88W8897-B0-CBK/AZ

As a proactive and sustainable company, NXP has decided to publish chemical content information of its product portfolio through direct Internet access.
With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status.
NXP has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database.
NXP products are compliant to the EU Directives RoHS, ELV and the China RoHS.
Please see also our Restricted Substances Declaration.

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NXP Semiconductors
Product content declaration of 88W8897-B0-CBK/AZLast Revision (GMT):
Thursday, 27 June 2024, 11:06:00 PM
Part TypePackage VersionPackage NameTotal part
weight
EnvironmentTermination2nd Level InterconnectFor more information:
Halogen Free (Cl+Br)Lead Free (Pb)EU RoHS CompliantPlatingBase Alloy
88W8897-B0-CBK/AZSOT2105WLCSP15028.448600 mg YesYesYesNot ApplicableNot ApplicableNot Applicablecontact us
Manufacturer Part Number (MPN)Effective DateVersionPb-free solderingSnPb solderingNumber of processing cyclesManufacturing
Moisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperatureMoisture Sensitivity Level
/ Floor Life
Peak Package temperatureMax time at peak temperature
9353 912 610922023-11-2571 / Unlimited26030 sec.NA / Not AvailableNot ApplicableNot Applicable3External manufacturing
SubpartHomogeneous MaterialSubstanceCAS numberMass(mg)Mass(%) of
Material
Mass(%) of
Total part
CategoryDescription
Semiconductor DieDieInorganic Silicon compoundsSilicon7440-21-320.38556498.00000071.657530
Miscellaneous substancesOther miscellaneous substances (less than 10%).0.4160322.0000001.462399
Subtotal20.801596100.000000073.119929
Plastic CoatingAcrylatesOther acrylates0.00018618.5714000.000653
AcrylatesProprietary Material-Other acrylates0.0000202.0000000.000070
Glycol Ethers and Acetates - Specific2-Methoxyethanol109-86-40.0000010.0051000.000000
Inorganic Silicon compoundsSilica, vitreous60676-86-00.00053553.7075000.001888
Inorganic Silicon compoundsSilicon dioxide7631-86-90.0000606.0000000.000211
Inorganic compoundsCarbon Black1333-86-40.0000202.0000000.000070
Inorganic compoundsChlorine, atomic22537-15-10.0000010.0017000.000000
Phenols and Phenolic ResinsPhenol, 4,4'-(1-methylethylidene)bis-, polymer with (chloromethyl)oxirane25068-38-60.00011111.1429000.000392
PolymersPoly[(phenyl glycidyl ether)-co-dicyclopentadiene]119345-05-00.0000666.5714000.000231
Subtotal0.001000100.00000000.003515
Polyimide Coating 1Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0012720.5000000.004472
PolymersPoly(p-phenylene-2,6-benzobisoxazole0.25319799.5000000.890015
Subtotal0.254469100.00000000.894488
Polyimide Coating 2Miscellaneous substancesOther miscellaneous substances (less than 10%).0.0011440.5000000.004023
PolymersPoly(p-phenylene-2,6-benzobisoxazole0.22773299.5000000.800502
Subtotal0.228876100.00000000.804525
Redistribution MetalCopper and its compoundsCopper, metal7440-50-80.30646098.6861001.077242
Titanium and its compoundsTitanium, metal7440-32-60.0040801.3139000.014342
Subtotal0.310540100.00000001.091584
Solder BallAluminum and its compoundsAluminum, metal7429-90-50.0000660.0010000.000231
Antimony and its compoundsAntimony, metal7440-36-00.0001310.0020000.000462
Arsenic and its compoundsArsenic, metal7440-38-20.0000660.0010000.000231
Bismuth and its compoundsBismuth, metal7440-69-90.0065710.1000000.023097
Cadmium and its compoundsCadmium, metal7440-43-90.0000660.0010000.000231
Copper and its compoundsCopper, metal7440-50-80.0459960.7000000.161681
Indium and its compoundsIndium, metal7440-74-60.0001180.0018000.000416
Iron and its compoundsIron, metal7439-89-60.0000660.0010000.000231
Lead and its compoundsLead, metallic lead and lead alloys7439-92-10.0003680.0056000.001293
Nickel and its compoundsNickel, metal7440-02-00.0000660.0010000.000231
Phosphorus compoundsPhosphorus, elemental (not containing red allotrope)7723-14-00.0001970.0030000.000693
Silver and its compoundsSilver, metal7440-22-40.0197130.3000000.069292
Tin and its compoundsTin, metal7440-31-56.49737598.88160022.838999
Zinc and its compoundsZinc, metal7440-66-60.0000660.0010000.000231
Subtotal6.570864100.000000023.097319
Under Bump MetalCopper and its compoundsCopper, metal7440-50-80.27936099.3266000.981982
Titanium and its compoundsTitanium, metal7440-32-60.0018940.6734000.006658
Subtotal0.281254100.00000000.988640
Total28.448600100.0000000100.0000000
Note(s):
1Some materials contains substances with a generic description as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
产品内容声明 88W8897-B0-CBK/AZ
Product content declaration of 88W8897-B0-CBK/AZ
上次修订 Last Revision (GMT):
Thursday, 27 June 2024, 11:06:00 PM
部件名称
Name of the part
均质材料
Homogeneous Material
有毒或有害物质和元素 (Toxic or hazardous Substances and Elements)
铅(Pb)镉(Cd)汞(Hg)六价铬(Cr-VI)多溴联苯(PBB)多溴二苯醚(PBDE)
半导体芯片
Semiconductor Die
半导体芯片
Die
OOOOOO

塑料层
Plastic Coating
OOOOOO

聚酰亚胺涂料
Polyimide Coating 1
OOOOOO

聚酰亚胺涂料
Polyimide Coating 2
OOOOOO

电气再分配
Redistribution Metal
OOOOOO

焊锡球
Solder Ball
OOOOOO

焊料凸点下的金属
Under Bump Metal
OOOOOO
O: 表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T11363-2006标准规定的限量要求以下。
O: Indicates all homogeneous materials hazardous substances content are below the SJ/T11363-2006 MCV limit.
X: 该有毒有害物质至少在该部件的某一均质材料中的含量超出SJ/T11363-2006标准规定的限量要求。
X: Indicates that the hazardous substance content contained in any one of the homogeneous materials of the part exceeded the MCV limits specified in the Standard SJ/T 11363-2006.
备注: 该半导体产品具有无限期的环保使用期限(EFUP)。
Remark: This semiconductor product has an indefinite environmental friendly use period (EFUP).
免责声明
Disclaimer
本文件中的所有信息只为考察或指示目的。本文件中的所有信息被认为是精确和可靠的。然而,恩智浦不对该等信息的精确性和完整性给予任何陈述和保证,且恩智浦不对使用该等信息造成的后果承担责任。恩智浦可以在任何时候对文件中公布的信息加以修改,无需经过通知。不同生产地的产品可能存在微小偏差。本文件取代先于此次公布的所有信息。本文件中任何信息都不能被解释为对承诺开放的销售产品的要约,或者授予、让与或暗示任何版权、专利或者其它工业或知识产权的任何许可。

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
NXP Semiconductors
Compliance Documentation of 88W8897-B0-CBK/AZLast Revision (GMT):
Thursday, 27 June 2024, 11:06:00 PM
SubpartHomogeneous MaterialCertificate of Analysis(CoA)
RoHSPhthalates *Halogens *Antimony *
Semiconductor DieNot AvailableNot AvailableNot AvailableNot Available
For more information: contact us
Note(s):
* NXP does not commit to providing this report for all product materials!
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, NXP does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.