201804021F01 : NX3P1108UK Assembly(bumping) Transfer from Nexperia(Germany) to SPIL(Taiwan)
NXP is pleased to announce the product assembly transferring (bumping) location from Nexperia (Germany) to SPIL (Taiwan). WLCSP bumping proces is same "UBM + Ball drop" but the solder ball material change from "SOL250" to "SAC105(Ni)"."SAC105(Ni)" is a mature and standard material in NXP and in industry.
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location, Assembly materials | 25-May-2018 | 23-Aug-2018 |
Reason of Change
oNexperia will stop WLCSP bumping activities.The following files included in this PCN provide information about the verification of the changes (if any) in the assembly process: 1)PQIP
Identification of Affected Products
Top side marking o Marking line B will change from DS* to AS* (3rd character is production code) o Solder ball material changed. Nexperia is "Sol pearls" and SPIL is SAC105(Ni) o Nominal bump size height reduced from 0.24 mm to 0.23 mm (standardization)
Anticipated Impact
Data sheet revision: A new datasheet will be issued
POD in datasheet updated : nominal bump size height redced from 0.24 mm to 0.23 mm (standardization)No impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX3P1108UKZ (935298595012) |
- | - | - |