202207016F03 : Introduction of Test and Pre-Assembly Capacity Extension for Blade Diced UCODE 9
For the increase of production capacity we extend our wafer test and pre-assembly at NXP ATBK (Thailand) by: • Wafer test and pre-assembly at NXP ATKH (Taiwan); announced in the FPCN 202207016F01 • Pre-assembly at subcontractor Chipbond (Taiwan); announced in the FPCN 202207016F02 Next to these sites we will further expand our pre-assembly capacity at our NXP ATBK (Thailand) site by DBG (Dice before grind) in parallel to the existing process. To be noted: • There will be no change in type names or 12NCs (ordering code). • For the DBG pre-assembly process a different wafer foil already in use for plasma diced UCODE 9 products will be used.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly processassembly materials | 14-Dec-2022 | 14-Mar-2023 |
Reason of Change
NXP strives to provide larger flexibility in the production fulfilment. Being able to process UCODE 9 blade diced wafer products at more than one source will increase capacity and supply stability.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
For the DBG pre-assembly process a different wafer foil already in use for plasma diced UCODE products will be used.No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
SL3S1206FUD2/HAA (935396596046) |
- | - | - |