesProprietary Material-Other miscellaneous substances.0.0000130.1000000.000008
Tin and its compoundsTin, metal7440-31-50.01270299.9000000.008087
Subtotal0.012715100.00000000.008095
Top ConductorCopper and its compoundsCupric oxide1317-38-00.0000772.3000000.000049
Lead and its compoundsFrits, chemicals65997-18-40.0000200.6000000.000013
PolymersEthyl cellulose9004-57-30.0001374.1000000.000087
Silver and its compoundsSilver, metal7440-22-40.00311293.0000000.001981
Subtotal0.003346100.00000000.002130
Semiconductor Die 1Semiconductor DieInorganic Silicon compoundsSilicon7440-21-32.02789498.0000001.291013
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0413862.0000000.026347
Subtotal2.069280100.00000001.317360
Semiconductor Die 2Semiconductor DieInorganic Silicon compoundsSilicon7440-21-32.47027289.6000001.572643
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0248130.9000000.015797
Nickel and its compoundsNickel, metal7440-02-00.0137850.5000000.008776
Silver and its compoundsSilver, metal7440-22-40.0086850.3150000.005529
Tin and its compoundsTin, metal7440-31-50.2394468.6850000.152438
Subtotal2.757000100.00000001.755182
Solder PasteSolder PasteCopper and its compoundsCopper, metal7440-50-80.0078450.5000000.004994
Silver and its compoundsSilver, metal7440-22-40.0470703.0000000.029966
Tin and its compoundsTin, metal7440-31-51.51408596.5000000.963908
Subtotal1.569000100.00000000.998869
Substrate, Pre-plated NiPdAuCopper FoilCopper and its compoundsCopper, metal7440-50-82.34314599.9000001.491710
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0023450.1000000.001493
Subtotal2.345490100.00000001.493203
Copper PlatingCopper and its compoundsCopper, metal7440-50-825.30377399.90000016.109076
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0253290.1000000.016125
Subtotal25.329102100.000000016.125202
Gold PlatingGold and its compoundsGold, metal7440-57-50.23278399.9000000.148196
Miscellaneous substancesProprietary Material-Other miscellaneous substances.0.0002330.1000000.000148
Subtotal0.233016100.00000000.148344
Solder MaskAromatic amines and their salts1,3,5-Triazine-2,4,6-triamine108-78-10.0012950.1000000.000824
Barium and its compoundsBarium sulfate7727-43-70.25247219.5000000.160731
Inorganic Silicon compoundsSilicon dioxide7631-86-90.1281789.9000000.081602
Magnesium and its compoundsTalc14807-96-60.0375472.9000000.023904
Organic compoundsOther organic compounds.0.0699155.4000000.044510
Phosphorus compoundsDiphenyl(2,4,6-trimethylbenzoyl)phosphine oxide75980-60-80.0103580.8000000.006594
PolymersPlastic: EP - Epoxide, Epoxy0.16054612.4000000.102208
PolymersPlastic: PAK0.63441749.0000000.403887
Subtotal1.294728100.00000000.824260
Substrate PrepregInorganic Silicon compoundsFibrous-glass-wool65997-17-33.50343924.0000002.230386
Inorganic Silicon compoundsSilicon dioxide7631-86-96.53975344.8000004.163387
Miscellaneous substancesOther miscellaneous substances (less than 10%).1.0656307.3000000.678409
PolymersPlastic: EP - Epoxide, Epoxy3.48884223.9000002.221092
Subtotal14.597664100.00000009.293274
Total157.077738100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 A3M34TL139T2
Product content declaration of A3M34TL139T2
上次修订 Last Revision (GMT):
Friday, 08 November 2024, 11:59:00 AM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
焊丝-金
Bonding Wire - Au
焊丝-金
Bonding Wire - Au
OOOOOO
电容器
Capacitor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 2
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 3
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 5
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 6
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 7
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 8
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 9
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电容器
Capacitor 10
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
芯片密封胶
Die Encapsulant
芯片密封胶
Die Encapsulant
OOOOOO
环氧树脂粘合剂
Epoxy Adhesive
环氧树脂粘合剂
Epoxy Adhesive
OOOOOO
电感
Inductor 1
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 2
电感
Inductor
OOOOOO
电感
Inductor 3
陶瓷的
Ceramic 1
OOOOOO

陶瓷的
Ceramic 2
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

镀锡
Tin Plating
OOOOOO
电感
Inductor 4
陶瓷的
Ceramic
OOOOOO

内电极
Inner Electrode
OOOOOO

镀镍层
Nickel Plating
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

镀锡
Tin Plating
OOOOOO
电阻
Resistor 1
氧化铝基材
Alumina Substrate
OOOOOO


Glaze
XOOOOO

内电极
Inner Electrode 1
OOOOOO

内电极
Inner Electrode 2
OOOOOO

外电极
Outer Electrode
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO
电阻
Resistor 2
底导体
Bottom Conductor
OOOOOO

陶瓷的
Ceramic
OOOOOO

导体
Conductor
OOOOOO


Glaze
XOOOOO

镀镍层
Nickel Plating
OOOOOO

防护涂料
Protective Coating
OOOOOO

电阻层
Resistive Layer
XOOOOO

溅射
Sputter
OOOOOO

镀锡
Tin Plating
OOOOOO

顶部电导体
Top Conductor
XOOOOO
半导体芯片
Semiconductor Die 1
半导体芯片
Semiconductor Die
OOOOOO
半导体芯片
Semiconductor Die 2
半导体芯片
Semiconductor Die
OOOOOO
焊锡膏
Solder Paste
焊锡膏
Solder Paste
OOOOOO
基板,预镀镍钯金
Substrate, Pre-plated NiPdAu
铜箔
Copper Foil
OOOOOO

镀铜
Copper Plating
OOOOOO

镀金材料
Gold Plating
OOOOOO

阻焊层
Solder Mask
OOOOOO

基材预浸料
Substrate Prepreg
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品的环保使用期限(EFUP)为50年。
Remark: This semiconductor product has an environmental friendly use period (EFUP) of 50 years.
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of A3M34TL139T2Last Revision (GMT):
Friday, 08 November 2024, 11:59:00 AM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Bonding Wire - AuTest Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Test Report
21 May 2024
Capacitor 1CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 2CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 3CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 4CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 5CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
29 Sep 2023
Test Report
29 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 6CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 7CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Capacitor 8CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
25 Jun 2021
Test Report
25 Jun 2021
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
4 Jun 2021
Capacitor 9CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Capacitor 10CERAMICTest Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
Test Report
27 Nov 2023
INNER ELECTRODETest Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
Test Report
21 Sep 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
20 May 2022
Test Report
20 May 2022
OUTER ELECTRODETest Report
5 Sep 2024
Test Report
5 Sep 2024
Test Report
21 Sep 2023
Test Report
21 Sep 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
Die EncapsulantTest Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Test Report
30 Jan 2024
Epoxy AdhesiveTest Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Test Report
14 Apr 2023
Inductor 1ELECTRODETest Report
16 May 2024
Test Report
16 May 2024
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Not AvailableNot Available
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Not Available
Inductor 2ELECTRODETest Report
16 May 2024
Test Report
16 May 2024
Test Report
14 Jun 2022
Test Report
14 Jun 2022
GLAZE (BB)Not AvailableNot AvailableTest Report
28 Oct 2020
Test Report
28 Oct 2020
GLAZE (BC)Not AvailableNot AvailableTest Report
27 Nov 2020
Test Report
27 Nov 2020
GLAZE BBTest Report
14 Sep 2022
Test Report
14 Sep 2022
Not AvailableNot Available
GLAZE BCTest Report
1 Nov 2022
Test Report
1 Nov 2022
Not AvailableNot Available
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
25 Jun 2021
Test Report
25 Jun 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 3ELECTRODETest Report
16 May 2024
Test Report
16 May 2024
Test Report
14 Jun 2022
Test Report
14 Jun 2022
INNER GLAZETest Report
14 Sep 2022
Test Report
14 Sep 2022
Test Report
24 Sep 2021
Test Report
24 Sep 2021
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
27 Apr 2023
Test Report
20 May 2022
OUTER GLAZETest Report
1 Nov 2022
Test Report
1 Nov 2022
Test Report
15 Nov 2021
Test Report
15 Nov 2021
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Inductor 4ELECTRODETest Report
16 May 2024
Test Report
16 May 2024
Test Report
1 Jun 2023
Test Report
1 Jun 2023
INNER GLAZETest Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
Test Report
31 Aug 2023
NI PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
OUTER GLAZETest Report
18 Oct 2023
Test Report
18 Oct 2023
Test Report
18 Oct 2023
Test Report
18 Oct 2023
SN PLATINGTest Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Test Report
12 Apr 2024
Resistor 1CERAMICNot AvailableNot AvailableTest Report
13 Feb 2020
Not Available
EXTERNAL ELECTRODETest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
INTERNAL ELECTRODETest Report
27 Dec 2019
Test Report
27 Dec 2019
Test Report
27 Dec 2019Test Report
15 Sep 2020
Test Report
27 Dec 2019
NI PLATINGNot AvailableNot AvailableTest Report
4 Oct 2020
Test Report
4 Oct 2020
OVERCOATTest Report
27 Aug 2020
Test Report
27 Aug 2020
Not AvailableNot Available
OVERGLAZETest Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
RESISTIVE ELECTRODETest Report
19 Oct 2020
Test Report
19 Oct 2020
Not AvailableNot Available
SECONDARY ELECTRODETest Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
SN PLATINGTest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
SUSBTRATETest Report
13 Feb 2020
Test Report
13 Feb 2020
Not AvailableTest Report
13 Feb 2020
Resistor 2CERAMICNot AvailableNot AvailableTest Report
13 Feb 2020
Not Available
EXTERNAL ELECTRODETest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
INTERNAL ELECTRODETest Report
27 Dec 2019
Test Report
27 Dec 2019
Test Report
27 Dec 2019Test Report
19 Sep 2020
Test Report
27 Dec 2019
NI PLATINGNot AvailableNot AvailableTest Report
1 Sep 2020
Test Report
1 Sep 2020
OVERCOATTest Report
27 Aug 2020
Test Report
27 Aug 2020
Not AvailableNot Available
OVERGLAZETest Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
Test Report
12 Nov 2020
RESISTIVE ELECTRODETest Report
19 Oct 2020
Test Report
19 Oct 2020
Not AvailableNot Available
SECONDARY ELECTRODETest Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
Test Report
1 Sep 2020
SN PLATINGTest Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
Test Report
1 Jun 2020
SUSBTRATETest Report
13 Feb 2020
Test Report
13 Feb 2020
Not AvailableTest Report
13 Feb 2020
Semiconductor Die 1Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Semiconductor Die 2Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Test Report
18 Jun 2024
Solder PasteTest Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Test Report
22 Nov 2023
Substrate, Pre-plated NiPdAuAUS SR-1Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
Test Report
23 Mar 2023
CU FOILTest Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
Test Report
4 Jan 2024
GHPL-970LFTest Report
22 Mar 2021
Test Report
22 Mar 2021
Test Report
8 Feb 2023
Not Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.