System-on-Chip

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The LH79524/LH79525, powered by an Arm720T™, is a complete System-on-Chip with a high level of integration to satisfy a wide range of requirements and applications. The SoC has a fully static design, power management unit, and low voltage operation (1.8 V Core, 3.3 V I/O). With the on-chip voltage regulator, a single 3.3 V supply can be used as well. Robust peripherals and a low-power RISC core provide high performance at a reasonable price.

Data Sheet

Application Notes

Product Details

Part numbers include: LH79524N0F100A1.

Documentation

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1-5 of 6 documents

^{Data Sheet}
System-on-Chip

PDFRev 2.0Nov 19, 2013848.0 KBLH79524_525_NEnglish
^{Application Note}
Using IAP for LPC2000 Arm^® devices

PDFRev 1.0Jul 21, 2013125.9 KBAN10256English
^{Application Note}
PCB layout guidelines for NXP^® MCUs in BGA packages

PDFRev 2.0Apr 22, 2011272.0 KBAN10778English
^{User Guide}
LH79524/LH79525 User Guide

PDFRev 1.3Mar 3, 20093.8 MBLH79524-LH79525English
^Errata
Errata LH79524-525

PDFRev 1.0Sep 16, 2016121.3 KBERRATA_LH79524_LH79525_1English
^{Package Information}
plastic low profile fine-pitch ball grid array package; 208 balls

PDFRev 1.0Feb 8, 2016496.0 KBSOT1019-1English

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Design Resources

Design Files

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4 design files

^Models
lh79524_a1_1 IBIS Model

IBSRev 0.1Jan 11, 2017 00:00:00624.9 KBLH79524_A1_1
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^Models
lh79525_a1_1 IBIS Model

IBSRev 0.1Jan 11, 2017 00:00:00618.0 KBLH79525_A1_1
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lh79525_a0_1 IBIS Model

IBSRev 0.1Jan 11, 2017 00:00:00573.3 KBLH79525_A0_1
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lh79524_a0_1 IBIS Model

IBSRev 0.1Jan 11, 2017 00:00:00580.3 KBLH79524_A0_1
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Product Details

Documentation

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System-on-Chip

Using IAP for LPC2000 Arm^® devices

PCB layout guidelines for NXP^® MCUs in BGA packages

LH79524/LH79525 User Guide

Errata LH79524-525

plastic low profile fine-pitch ball grid array package; 208 balls

Design Resources

Design Files

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lh79524_a1_1 IBIS Model

lh79525_a1_1 IBIS Model

lh79525_a0_1 IBIS Model

lh79524_a0_1 IBIS Model

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System-on-Chip

Product Details

Documentation

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System-on-Chip

Using IAP for LPC2000 Arm® devices

PCB layout guidelines for NXP® MCUs in BGA packages

LH79524/LH79525 User Guide

Errata LH79524-525

plastic low profile fine-pitch ball grid array package; 208 balls

Design Resources

Design Files

Filter by

lh79524_a1_1 IBIS Model

lh79525_a1_1 IBIS Model

lh79525_a0_1 IBIS Model

lh79524_a0_1 IBIS Model

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Support

What do you need help with?

Suggested Links

Using IAP for LPC2000 Arm^® devices

PCB layout guidelines for NXP^® MCUs in BGA packages