202203027I : MC33879BPEK/R2 Qualified in NXP CHD Wafer Manufacturing Site
NXP Semiconductors announces the qualification of new MC33879BPEK/R2 SMOS5AP technology products in NXP CHD Fab located in Chandler Arizona USA. This site change affects the SMOS5AP product - no change to Assembly / Test sites or processes. The new CHD sourced SMOS5AP products have completed qualification and will be available for ordering using the new part numbers MC33879BPEK and MC33879BPEKR2. NXP CHD Fab was successfully qualified adhering to NXP specifications and AEC-Q100 rev.H / AEC-Q101 rev.D1 requirements. Please reference the attached presentation for additional details on this qualification. Please refer to the PPAP of each device qualified for additional details. New data sheet MC33879 revision 12.0 is attached and may be obtained at: https://www.nxp.com.cn/docs/en/data-sheet/MC33879.pdf Please reference the new data sheet revision history section for a complete list of changes. In September 2020 NXP Semiconductors announced the decision to scale down operations at our Oak Hill Fab located in Austin Texas through General Notification 202009009G. NXP SMOS5AP technology products are directly impacted by this Oak Hill Fab scale down activity. Therefore customers are encouraged to ensure last order quantities of previous part numbers MC33879APEK and MC33879APEKR2 have been received by NXP as these old part numbers have undergone End-of-Life / Discontinuation with Last Time Buy Date Jun-2022 and Last Ship Date Dec-2023.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Customer Information Notification | Wafer fab locationother | 13-Jul-2022 | 14-Jul-2022 |
Reason of Change
Qualification of new SMOS5AP products MC33879BPEK and MC33879BPEKR2 in NXP CHD Fab located in Chandler Arizona USA is required for customer supply assurance with the announcement of the scale down operations at our Oak Hill Fab.
Identification of Affected Products
Replacement part type created see Parts Affected list New part numbers are created for CHD wafer fab products
Anticipated Impact
Data sheet revision: A new datasheet will be issued
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
MC33879APEK (935317184574) |
- | - |
MC33879BPEK
(935432238574) |
|
MC33879APEKR2 (935317184518) |
- | - |
MC33879BPEKR2
(935432238518) |