201705011F01 : NX5P3090UK Bumping Site transfer from ChipBond to ASEK
NXP is pleased to announce product assembly migration from Chipbond to ASEK. Bumping process is same "repassivation + plated UBM + ball drop" But the bumping/assemble center change to ASEK. The Bumping process in ASEK has been released in 2016. Specific qualification tests for bumping transfer has been done on NX5P3090UK parts and all pass.old product flow: SSMC(fab) -> Chip-bond (bumping) -> ATKH (WT) -> Chip-bond (assembly)new product flow: SSMC(fab) -> ASEK (bumping) -> ATKH (WT) -> ASEK(assembly)
| PCN Type | Change Category | Issue Date | Effective Date |
|---|---|---|---|
| Final Product Change Notification | Assembly location | 23-Jul-2017 | 21-Oct-2017 |
Reason of Change
Chipbond old site closure on end Q2 2017ASEK new site production start wk1714
Identification of Affected Products
Top side marking Top side Marking on Chipbond material is '5' while ASE-K is 't'.
Anticipated Impact
Data sheet revision: No impact to existing datasheet
no impactNo impact on form fit function reliability or quality.
Affected Parts
| Part Number / 12NC | Last Time Buy Date | Last Time Delivery Date | Replacement Part |
|---|---|---|---|
|
NX5P3090UKZ (935305702012) |
- | - | - |