202404006F01 : Introduction of Plasma Dicing Capacity Extension for Plasma Diced UCODE 9
For the increase of production capacity we extend our plasma dicing location. • Next to our current plasma dicing site AMKOR (Taiwan) our plasma dicing subcontractor TFME (China) will be enabled. To be noted: • There will be no change in type names or 12NCs (ordering code) • TIDs will be not changed
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location | 11-Apr-2024 | 10-Jul-2024 |
Reason of Change
NXP strives to provide larger flexibility in the production fulfilment. Being able to process UCODE 9 plasma diced wafer products at more than one source will increase capacity and supply stability.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
SL3S1206FUD2/HAPZ (935430457035) |
- | - | - |
|
SL3S1216FUD2/HAPAZ (935430459035) |
- | - | - |