202207016F02 : Introduction of Test and Pre-Assembly Capacity Extension for Blade Diced UCODE 9
For the increase of production capacity we extend our wafer test and pre-assembly locations. • Next to our current wafer test and pre-assembly sites NXP ATBK (Thailand) and NXP ATKH (Taiwan) NXP will enable additional pre-assembly capacity at our subcontractor Chipbond (Taiwan). To be noted: • There will be no change in type names or 12NCs (ordering code).
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly locationtest location | 25-Oct-2022 | 23-Jan-2023 |
Reason of Change
NXP strives to provide larger flexibility in the production fulfilment. Being able to process UCODE 9 blade diced wafer products at more than one source will increase capacity and supply stability.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
SL3S1206FUD2/HAA (935396596046) |
- | - | - |