1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs | NXP Semiconductors

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1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs

MRF6S19060N
No Longer Manufactured
  • This page contains information on a product that is no longer manufactured (discontinued). Specifications and information herein are available for historical reference only.

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The MRF6S19060NR1 and MRF6S19060NBR1 are designed for N–CDMA base station applications with frequencies from 1930 to 1990 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applications. To be used in Class AB for PCN–PCS/cellular radio and WLL applications.
N true 0 PSPMRF6S19060Nen 6 Application Note Application Note t789 3 Data Sheet Data Sheet t520 1 Package Information Package Information t790 2 en_US en_US en Data Sheet Data Sheet 1 1 5 English Designed for N-CDMA base station applications with frequencies from 1930 to 1990 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applications. To be used in Class AB for PCN-PCS/cellular radio and WLL applications. 1118702321493714884041 PSP 954.8 KB None None documents None 1118702321493714884041 /docs/en/data-sheet/MRF6S19060N.pdf 954816 /docs/en/data-sheet/MRF6S19060N.pdf MRF6S19060N documents N 2005-06-13 MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs /docs/en/data-sheet/MRF6S19060N.pdf /docs/en/data-sheet/MRF6S19060N.pdf Data Sheet N 980000996212993340 2022-12-07 pdf en Dec 27, 2010 980000996212993340 Data Sheet Y N MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs Application Note Application Note 3 2 3 English I989356375600 PSP 910.7 KB None None documents None I989356375600 /docs/en/application-note/AN1907.pdf 910737 /docs/en/application-note/AN1907.pdf AN1907 documents N N 2016-11-09 AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf /docs/en/application-note/AN1907.pdf Application Note N 645036621402383989 2025-01-28 pdf N en May 13, 2009 645036621402383989 Application Note Y N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 3 0 English This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. 1236894638615715664840 PSP 449.7 KB None None documents None 1236894638615715664840 /docs/en/application-note/AN3789.pdf 449688 /docs/en/application-note/AN3789.pdf AN3789 documents N N 2016-10-31 Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf /docs/en/application-note/AN3789.pdf Application Note N 645036621402383989 2024-03-13 pdf N en Mar 12, 2009 645036621402383989 Application Note Y N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 4 0 English Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages 1149802174784738095879 PSP 8.3 MB None None documents None 1149802174784738095879 /docs/en/application-note/AN3263.pdf 8285724 /docs/en/application-note/AN3263.pdf AN3263 documents N N 2016-10-31 Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3263.pdf /docs/en/application-note/AN3263.pdf Application Note N 645036621402383989 2022-12-07 pdf N en Jun 7, 2006 645036621402383989 Application Note Y N Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages Package Information Package Information 2 5 F English 98ASA10575D, 1484-04, TO-272 4 Lead Wide Body 11CKYWrw PSP 73.4 KB None None documents None 11CKYWrw /docs/en/package-information/98ASA10575D.pdf 73382 /docs/en/package-information/98ASA10575D.pdf SOT1735-1 documents N N 2016-10-31 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins /docs/en/package-information/98ASA10575D.pdf /docs/en/package-information/98ASA10575D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Mar 17, 2016 302435339416912908 Package Information D N 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins 6 F English 98ASA10577D, 1486-03, TO-270, 4 Lead 117Dnwyr PSP 75.9 KB None None documents None 117Dnwyr /docs/en/package-information/98ASA10577D.pdf 75944 /docs/en/package-information/98ASA10577D.pdf SOT1736-1 documents N N 2016-10-31 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins /docs/en/package-information/98ASA10577D.pdf /docs/en/package-information/98ASA10577D.pdf Package Information N 302435339416912908 2022-12-07 pdf N en Jan 18, 2016 302435339416912908 Package Information D N 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins false 0 MRF6S19060N downloads en true 1 Y PSP Application Note 3 /docs/en/application-note/AN1907.pdf 2016-11-09 I989356375600 PSP 2 May 13, 2009 Application Note None /docs/en/application-note/AN1907.pdf English documents 910737 None 645036621402383989 2025-01-28 N /docs/en/application-note/AN1907.pdf AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages /docs/en/application-note/AN1907.pdf documents 645036621402383989 Application Note N en None Y pdf 3 N N AN1907 Solder Reflow Attach Method for High Power RF Devices in Over-Molded Plastic Packages 910.7 KB AN1907 N I989356375600 /docs/en/application-note/AN3789.pdf 2016-10-31 1236894638615715664840 PSP 3 Mar 12, 2009 Application Note This application note provides NXP Semiconductors customers with a guide for mounting high power RF transistors and integrated circuits in Over-Molded Plastic (OMP) packages by clamping down the RF power device in the Power Amplifier (PA) housing. None /docs/en/application-note/AN3789.pdf English documents 449688 None 645036621402383989 2024-03-13 N /docs/en/application-note/AN3789.pdf Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3789.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Clamping of High Power RF Transistors and RFICs in Over-Molded Plastic Packages 449.7 KB AN3789 N 1236894638615715664840 /docs/en/application-note/AN3263.pdf 2016-10-31 1149802174784738095879 PSP 4 Jun 7, 2006 Application Note Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages None /docs/en/application-note/AN3263.pdf English documents 8285724 None 645036621402383989 2022-12-07 N /docs/en/application-note/AN3263.pdf Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages /docs/en/application-note/AN3263.pdf documents 645036621402383989 Application Note N en None Y pdf 0 N N Bolt Down Mounting Method for High Power RF Transistors and RFICs in Over-Molded Plastic Packages 8.3 MB AN3263 N 1149802174784738095879 Data Sheet 1 /docs/en/data-sheet/MRF6S19060N.pdf 2005-06-13 1118702321493714884041 PSP 1 Dec 27, 2010 Data Sheet Designed for N-CDMA base station applications with frequencies from 1930 to 1990 MHz. Suitable for TDMA, CDMA and multicarrier amplifier applications. To be used in Class AB for PCN-PCS/cellular radio and WLL applications. None /docs/en/data-sheet/MRF6S19060N.pdf English documents 954816 None 980000996212993340 2022-12-07 /docs/en/data-sheet/MRF6S19060N.pdf MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs /docs/en/data-sheet/MRF6S19060N.pdf documents 980000996212993340 Data Sheet N en None Y pdf 5 N MRF6S19060NR1, MRF6S19060NBR1 1930-1990 MHz, 12 W Avg., 28 V, 2 x N-CDMA Lateral N-Channel RF Power MOSFETs 954.8 KB MRF6S19060N N 1118702321493714884041 Package Information 2 /docs/en/package-information/98ASA10575D.pdf 2016-10-31 11CKYWrw PSP 5 Mar 17, 2016 Package Information 98ASA10575D, 1484-04, TO-272 4 Lead Wide Body None /docs/en/package-information/98ASA10575D.pdf English documents 73382 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10575D.pdf 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins /docs/en/package-information/98ASA10575D.pdf documents 302435339416912908 Package Information N en None D pdf F N N 98ASA10575D, TO, 23.0x8.0x2.59, Pitch 12.0, 4 Pins 73.4 KB SOT1735-1 N 11CKYWrw /docs/en/package-information/98ASA10577D.pdf 2016-10-31 117Dnwyr PSP 6 Jan 18, 2016 Package Information 98ASA10577D, 1486-03, TO-270, 4 Lead None /docs/en/package-information/98ASA10577D.pdf English documents 75944 None 302435339416912908 2022-12-07 N /docs/en/package-information/98ASA10577D.pdf 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins /docs/en/package-information/98ASA10577D.pdf documents 302435339416912908 Package Information N en None D pdf F N N 98ASA10577D, TO, 17.53x9.02x2.59, Pitch 5.38, 5 Pins 75.9 KB SOT1736-1 N 117Dnwyr true Y Products

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